Mc10ep89 1
Mc10ep89 1
5V D!
!
with VEE = -3.0 V to -5.5 V
•!Open Input Default State DFN8 1 4
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
Q1 4 5 VEE
Table 2. ATTRIBUTES
Characteristics Value
Internal Input Pulldown Resistor 75 k!
Internal Input Pullup Resistor N/A
ESD Protection Human Body Model > 4 kV
Machine Model > 200 V
Charged Device Model > 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg Pb-Free Pkg
SOIC-8 Level 1 Level 1
TSSOP-8 Level 1 Level 3
DFN8 Level 1 Level 1
Flammability Rating Oxygen Index: 28 to 34 UL-94 V-0 @ 0.125 in
Transistor Count 152 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
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MC10EP89
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MC10EP89
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to -0.3 V.
3. All loading with 50 ! to VCC - 3.0 V.
4. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input
signal.
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with VCC. VEE can vary +0.5 V to -0.5 V.
6. All loading with 50 ! to VCC - 3.0 V.
7. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input
signal.
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MC10EP89
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to -0.3 V.
9. All loading with 50 ! to VCC - 3.0 V.
10. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input
signal.
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
11. Input and output parameters vary 1:1 with VCC. VEE can vary +0.7 V to -0.3 V.
12. All loading with 50 ! to VCC - 3.0 V.
13. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input
signal.
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MC10EP89
Table 8. AC CHARACTERISTICS VCC = 0V; VEE = -3.0 V to -5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 14)
-40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
fmax Maximum Toggle >2 >2 >2 GHz
(See Figure 2 Fmax/JITTER)
tPLH, Propagation Delay to 220 280 340 250 310 370 270 330 390 ps
tPHL Output Differential
VPP Input Voltage Swing 150 800 1200 150 800 1200 150 800 1200 mV
(Differential Configuration)
tr Output Rise/Fall Times Q, Q 175 250 325 200 275 350 225 295 375 ps
tf (20% - 80%)
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
14. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 ! to VCC-3.0 V.
15. Skew is measured between outputs under identical transitions.
1800 9
1600 8
5V
JITTEROUT ps (RMS)
1400 7
VOUTpp (mV)
1200 6
3.3 V
1000 5
800 4
600 3
400 2
(JITTER)
200 1
0
0 1000 2000 3000 4000 5000
FREQUENCY (MHz)
Figure 2. Fmax/Jitter
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MC10EP89
DC BLOCKING CAPACITORS
75 ! 75 ! COAX
0.1 #F 75!
EP89
75 ! 75 !!COAX
150 ! 150 !
0.1 #F 75 !
VEE
Q Zo = 50 ! D
Driver Receiver
Device Device
Q Zo = 50 ! D
50 ! 50 !
VTT
VTT = VCC - 3.0 V
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MC10EP89
ORDERING INFORMATION
Device Package Shipping†
MC10EP89D SOIC-8 98 Units / Rail
MC10EP89DG SOIC-8 98 Units / Rail
(Pb-Free)
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MC10EP89
PACKAGE DIMENSIONS
SOIC-8 NB
CASE 751-07
ISSUE AJ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
-X- ANSI Y14.5M, 1982.
A 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
8 5 PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
B S 0.25 (0.010) M Y M PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
1 IN EXCESS OF THE D DIMENSION AT
4 MAXIMUM MATERIAL CONDITION.
-Y- K 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW
STANDARD IS 751-07.
MILLIMETERS INCHES
G
DIM MIN MAX MIN MAX
A 4.80 5.00 0.189 0.197
C N X 45 # B 3.80 4.00 0.150 0.157
SEATING C 1.35 1.75 0.053 0.069
PLANE D 0.33 0.51 0.013 0.020
-Z- G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
0.10 (0.004) J 0.19 0.25 0.007 0.010
H M J K 0.40 1.27 0.016 0.050
D
M 0# 8# 0 # 8 #
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
0.25 (0.010) M Z Y S X S
SOLDERING FOOTPRINT*
1.52
0.060
7.0 4.0
0.275 0.155
0.6 1.270
0.024 0.050
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MC10EP89
PACKAGE DIMENSIONS
TSSOP-8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R-02
ISSUE A
8x K REF NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
0.10 (0.004) M T U S V S Y14.5M, 1982.
0.15 (0.006) T U S
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
2X L/2 PROTRUSIONS OR GATE BURRS. MOLD FLASH
8 5 OR GATE BURRS SHALL NOT EXCEED 0.15
B 0.25 (0.010)
(0.006) PER SIDE.
L -U- 4. DIMENSION B DOES NOT INCLUDE INTERLEAD
1 4 M FLASH OR PROTRUSION. INTERLEAD FLASH OR
PIN 1 PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
IDENT PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
0.15 (0.006) T U S
A REFERENCE ONLY.
F 6. DIMENSION A AND B ARE TO BE DETERMINED
-V- AT DATUM PLANE -W-.
DETAIL E
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 2.90 3.10 0.114 0.122
C B 2.90 3.10 0.114 0.122
C 0.80 1.10 0.031 0.043
0.10 (0.004) D 0.05 0.15 0.002 0.006
-W- F 0.40 0.70 0.016 0.028
-T- SEATING D G G 0.65 BSC 0.026 BSC
PLANE
K 0.25 0.40 0.010 0.016
DETAIL E L 4.90 BSC 0.193 BSC
M 0# 6# 0# 6#
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MC10EP89
PACKAGE DIMENSIONS
DFN8
CASE 506AA-01
ISSUE D
NOTES:
D A 1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
B 2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PIN ONE 4. COPLANARITY APPLIES TO THE EXPOSED
REFERENCE
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
E A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
2X b 0.20 0.30
D 2.00 BSC
0.10 C D2 1.10 1.30
E 2.00 BSC
2X E2 0.70 0.90
0.10 C e 0.50 BSC
TOP VIEW K 0.20 ---
L 0.25 0.35
0.10 C A
8X 0.08 C
SIDE VIEW (A3)
SEATING
A1
PLANE C
D2
e
e/2
1 4
8X L
E2
8 5
0.10 C A B
8X b
0.05 C NOTE 3
BOTTOM VIEW
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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