DB3 /DB4 / DC34
TRIGGER DIODES
FEATURES
VBO : 32V / 34V / 40V VERSIONS
LOW BREAKOVER CURRENT
DESCRIPTION
DO 35
High reliability glass passivation insuring (Glass)
parameter stability and protection against
junction contamination.
ABSOLUTE RATINGS (limiting values)
Symbol Parameter Value Unit
P Power dissipation on printed circuit Ta = 65 C 150 mW
(L = 10 mm)
ITRM Repetitive peak on-state current tp = 20 s 2 A
F= 100 Hz
Tstg Storage and operating junction temperature range - 40 to + 125 C
Tj - 40 to + 125 C
THERMAL RESISTANCES
Symbol Parameter Value Unit
Rth (j-a) Junction to ambient 400 C/W
Rth (j-l) Junction-leads 150 C/W
April 1995 1/4
DB3 / DB4 / DC34
ELECTRICAL CHARACTERISTICS (Tj = 25C)
Symbol Parameter Test Conditions Value Unit
DB3 DC34 DB4
VBO Breakover voltage * C = 22nF ** MIN 28 30 35 V
see diagram 1
TYP 32 34 40
MAX 36 38 45
[I+VBOI-I-VBOI] Breakover voltage C = 22nF ** MAX 3 V
symmetry see diagram 1
IV I Dynamic breakover I= [IBO to IF=10mA] MIN 5 V
voltage * see diagram 1
VO Output voltage * see diagram 2 MIN 5 V
IBO Breakover current * C = 22nF ** MAX 100 50 100 A
tr Rise time * see diagram 3 TYP 1.5 s
IB Leakage current * VB = 0.5 VBO max MAX 10 A
see diagram 1
* Electrical characteristic applicable in both forward and reverse directions.
** Connected in parallel with the devices.
DIAGRAM 1 : Current-voltage characteristics DIAGRAM 2 : Test circuit for output voltage
10 k 500 k D.U.T
220 V
+ IF 50 Hz VO R = 20
0.1 F
10mA
IBO
IB
DIAGRAM 3 : Test circuit see diagram 2.
-V +V
0,5 VBO Adjust R for lp=0.5A
V
lp
VBO 90 %
- IF
10 %
tr
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DB3 / DB4 / DC34
Fig.1 : Power dissipation versus ambient tempera- Fig.2 : Relative variation of VBO versus junction
ture (maximum values) temperature(typical values)
P (mW) VBO[Tj]
160 VBO[Tj=25oC]
1.08
140
120
1.06
100
80 1.04
60
40 1.02
o
20 Tj( C)
Tamb (oC)
o
0 1.00
0 10 20 30 40 50 60 70 80 90 100 110 120 130 25 50 75 100 125
Fig.3 : Peak pulse current versus pulse duration
(maximum values)
I TRM (A)
2 F = 100 Hz
o
Tj initial = 25 C
1
0.1
tp ( s)
0.01
10 100 1000 10000
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DB3 / DB4 / DC34
PACKAGE MECHANICAL DATA (in millimeters)
DO 35 Glass
B A B /C
O
note 1 E E note 1
/D
O /D
O
note 2
REF. DIMENSIONS NOTES
Millimeters Inches
Min. Max. Min. Max.
A 3.050 4.500 0.120 0.117 1 - The lead diameter D is not controlled over zone E
B 12.7 0.500
2 - The minimum axial lengh within which the device may be
placed with its leads bent at right angles is 0.59(15 mm)
C 1.530 2.000 0.060 0.079
D 0.458 0.558 0.018 0.022
E 1.27 0.050
Cooling method by convection and conduction Polarity : N A
Marking : type number Stud torque : N A
Weight : 0.15 g
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are notauthorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
1995 SGS-THOMSON Microelectronics - All rights reserved.
Purchase of I2C Components by SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in an I2C system, is granted provided that the system conforms to
the I2C Standard Specifications as defined by Philips.
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