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LM78M05-MIL
SNVSAX6 – JUNE 2017

LM78M05-MIL Series 3-Terminal 500-mA Positive Voltage Regulator

1 Features 3 Description
•
1 Output Current in Excess of 0.5 A The LM78M05-MIL three-pin positive voltage
regulator employs built-in current limiting, thermal
• No External Components shutdown, and safe-operating area protection, which
• Internal Thermal Overload Protection makes them virtually immune to damage from output
• Internal Short Circuit Current-Limiting overloads.
• Output Transistor Safe-Area Compensation With adequate heat sinking, they can deliver in
• Available in 3-Pin TO-220, TO-252, and TO excess of 0.5-A output current. Typical applications
packages would include local (on-card) regulators which can
eliminate the noise and degraded performance
• Output Voltage: 5 V associated with single-point regulation.
2 Applications Device Information(1)
• Electronic Point-of-Sale PART NUMBER PACKAGE BODY SIZE (NOM)
• Medical and Health Fitness Applications TO-220 (3) 10.16 mm × 14.986 mm
• Printers LM78M05 TO-252 (3) 6.10 mm × 6.58 mm

• Appliances and White Goods TO (3) 9.14 mm × 9.14 mm

• TVs and Set-Top Boxes (1) For all available packages, see the orderable addendum at
the end of the data sheet.

Available Packages Simplified Application

Pin 1. Input
2. Ground 1
3. Output
Tab/Case is Ground
2 LM78M05-MIL
3

TO
TO-220
VIN IN OUT VOUT

1
GND
2
3

TO-252

1 2

3
Copyright © 2017, Texas Instruments Incorporated

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 8 Application and Implementation ........................ 10
2 Applications ........................................................... 1 8.1 Application Information............................................ 10
3 Description ............................................................. 1 8.2 Typical Application .................................................. 10
4 Revision History..................................................... 2 9 Power Supply Recommendations...................... 11
5 Pin Configuration and Functions ......................... 3 10 Layout................................................................... 11
6 Specifications......................................................... 3 10.1 Layout Guidelines ................................................. 11
6.1 Absolute Maximum Ratings ...................................... 3 10.2 Layout Example .................................................... 12
6.2 Recommended Operating Conditions....................... 3 10.3 Thermal Considerations ........................................ 12
6.3 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 15
6.4 Electrical Characteristics........................................... 4 11.1 Documentation Support ........................................ 15
6.5 Typical Characteristics .............................................. 5 11.2 Receiving Notification of Documentation Updates 15
7 Detailed Description .............................................. 7 11.3 Community Resources.......................................... 15
7.1 Overview ................................................................... 7 11.4 Trademarks ........................................................... 15
7.2 Functional Block Diagram ......................................... 8 11.5 Electrostatic Discharge Caution ............................ 15
7.3 Feature Description................................................... 9 11.6 Glossary ................................................................ 15
7.4 Device Functional Modes.......................................... 9 12 Mechanical, Packaging, and Orderable
Information ........................................................... 15

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE REVISION NOTES

June 2017 * Initial release.

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5 Pin Configuration and Functions

NDE Package NDP Package

3-Pin TO-220 3-Pin TO-252
Top View Top View

NDT Package
3-Pin TO
Top View

Pin Functions
PIN
NO. I/O DESCRIPTION
NAME
TO-220 TO-252 TO
GND 2/TAB 2/TAB 3 — Tab is GND
INPUT 1 1 1 I Input
OUTPUT 2 2 2 O Output

6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
Input voltage 5 V ≤ VO ≤ 15 V 35 V
Power dissipation Internally limited
TO package (NDT) 300
Lead temperature (Soldering, 10 s) °C
TO-220 package (NDE) 260
Operating junction temperature –40 125 °C
Storage temperature, Tstg –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input voltage VOUT + 1.8 35 V
Output current 0.5 A

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6.3 Thermal Information

LM78M05
(1) NDP NDT
THERMAL METRIC UNIT
(TO-252) (TO)
3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 38 162.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.4 23.9 °C/W
RθJB Junction-to-board thermal resistance 17.7 — °C/W
ψJT Junction-to-top characterization parameter 6.7 — °C/W
ψJB Junction-to-board characterization parameter 17.9 — °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.4 — °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

6.4 Electrical Characteristics

VIN = 10 V, CIN = 0.33 µF, CO = 0.1 µF, TJ = 25°C (unless otherwise noted). Limits are specified by production testing or
correlation techniques using standard Statistical Quality Control (SQC) methods.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IL = 500 mA 4.8 5 5.2
VO Output voltage 5 mA ≤ IL ≤ 500 mA, PD ≤ 7.5 W, V
7.5 V ≤ VIN ≤ 20 V, –40°C ≤ TJ ≤ 4.75 5 5.25
125°C
IL = 100
50
mA
VRLINE Line regulation 7.2 V ≤ VIN ≤ 25 V mV
IL = 500
100
mA
VRLOAD Load regulation IL = 5 mA to 500 mA 100 mV
IQ Quiescent current IL = 500 mA 4 10 mA
5 mA ≤ IL ≤ 500 mA, 0.5
ΔIQ Quiescent current change mA
7.5 V ≤ VIN ≤ 25 V, IL = 500 mA 1
Vn Output noise voltage 10 Hz ≤ f ≤ 100 kHz 40 µV
ΔVIN Ripple rejection f = 120 Hz, IL = 500 mA 78 dB
Input voltage required to maintain
VIN IL = 500 mA 7.2 V
line regulation
ΔVO Long-term stability IL = 500 mA, –40°C ≤ TJ ≤ 125°C 20 mV/khrs

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6.5 Typical Characteristics

Figure 1. Peak Output Current Figure 2. Ripple Rejection

Figure 3. Ripple Rejection Figure 4. Dropout Voltage

Normalized to 1 V TJ = 25°C

Figure 5. Output Voltage Figure 6. Quiescent Current

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Typical Characteristics (continued)

Figure 7. Quiescent Current Figure 8. Output Impedance

Figure 9. Line Transient Response Figure 10. Load Transient Response

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7 Detailed Description

7.1 Overview
The LM78M05-MIL device is a fixed positive voltage regulators. It can accept up to 35 V at the input and regulate
it down to outputs of 5 V, 12 V, or 15 V. The device is capable of supplying up to 500 mA of output current,
although it is important to ensure an adequate amount of heat sinking to avoid exceeding thermal limits.
However, in the case of accidental overload the device has built in current limiting, thermal shutdown and safe-
operating area protection to prevent damage from occurring.

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7.2 Functional Block Diagram

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7.3 Feature Description

The LM78M05-MIL fixed voltage regulator has built-in thermal overload protection which prevents the device
from being damaged due to excessive junction temperature.
The regulator also contains internal short-circuit protection which limits the maximum output current, and safe-
area protection for the pass transistor which reduces the short-circuit current as the voltage across the pass
transistor is increased.
Although the internal power dissipation is automatically limited, the maximum junction temperature of the device
must be maintained below 125°C to meet data sheet specifications. An adequate heat sink must be provided to
assure this limit is not exceeded under worst-case operating conditions (maximum input voltage and load
current) if reliable performance is to be obtained.

7.4 Device Functional Modes

7.4.1 Normal Operation
The device OUTPUT pin sources current necessary to make the voltage at the OUTPUT pin equal to the fixed
voltage level of the device.

7.4.2 Operation With Low Input Voltage

The device requires up to 2-V headroom (VIN – VOUT) to operate in regulation. With less headroom, the device
may drop out of regulation in which the OUTPUT voltage would equal INPUT voltage minus dropout voltage.

7.4.3 Operation in Self Protection

When an overload occurs, the device shuts down Darlington NPN output stage or reduce the output current to
prevent device damage. The device automatically resets from the overload. The output may be reduced or
alternate between on and off until the overload is removed.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM78M05-MIL device is a fixed voltage regulator that needs no external feedback resistors in order to set
the output voltage. Input. Output capacitors are not required for the device to be stable. However, input
capacitance helps filter noise from the supply and output capacitance improves the transient response.

8.2 Typical Application

LM78M05-MIL

VIN IN OUT VOUT

0.33 PF 0.1 PF
GND

Copyright © 2017, Texas Instruments Incorporated

CIN required if regulator input is more than 4 inches from input filter capacitor (or if no input filter capacitor is used).
COUT is optional for improved transient response.

Figure 11. Typical Application

8.2.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters.

Table 1. Design Parameters

PARAMETER VALUE
CIN 0.33 µF
COUT 0.1 µF

8.2.2 Detailed Design Procedure

8.2.2.1 Input Voltage

Regardless of the output voltage option being used (5 V, 12 V, 15 V), the input voltage must be at least 2 V
greater to ensure proper regulation (7 V, 14 V, 17 V).

8.2.2.2 Output Current

Depending on the input-output voltage differential, the output current must be limited to ensure maximum power
dissipation is not exceeded. The graph in Figure 1 shows the appropriate current limit for a variety of conditions.

8.2.2.3 Input Capacitor

If no power supply filter capacitor is used or if the device is placed more than four inches away from the capacitor
of the power supply, an additional capacitor placed at the input pin of the device helps bypass noise.

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8.2.2.4 Output Capacitor

This device is designed to be stable with no output capacitance and can be omitted from the design if needed.
However if large changes in load are expected, an output capacitor is recommended to improve the transient
response.

8.2.3 Application Curves

Figure 12. RθJA vs 2-oz Copper Area for PFM Figure 13. Maximum Allowable Power Dissipation
vs Ambient Temperature for PFM

Figure 14. Maximum Allowable Power Dissipation vs 2-oz Copper Area for PFM

9 Power Supply Recommendations

The LM78M05-MIL device is designed to operate from an input voltage supply range between VOUT + 2 V to 35
V. If the device is more than four inches from the power supply filter capacitors, an input bypass capacitor 0.1-µF
or greater of any type is recommended.

10 Layout

10.1 Layout Guidelines

Follow these layout guidelines to ensure proper regulation of the output voltage with minimum noise. TI
recommends that the input terminal be bypassed to ground with a bypass capacitor. The optimum placement is
closest to the input terminal of the device and the system GND. Take care to minimize the loop area formed by
the bypass-capacitor connection, the input terminal, and the system GND. Traces carrying the load current must
be wide to reduce the amount of parasitic trace inductance. In cases when VIN shorts to ground, an external
diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and protect the
device. This diode must be placed close to the corresponding device pins to increase their effectiveness.

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10.2 Layout Example

Figure 15. Layout Recommendation

10.3 Thermal Considerations

When an integrated circuit operates with appreciable current, its junction temperature is elevated. It is important
to quantify its thermal limits to achieve acceptable performance and reliability. This limit is determined by
summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the
operating environment. A one-dimension steady-state model of conduction heat transfer is demonstrated in
Figure 16. The heat generated at the device junction flows through the die to the die attach pad, through the lead
frame to the surrounding case material, to the printed-circuit board, and eventually to the ambient environment.
There are several variables that may affect the thermal resistance and in turn the need for a heat sink, which
includes the following.
Component variables (RθJC)
• Leadframe size and material
• Number of conduction pins
• Die size
• Die attach material
• Molding compound size and material
Application variables (RθCA)
• Mounting pad size, material, and location
• Placement of mounting pad
• PCB size and material
• Traces length and width
• Adjacent heat sources
• Volume of air
• Ambient temperature
• Shape of mounting pad

The case temperature is measured at the point where the leads contact the mounting pad surface

Figure 16. Cross-Sectional View of Integrated Circuit Mounted on a Printed-Circuit Board

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Thermal Considerations (continued)

The LM78M05-MIL regulator has internal thermal shutdown to protect the device from overheating. Under all
possible operating conditions, the junction temperature of the device must be within the range of 0°C to 125°C. A
heat sink may be required depending on the maximum power dissipation and maximum ambient temperature of
the application. To determine if a heat sink is needed, the power dissipated by the regulator (PD) is calculated
using Equation 1.
IIN = IL + IG (1)
PD = (VIN – VOUT) × IL + (VIN × IG) (2)
Figure 17 shows the voltages and currents which are present in the circuit.

LM78M05-MIL
IIN VOUT
VIN IN OUT
IL
GND

IG
Load

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Figure 17. Power Dissipation Diagram

Use to calculate the maximum allowable temperature rise, TR(max).

TR(max) = TJ(max) – TA(max)
where
• TJ(max) is the maximum allowable junction temperature (125°C)
• TA(max) is the maximum ambient temperature encountered in the application
Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient thermal
resistance (RθJA) can be calculated with Equation 3.
RθJA = TR(max) / PD (3)
As a design aid, Table 2 shows the value of the RθJA of TO-252 for different heat sink area. The copper patterns
that we used to measure these RθJA are shown at the end of AN–1028 Maximum Power Enhancement
Techniques for Power Packages (SNVA036). Figure 12 reflects the same test results as what are in the Table 2.
Figure 13 shows the maximum allowable power dissipation versus ambient temperature for the PFM device.
Figure 14 shows the maximum allowable power dissipation versus copper area (in2) for the TO-252 device. For
power enhancement techniques to be used with TO-252 package, see AN–1028 Maximum Power Enhancement
Techniques for Power Packages (SNVA036).

Table 2. RθJA Different Heat Sink Area

THERMAL RESISTANCE: RθJA
COPPER AREA (in2)
LAYOUT (°C/W)
TOP SIDE (1) BOTTOM SIDE TO-252
1 0.0123 0 103

(1) Tab of device is attached to topside copper.

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Thermal Considerations (continued)

Table 2. RθJA Different Heat Sink Area (continued)
THERMAL RESISTANCE: RθJA
COPPER AREA (in2)
LAYOUT (°C/W)
TOP SIDE (1) BOTTOM SIDE TO-252
2 0.066 0 87
3 0.3 0 60
4 0.53 0 54
5 0.76 0 52
6 1 0 47
7 0 0.2 84
8 0 0.4 70
9 0 0.6 63
10 0 0.8 57
11 0 1 57
12 0.066 0.066 89
13 0.175 0.175 72
14 0.284 0.284 61
15 0.392 0.392 55
16 0.5 0.5 53

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11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation
For related documentation see the following:
AN–1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036)

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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 PACKAGE OPTION ADDENDUM

www.ti.com 20-May-2025

PACKAGING INFORMATION

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

LM78M05CH Active Production TO (NDT) | 3 500 | BULK Yes AU Level-1-NA-UNLIM -40 to 125 ( LM78M05CH, LM78M
05CH)
LM78M05CH/NOPB Active Production TO (NDT) | 3 500 | BULK Yes AU Level-1-NA-UNLIM -40 to 125 ( LM78M05CH, LM78M
05CH)

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 MECHANICAL DATA
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H03A (Rev D)

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