August, 2009

Body Control Module (BCM)

Tania Martinez
Field Application Engineer - Automotive
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 Agenda

Body Electronics Challenges

BCM Overview

Freescale Solutions

Networking

BCM Example

Where can I find more information?

Q&A

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Body Electronics Challenges

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 Enabling More Integration

Benefits:
Less modules, less cables
Reduced weight, fuel efficiency
Body Controller Reduced manufacturing costs
(interior features + Better quality
lighting) Lower total cost of ownership

CAN Gateway RF Receiver

Central Body
(key, tires)
Domain
Fuses Box Controller
Replacement

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 Challenges of higher integration
Increased performance needs
Use of I/O processor to offload interrupt handling (eg S12XE, MPC5510)
More sophisticated software architectures (e.g. AUTOSAR)

Increased number of I/O (A/D and timer channels):

Use eSwitches using an SPI to save PWM channels and A/D inputs
Stay with cost effective QFP packages

Development cycle of more complex modules

Rapid prototyping, use of model based design
Off-the-shelf low-level drivers (e.g. AUTOSAR MCAL Layer from FSL)
Initialization tools to help configure more complex MCUs (e.g. RAppID)

Power Consumption in both run and sleep modes

Need advanced low-power modes (e.g. S12XE and MPC5510)
Use smart analog chips with wake-up features (e.g. MSDI, Romeo3)

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 Centralized vs Distributed

Centralized architectures refer to fewer modules with more

functionality than distributed architectures featuring smaller modules
with more communication interfaces

Benefits as perceived by Freescale:

Centralized Architectures: Distributed Architectures:

Simpler networking Greatest flexibility w/ car options
More cost effective for low-end cars Designed for reuse and scalability
Optimized number of ECUs Facilitates power cables routing

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BCM Overview

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 BCM Overview
Body control electronics cover a wide range of comfort, security, lighting
and access technologies, inside and outside the passenger cabin

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 Low End BCM - Block Diagram
+5V
+12V CAN SBC
CAN MC33742 7

IGN 4 2
Ignition Key Position RKE
Receiver
RKE
1
Door Central Lock Switch 2 Door
1
Door Ajar Status Central Lock Relay
1 MCU
Driver Seat Belt indicator 8
Power Window Relay
Window 1
8
Power Window Switch Rear Defrost Relay Window
0 S12XE
Power Window disable Input 2
1 32 Family
Rear Window Defrost Switch Turn Lamp / Hazard
22 3
4
Current Protection Output Lo/Hi Beam & Side light
2
Interior /Salute light
Light
6
Light Exterior Light Switch 1
1 Washer Motor
2
Interior Light Switch
Wiper Motor Wiper
Wiper 4
Wiper Switch 1
1 Alarm Beeper
Wiper intermittent adjust Alarm

* Total IO - 55

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 High End BCM Example diagram
MPC5516

Oscillators
e200z1 INTC e200z0 FMPLL
Core JTAG Core VREG
80MHz NDI 80MHz
eDMA RAM RAM (ECC)
EBI Controller 64KB-80 KB

1x Flexray Crossbar Switch (XBAR)

Flexray Tcvr Memory Protection Unit (MPU)
Flexray Tcvr 3x Quad eSwitch
Flash (ECC)
FlexRay FCU 512KB-1.5MB 12 High side drivers
4x MC33661 4xSCI (TX & RX)
4xGPIO (EN) Peripheral Bridge 10m HSD
LIN Tcvr 15m HSD
LIN Tcvr IC 10m HSD
LIN Tcvr 35m HSD
LIN Tcvr BAM 15m HSD
Wake
35m12m
HSD HSD
6x 3x 15m HSD
SBC - MC33742 1xSPI (Shared) 1x SPI 35m12m
HSD HSD
FlexCAN DSPI 15m HSD
2xGPIO. SIU PIT 5x GPIO SPI/Diag/Wdog
Vreg1 1xINT
35m HSD
SPI/Diag/Wdog
3x ATD.
RST SPI/Diag/Wdog
Vreg2 6x eSCI ADC eMIOS 12x PWM (Optional)

Watchdog
Wake signals
Wake-up Shared SPI
inputs
MC33879 8xLSD/HSD
High side driver 1xSPI 0.7m HSD/LSD
CAN Tcvr 2xGPIO. 0.7m HSD/LSD
2x INT 0.7m HSD/LSD
2x ATD 1xSPI 0.7m HSD/LSD
4x MC33902 4xGPIO.
Wake 2xGPIO. 0.7m HSD/LSD
CAN Tcvr Switch
CAN Tcvr Switch 0.7m HSD/LSD
CAN Tcvr detection RF 1xSPI
CAN Tcvr 4xCAN (TX & RX) detection 1xGPIO. 0.7m HSD/LSD
12x GPIO (EN, STB, ERR) interface transceiver H-bridge
interface 2x PWM 0.7m HSD/LSD
Echo+
2x MC33972 SPI / Diag.
44 Switch inputs

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Freescale Solutions

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 Generic body control module Communication and power supply

Input / Output blocks Processing block Output blocks

Communication
+ power supply Factors to consider:
CAN
Vreg
Amount of physical layer
SPI
CAN P/L communications
Watchdog
Motor
drivers
channels required.
Wakeup
PCB space available.
SPI
Power supply
S08
CAN CAN P/L S12X High side partitioning on the
CAN P/L drivers
MPC55XX
MPC560X
module.
LIN LIN P/L
LIN P/L
Low power
LIN P/L
LIN P/L requirements of the
Low side
drivers
module.
Switch inputs
Diagnostics required for
the communication
Analog inputs channels.

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 Communication + Power Supply (SBC System Basis Chip)
Medium/high
complexity High complexity.

Low power modes CAN, LIN wake-up Multiple wake up

LIN_a Periodic scan
attributes RF (wake up)
Low consumption. No low
power ECU_A ECU_B ECU_C ECU_D
Detection of wake up mode
events
LIN-b
Wake up time
Low / medium CAN_2
Periodic scan function complexity
(wake up event detection)
CAN & local
prior to full network wake up wake-up

ECU: C, D (partial B)
ECU: B (partial A & C) Vbat
ECU: A & B Vdd
Vreg MCU
Vbat
SW SBC RST/INT
Vdd
Vreg MCU Vreg Vdd
MCU OSC MSDI
INH BUS CAN P/L
CAN+Vreg
BUS CAN P/L
BUS CAN P/L LIN CAN_2 RF

Separated transceiver Integrated transceiver SBC CAN (33742)

FSL CAN and regulator with
HS/LIN and regulator.
additional simplified SBC LIN (MC33910 912)
portfolio functionality.

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 Generic body control module handling inputs
Input / Output blocks Processing block Output blocks Factors to consider:
Communication
+ power supply Amount of switches
CAN
Vreg
(switch to GND / VBatt)
Amount of analog
CAN P/L SPI
inputs
Motor
Watchdog
drivers Wakeup capable inputs
Wakeup (digital and analog).
S08
SPI Wetting current
CAN CAN P/L
CAN P/L
S12X High side
drivers
characteristics.
MPC55XX
MPC560X PCB space available.
LIN LIN P/L
LIN P/L
LIN P/L
Power dissipation
LIN P/L
constrains
Low side

Switch inputs
drivers Low power
requirements of the
module.
Analog inputs
Amount of components
on the PCB.

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 MSDI - Multiple Switch Detection Interface
33993 / 33972 / 33975
The Multiple Switch Detection Interface is a monolithic silicon
integrated circuit (IC) that performs switch monitoring 33972
functions. The device can be used to detect the closing and
opening of up to 22 switch contacts.

One MSDI device can replace 66 SMD devices

MSDI can handle multitude of common I/O needs in

embedded systems (Analog mux, FETs, LEDs, power sensors)

Customer Benefits Discrete Switch MC33972 Switch

Inputs Inputs
Power Dissipation Poor (>8W)* Good (<1W)*
32 SOICW
Operating Voltage Poor Excellent
Range 12VSW
Board Space Utilization Poor Good R2
Number of Solder Joints Poor (352 solder Excellent (138 R1 22K
joints) solder joints) Switch 875 To
Ground Offset Protection Good Excellent Input C1 R3
MCU
Quiescent Current with Poor Excellent
Wake up
14.5K
* Considering the 22 switches closed.

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Generic body control module - High side & Low side drivers
Input / Output blocks Processing block Output blocks
Factors to consider:
Communication Amount of high side and
+ power supply
low side outputs
CAN
Vreg Current profile of each of
CAN P/L SPI the outputs
Motor
Protection and
Watchdog diagnostic requirements
drivers

Wakeup PWM requirements for

SPI
each outputs.
S08
CAN CAN P/L S12X High side PCB space available.
CAN P/L
MPC560X drivers Power dissipation
MPC55XX
LIN P/L
constrains
LIN LIN P/L
LIN P/L
LIN P/L
Variability between the
Low side loads been driven.
Switch inputs
drivers Reliability requirements
Failsafe characteristics of
the outputs.
Analog inputs

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 eSwitch family
SMARTMOSTM HDTMOSTM
Protection and diagnostic Best in Class MOSfet
Over temperature 1.7mOHM typ. at 25C
Over current 2.9mOhm typ at 150C
Over/Under Voltage
Short circuit Protection in the power stage
Reverse battery Temperature sensor
Loss of ground/Vbat Current sensor
Energy discharge protection

SPI Interface PQFN

Easy connection to the uP
Programmability Low cost power package
Daisy chain using SPI 0.5 mm thick leadframe
Programmable overcurrent trip level Die soldered attached
Watchdog Rthj-c < 0.5C/W

Design Flexiblility
ADVANTAGES OF 2 DIE SOLUTIONS :
REDUCE TEMPERATURE OF CONTROL DIE
Alu Power wires
Low series resistance
AVOID PARASITIC SUSBTRATE EFFECTS
Current capability > 200A
USE EACH TECHNO AT EFFICIENT LEVEL
REDUCE STAND BY CURRENT High reliability

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 eXtremeSwitch GenIII
Low space, weight, full integration with minimum MCU required.
55W/65W or 21W/28W bulb, HID-Xenon and LEDs matrix compliant,
PWM module self running with configurable duty-cycle and delay (reduction of MCU I/Os
needed),
Protections and Over-current profile dedicated to PWM bulb switching,
EMC optimization,
High reliability,
Outputs under fully control and protected in case of MCU damage,
Auto-retry,
External or Internal watchdog with failsafe management.

Light weight & Fuel efficient

Intelligent & Safe
Lower system cost
No inventory cost for spare relay/fuse

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 Generic body control module Processing block
Input / Output blocks Processing block Output blocks

Communication
+ power supply Factors to consider:
CAN
Vreg
Scalability & Flexibility:
CAN P/L SPI Platform approach
Watchdog
Motor Compatibility (reuse)
drivers
Migration options
Wakeup Peripherals
S08
SPI
MCU selection:
CAN CAN P/L S12X High side
CAN P/L
MPC560X drivers Flash, ROM, EEPROM
MPC55XX Pin-out
LIN LIN P/L
LIN P/L
LIN P/L
Package options
LIN P/L
Functionality
Low side
drivers
Low Power
Switch inputs Development support
Cost
Analog inputs
Quality
Software availability

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 Automotive Performance & Integration

Expanding Our 32-bit Power Architecture Family

Control and Communications
Building on Our
First 32-bit MCUs with
16-bit Strength S12-S12X Integrated FlexRay
Expanding on-chip peripherals for vehicle networking
with XGATE co-processor New low-cost solutions
Extending flash memory sizes
and CPU performance
32 widen entry point
New application areas
FlexRay integration for body, safety and
gateway
Cost Reducing
Low-End S08
Cents not dollars for
16
automotive quality
and control.
8
l
gi
D i rs
ta Total Solution
d
te lle
ra ro Integration
teg ont
In C

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 Relative Performance/Features Positioning

32bit MPC5510
(z1 + z0 dual-core)
16bit

8bit
MPC560xB
(z0 single core)
Computing Needs

S12XE
(S12X w/ XGATE)

S12XS

S12P

S08S/S08E S08D

Features, I/O functionality

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 Highly Integrated BCM MPC5510 or S12XE

Application Challenges Freescale Solutions

Integration level depends on OEM Scalable product families

needs
I/O Processor support for
Diversity of architectures maximum flexibility
Distributed vs centralized
AUTOSAR MCAL available for
AUTOSAR or not
Networking requirements
both architectures
Low power management High-performance AND low-
Reuse of legacy software and tools
power!
Standard architectures
supported by a strong
ecosystem of tools and software
partners

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 Freescale Automotive Multi-Core Architectures
S12X MPC5554 MPC5510/MPC56xxG/C
I/O Processor Solutions
(In production today)

CPU offloading of specific low- S12X Power Power Power

Architecture Architecture Architecture
level tasks e200 e200 e200
XGATE
Peripheral emulation and
flexibility Crossbar / Bus Crossbar / Bus Crossbar / Bus

eTPU
Parallel Gateway Periph. Mem.
Periph. Mem. Mem. Periph
communications processing

MPC57xx MPC56xx
Hi-Performance Symmetric Integrated Safety
dual-core Processing Power Power Architectures Power Power
Architecture Architecture Architecture Architecture
(In Development) (In Development)
e200 e200 e200 e200
Increased MIPS/MHz Lockstep
functionality
Simplified Application level tasks
Crossbar / Bus
eTPU

partitioning Crossbar / Bus Self test diagnostics

Improved current consumption Mem. Periph Dual redundant Mem. Periph
and EMC performance systems with Error
Correction

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 The Crossbar Architecture, a Turbo for Gateways

Example of the MPC5668G Platform with a

Platform = cores + crossbar + 6Mx6S crossbar configuration:
system support functions (INTC,
debug, timers, semaphores)

FlexRay
CPU CPU

eDMA

MLB
FEC

DIM
e200z6 e200z0
The crossbar switch allows
concurrent accesses between
masters and slaves resources
Crossbar
Widening the memory bottleneck:
Separate SRAM blocks
Flash controller with separate page
buffers to emulate dual-ported flash Page buffers

IP Bus

IP Bus
SRAM

SRAM

Bridge

Bridge
& Flash
Controller
Peak data bandwidth of the
MPC5668G crossbar architecture is
3.5 Gbytes/sec at 116 MHz clock FLASH
speed

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 XGATE Co-processor
XGATE
16-bit 100Mhz Co-Processor to offload main CPU

Benefits
Higher Throughput: Dual core drives higher performance
without increased bus speed
Low-EMC, Low-Power: main CPU can run lower
frequency- reduces overall emission

Applications- existing XGATE applications include:

IO Coprocessor
Interrupt Processor

Interrupt nesting capability
Smart DMA controller

Manipulate data or change memory source before
storing to memory TFT
Virtual peripheral driver DISPLAY

Build LIN protocol layer, virtual PWM, SCI, SPI, etc.
TFT Driver XGATE on can directly
drive 1/8 VGA (30K

Drive TFT Display directly from XGATE pixels) at 75Hz refresh
Onboard Safing Micro rate.

Monitor main CPU with XGATE No need for external

graphics accelerator
Manchester Decoding chip or associated
DRAM!

Flexibility
What can the XGATE do for you?

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Networking

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 1990s : The Birth of Networking into Cars
CAN, VAN or J1850 depending on car makers
Proprietary communication, K-line

The Challenge: Get to some consistency, Reuse

Immobilizer Body Instrument Radio

Controller Cluster

Trailer Engine
Connection Management
Alarm

Airbag Anti-lock
Air conditioning Braking Lighting
Window lift

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 2000s : CAN and LIN Standards Dominate
CAN
Diagnostic CAN The Challenge: Manage the complexity, limited
LIN bandwidth and non-determinism
MOST

RKE and Amplif.

Immobilizer
TPMS Rx
Instrument
Motors Seat Radio Infotainment Display
Cluster
Motors modules
Motors
Motors Body Engine
Motors Alarm Controller /
Management
Gateway
Anti-lock
Rear module Braking Glow
Steering
Plug
Flaps HVAC column
Occupant
Flaps
Flaps Sunroof Classification Fuel Pump
Flaps Blower
Airbag Transmission
Motors Door module
Motors
Motors Seat Belt Power Steering
Lighting SJB
Motors Pretent.

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 2010s : Hierarchical Networks
CAN
Diagnostic CAN
The Challenge : Overcome the complexity of super
LIN
nodes through new design methodologies, standard
MOST software
FlexRay

RKE and Amplif.

Immobilizer Video
TPMS Rx Video
Instrument
Motors Seat Radio Nav Display Video
Cluster
Motors modules
Motors
Motors Body Glow
Motors
Motors Engine
Controller Management Plug
Motors
Motors Alarm / Gateway
Airbag
NOX Cooli
Rear module St. column ng fan
Occupant
Flaps HVAC Rain sensor Classification Integrated Fuel
Flaps Flaps Chassis
Pump
FlapsFlaps Sunroof Driver Seat Management
Flaps Blower Belt Pretent.
Lighting L SJB Transmission
Power
Motors Door module Pass. Seat Steering
Motors Lighting R 4x4
Belt Pretent. Active
Motors
Motors
Motors Door module Temp Blind Spot Suspension Steering
Motors Sensor cluster Suspension
Motors Det.
Rear Suspension
Motors Wipers Anti-lock Suspension
Lighting Battery Braking
management Park Assist
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 Automotive Networking Overview
LIN CAN FlexRay
Channels Single Single Single/Dual
Speed 20 Kbit/s <= 1 Mbit/sec 10 Mbits/sec
Time triggered No No Yes
Arbitration Master CSMA TDMA
Devices available
from Freescale today Yes Yes Yes

Freescale is a leader in defining next generation communications

specifically for Automotive
Freescale is a founding member of the LIN Consortium
Freescale is a founding member of the FlexRay Consortium

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BCM Example

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 Light Control Module

Controls all exterior lighting, up to 16 channels

CAN interface
55A current capability at 85C
Very small size (business card) and high power density
Efficiency of about 99%
Small footprint allows it to be used as a sub-module
Uses wiring harness for heatsinking
Wiring harness protection allows
the reduction of wiring harness gauge
omission of fuses
Adds new features such as
PWM control for lamp dimming and protection
wiring, lamp and harness diagnostics

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 Light Control Module

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 Power Distribution Module

4.25x 5.0 board

High Power Outputs - 18 outputs, 80A total @ 85C
22 switch inputs
High Speed CAN and J-1850 Communications
PC Master GUI Interface

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 Power distribution module Building Blocks
CPU Block

PC Master I/F
SBC Power Block
Supply Block

J1850 Block

MSDI eXtreme
Block Switch Output
Blocks
Power Input
& Protection
Block

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Where can I find more information?

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