Winstar Display Co.

, LTD

SPECIFICATION

CUSTOMER :

MODULE NO.: WH1602B-TMI-CT#

APPROVED BY:
( FOR CUSTOMER USE ONLY ) PCB VERSION: DATA:

SALES BY APPROVED BY CHECKED BY PREPARED BY

VERSION DATE REVISED SUMMARY

PAGE NO.
B 2009/4/29 20 Modify backlight
information.

1
 Winstar Display Co., LTD MODLE NO：

DOC. FIRST ISSUE

RECORDS OF REVISION
REVISED
PAGE NO. SUMMARY
VERSION DATE

0 2008/5/9 First issue

A 2008/10/15 20 Modify backlight
information.
B 2009/4/29 20 Modify backlight
information.

2
Contents
1.Module Classification Information

2.Precautions in use of LCD Modules

3.General Specification

4.Absolute Maximum Ratings

5.Electrical Characteristics

6.Optical Characteristics

7.Interface Pin Function

8.Contour Drawing & Block Diagram

9.Function Description

10.Character Generator ROM Pattern

11.Instruction Table

12.Timing Characteristics

13.Initializing of LCM

14.Reliability

15.Backlight Information

16. Inspection specification

17. Material List of Components for RoHs

3
1.Module
1.Module Classification Information

W H 1 6 0 2 B－T M I－ CT#

    

Brand：WINSTAR DISPLAY CORPORATION
 Display Type：H→Character Type, G→Graphic Type
 Display Font：Character 16 words, 2Lines.
 Model serials no.
 Backlight Type： N→Without backlight A→LED, Amber
B→EL, Blue green R→LED, Red
D→EL, Green O→LED, Orange
W→EL, White G→LED, Green
F→CCFL, White T→LED, White
Y→LED, Yellow Green
 LCD Mode： B→TN Positive, Gray T→FSTN Negative
N→TN Negative,
G→STN Positive, Gray
Y→STN Positive, Yellow Green
M→STN Negative, Blue
F→FSTN Positive
 LCD Polarize A→Reflective, N.T, 6:00 H→Transflective, W.T,6:00
Type/ Temperature D→Reflective, N.T, 12:00 K→Transflective, W.T,12:00
range/ View G→Reflective, W. T, 6:00 C→Transmissive, N.T,6:00
direction J→Reflective, W. T, 12:00 F→Transmissive, N.T,12:00
B→Transflective, N.T,6:00 I→Transmissive, W. T, 6:00
E→Transflective, N.T.12:00 L→Transmissive, W.T,12:00
 Special Code CT : English and Cyrillic standard font
#:Fit in with the ROHS Directions and regulations

4
2.Precautions in use of LCD Modules

(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of
LCD module.
(3)Don’t disassemble the LCM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist LCM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8). Winstar have the right to change the passive components
(9). Winstar have the right to change the PCB Rev.

3.General Specification

Item Dimension Unit

Number of Characters 16 characters x 2 Lines －
Module dimension 80.0 x 36.0 x 13.5(MAX) mm
View area 66.0 x 16.0 mm
Active area 56.20 x 11.5 mm
Dot size 0.55 x 0.65 mm
Dot pitch 0.60 x 0.70 mm
Character size 2.95 x 5.55 mm
Character pitch 3.55 x 5.95 mm
LCD type STN Negative, Blue Transmissive,
(In LCD production, It will occur slightly color difference. We
can only guarantee the same color in the same batch.)
Duty 1/16
View direction 6 o’clock
Backlight Type LED white

5
4.Absolute Maximum Ratings

Item Symbol Min Typ Max Unit

Operating Temperature TOP -20 － +70 ℃
Storage Temperature TST -30 － +80 ℃
Input Voltage VI VSS － VDD V

Supply Voltage For Logic VDD-VSS -0.3 － 7 V

Supply Voltage For LCD VDD-V0 -0.3 － 13 V

5.Electrical Characteristics

Item Symbol Condition Min Typ Max Unit

Supply Voltage For Logic VDD-VSS － 4.5 5.0 5.5 V
Ta=-20℃ － － 5.2 V
Supply Voltage For LCD
VDD-V0 Ta=25℃ － 3.7 － V
*Note
Ta=70℃ 3.2 － － V

Input High Volt. VIH － 0.7 VDD － VDD V

Input Low Volt. VIL － Vss － 0.6 V

Output High Volt. VOH － 3.9 － VDD V

Output Low Volt. VOL － 0 － 0.4 V

Supply Current IDD VDD=5V 1.0 1.2 1.5 mA

* Note: Please design the VOP adjustment circuit on customer's main board

6
6.Optical Characteristics

Item Symbol Condition Min Typ Max Unit

(V)θ CR≧5 20 － 40 deg
View Angle
(H)φ CR≧5 -30 － 30 deg

Contrast Ratio CR － － 3 － －

T rise － － 150 200 ms

Response Time
T fall － － 150 200 ms

Definition of Operation Voltage (Vop) Definition of Response Time ( Tr , Tf )

Non-selected Non-selected
Conition Selected Conition Conition
Intensity Selected Wave
100％ Non-selected Wave Intensity

10％
Cr Max
Cr = Lon / Loff 90％
100％

Vop
Driving Voltage(V) Tr Tf

[positive type] [positive type]

Conditions :
Operating Voltage : Vop Viewing Angle(θ，φ) : 0°， 0°
Frame Frequency : 64 HZ Driving Waveform : 1/N duty , 1/a bias

≧2)
Definition of viewing angle(CR≧
θb
θf
φ= 180°
θl
θr

φ= 270° φ= 90°

φ= 0°

7
7.Interface Pin Function

Pin No. Symbol Level Description

1 VSS 0V Ground
2 VDD 5.0V Supply Voltage for logic
3 VO (Variable) Operating voltage for LCD
4 RS H/L H: DATA, L: Instruction code
5 R/W H/L H: Read(MPU→Module) L: Write(MPU→Module)
6 E H,H→L Chip enable signal

7 DB0 H/L Data bus line

8 DB1 H/L Data bus line
9 DB2 H/L Data bus line
10 DB3 H/L Data bus line
11 DB4 H/L Data bus line
12 DB5 H/L Data bus line
13 DB6 H/L Data bus line
14 DB7 H/L Data bus line
15 A － LED +

16 K － LED－

8
8.Contour Drawing &Block Diagram

80.0 0.5
1 Vss
4.95 71.2
7.55 66.0(VA) 2 Vdd
12.45 56.2(AA) 3 Vo
13.5Max
8.0 P2.54*15=38.1 4 RS
12.55
10.3

2.0
5.7

2.5
1.8 16-? 1.0 PTH 8.9 5 R/W
6 E
1 16
7 DB0

18.3
8 DB1
36.0 0.5

K
16.0(VA)
25.2

31.0
11.5

9 DB2
A 10 DB3
11 DB4
12 DB5
40.55 4-? 2.5 PTH 1.6
2.5 75.0 4-? 5.0 PAD 13 DB6
LED B/L 14 DB7
15 A
16 K

3.55
2.95 0.6
0.6
0.55
0.65
0.7
5.55
5.95
0.4

DOT SIZE
SCALE 5/1

RS Com1~16
R/W Controller/Com Driver
MPU
E HD44780
DB0~DB7 or 16X2 LCD
80 series Equivalent
or
68 series
Power Circuit

Seg1~40
Vdd Seg41~80
Bias and

VR Vo
D Seg Driver
10K~20K Vss

M
CL1
Generator

CL2
N.V.

Vdd,Vss,V1~V5
External contrast adjustment.
Optional

Character located 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
DDRAM address 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
DDRAM address 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F

9
9.Function Description

The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an
instruction register (IR) and a data register (DR).
The IR stores instruction codes, such as display clear and cursor shift, and address information for
display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the
MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When
address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM.
By the register selector (RS) signal, these two registers can be selected.

RS R/W Operation
0 0 IR write as an internal operation (display clear, etc.)
0 1 Read busy flag (DB7) and address counter (DB0 to DB7)
1 0 Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM)
1 1 Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)

Busy Flag (BF)

When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction
will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction
must be written after ensuring that the busy flag is 0.

Address Counter (AC)

The address counter (AC) assigns addresses to both DDRAM and CGRAM

Display Data RAM (DDRAM)

This DDRAM is used to store the display data represented in 8-bit character codes. Its extended
capacity is 80×8 bits or 80 characters. Below figure is the relationships between DDRAM addresses
and positions on the liquid crystal display.

High bits Low bits

Example: DDRAM addresses 4E

AC
AC6 AC5 AC4 AC3 AC2 AC1 AC0 1 0 0 1 1 1 0
(hexadecimal)

10
 Display position DDRAM address

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F
2-Line by 16-Character Display

Character Generator ROM (CGROM)

The CGROM generate 5×8 dot or 5×10 dot character patterns from 8-bit character codes. See Table 2.

Character Generator RAM (CGRAM)

In CGRAM, the user can rewrite character by program. For 5×8 dots, eight character patterns can be
written, and for 5×10 dots, four character patterns can be written.
Write into DDRAM the character code at the addresses shown as the left column of table 1. To show
the character patterns stored in CGRAM.

11
Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns

Table 1.

F o r 5 * 8 d o t c h a ra c te r p a tte rn s
C h a ra c te r C o d e s C h a ra c te r P a tte rn s
C G R A M A d d re ss
( D D R A M d a ta ) ( C G R A M d a ta )

7 6 5 4 3 2 1 0 5 4 3 2 1 0 7 6 5 4 3 2 1 0
H ig h Low H ig h Low H ig h Low
0 0 0 * * * 0
0 0 1 * * * 0 0 0
0 1 0 * * * 0 0 0
0 1 1 * * * 0 C h a ra c te r
0 0 0 1 0 0 * * * 0 0 0 p a tte rn ( 1 )
0 0 0 0 * 0 0 0
1 0 1 * * * 0 0 0
1 1 0 * * * 0 0 0
1 1 1 * * * 0 0 0 0 0 C u rs o r p a tte rn
0 0 0 * * * 0 0 0
0 0 1 * * * 0 0 0
0 1 0 * * *
0 1 1 * * * 0 0 0 0 C h a ra c te r
0 0 0 0 * 0 0 1 0 0 1 1 0 0 * * * p a tte rn ( 2 )
1 0 1 * * * 0 0 0 0
1 1 0 * * * 0 0 0 0
1 1 1 * * * 0 0 0 0 0 C u rs o r p a tte rn
0 0 0 * * *
0 0 1

0 0 0 0 * 1 1 1 1 1 1 1 0 0
1 0 1
1 1 0
1 1 1 * * *
F o r 5 * 1 0 d o t c h a ra c te r p a tte rn s
C h a ra c te r C o d e s C h a ra c te r P a tte rn s
C G R A M A d d ress
( D D R A M d a ta ) ( C G R A M d a ta )

7 6 5 4 3 2 1 0 5 4 3 2 1 0 7 6 5 4 3 2 1 0
H ig h Low H ig h Low H ig h Low
0 0 0 0 * * * 0 0 0 0 0
0 0 0 1 * * * 0 0 0 0 0
0 0 1 0 * * * 0 0
0 0 1 1 * * * 0 0
0 1 0 0 * * * 0 0 0
0 0 0 0 * 0 0 0 0 0 0 1 0 1 * * * 0 0 0
0 1 1 0 * * * 0 C h a ra c te r
0 1 1 1 * * * 0 0 0 0 p a tte rn
1 0 0 0 * * * 0 0 0 0
1 0 0 1 * * * 0 0 0 0
1 0 1 0 * * * 0 0 0 0 0 C u rs o r p a tte rn

1 1 1 1 * * * * * * * *

: " H ig h "

12
10.Character
10.Character Generator ROM Pattern

Upper
4 bit
Lower LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH
4 bit
CG
LLLL RAM
(1)
CG
LLLH RAM
(2)
CG
LLHL RAM
(3)
CG
LLHH RAM
(4)
CG
LHLL RAM
(5)
CG
LHLH RAM
(6)
CG
LHHL RAM
(7)
CG
LHHH RAM
(8)
CG
HLLL RAM
(1)
CG
HLLH RAM
(2)
CG
HLHL RAM
(3)
CG
HLHH RAM
(4)
CG
HHLL RAM
(5)
CG
HHLH RAM
(6)
CG
HHHL RAM
(7)
CG
HHHH RAM
(8)

13
11.Instruction
11.Instruction Table

Instruction Code
Execution time
Instruction Description
(fosc=270Khz)
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

Write “00H” to DDRAM and set

Clear Display 0 0 0 0 0 0 0 0 0 1 1.53ms
DDRAM address to “00H” from AC
Set DDRAM address to “00H” from AC
and return cursor to its original position
Return Home 0 0 0 0 0 0 0 0 1 － 1.53ms
if shifted. The contents of DDRAM are
not changed.
Entry Mode Assign cursor moving direction and
0 0 0 0 0 0 0 1 I/D SH 39μs
Set enable the shift of entire display.
Display
Set display (D), cursor (C), and blinking
ON/OFF 0 0 0 0 0 0 1 D C B 39μs
of cursor (B) on/off control bit.
Control
Set cursor moving and display shift
Cursor or
0 0 0 0 0 1 S/C R/L － － control bit, and the direction, without 39μs
Display Shift
changing of DDRAM data.
Set interface data length
(DL:8-bit/4-bit), numbers of display line
Function Set 0 0 0 0 1 DL N F － － 39μs
(N:2-line/1-line)and, display font type
(F:5×11 dots/5×8 dots)
Set CGRAM
0 0 0 1 AC5 AC4 AC3 AC2 AC1 AC0 Set CGRAM address in address counter. 39μs
Address
Set DDRAM
0 0 1 AC6 AC5 AC4 AC3 AC2 AC1 AC0 Set DDRAM address in address counter. 39μs
Address
Whether during internal operation or not
Read Busy
can be known by reading BF. The
Flag and 0 1 BF AC6 AC5 AC4 AC3 AC2 AC1 AC0 0μs
contents of address counter can also be
Address
read.
Write Data to Write data into internal RAM
1 0 D7 D6 D5 D4 D3 D2 D1 D0 43μs
RAM (DDRAM/CGRAM).
Read Data Read data from internal RAM
1 1 D7 D6 D5 D4 D3 D2 D1 D0 43μs
from RAM (DDRAM/CGRAM).

＊ ”－”：don’t care

14
12.Timing Characteristics
12.1 Write Operation

Ta=25℃, VDD=5.0V

Item Symbol Min Typ Max Unit

Enable cycle time TC 1200 － － ns

Enable pulse width TPW 140 － － ns

Enable rise/fall time TR,TF － － 25 ns

Address set-up time (RS, R/W to E) tAS 0 － － ns

Address hold time tAH 10 － － ns

Data set-up time tDSW 40 － － ns

Data hold time tH 10 － － ns

15
12.2 Read Operation

Ta=25℃, VDD=5V

Item Symbol Min Typ Max Unit

Enable cycle time TC 1200 － － ns

Enable pulse width (high level) TPW 140 － － ns

Enable rise/fall time TR,TF － － 25 ns

Address set-up time (RS, R/W to E) tAS 0 － － ns

Address hold time tAH 10 － － ns

Data delay time tDDR － － 100 ns

Data hold time tH 10 － － ns

16
13.Initializing of LCM

Power on

Wait for more than 40 ms after VDD rises to 4.5 V

BF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set
0 0 0 0 1 1 * * * *

Wait for more than 39us

BF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Function set
0 0 0 0 1 0 * * * *
0 0 N F * * * * * *

Wait for more than 39 µs

BF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0 0 0 0 1 0 * * * * Function set
0 0 N F * * * * * *

Wait for more than 37us

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control
0 0 0 0 0 0 * * * *
0 0 1 D C B * * * *

Wait for more than 37 µs

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear
0 0 0 0 0 0 * * * *
0 0 0 0 0 1 * * * *

Wait for more than 1.53ms

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set
0 0 0 0 0 0 * * * *
0 0 0 1 I/D SH * * * *

Initialization ends

4-Bit Ineterface

17
 Power on

Wait for more than 40 ms after VDD rises to 4.5 V

BF can not be checked before this instruction.

RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set
0 0 0 0 1 1 N F * *

Wait for more than 39us

BF can not be checked before this instruction.

RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Function set
0 0 0 0 1 1 N F * *

Wait for more than 37us

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control
0 0 0 0 0 0 1 B C D

Wait for more than 37 µs

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear
0 0 0 0 0 0 0 0 0 1

Wait for more than 1.53ms

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set
0 0 0 0 0 0 0 1 I/D S

Initialization ends

8-Bit Ineterface

18
14.Reliability
℃)
Content of Reliability Test (wide temperature, -20℃~70℃

Environmental Test
Test Item Content of Test Test Condition Note
High Temperature Endurance test applying the high storage 80℃
2
storage temperature for a long time. 200hrs
Low Temperature Endurance test applying the high storage -30℃
1,2
storage temperature for a long time. 200hrs
Endurance test applying the electric stress
High Temperature 70℃
(Voltage & Current) and the thermal stress to the ——
Operation 200hrs
element for a long time.
Low Temperature Endurance test applying the electric stress under -20℃
1
Operation low temperature for a long time. 200hrs
The module should be allowed to stand at 60
℃,90%RH max
High Temperature/ For 96hrs under no-load condition excluding the 60℃,90%RH
1,2
Humidity Operation polarizer, 96hrs
Then taking it out and drying it at normal
temperature.
The sample should be allowed stand the
following 10 cycles of
operation
Thermal shock -20℃ 25℃ 70℃ -20℃/70℃
——
resistance 10 cycles

30min 5min 30min

1 cycle
Total fixed
amplitude : 1.5mm
Vibration
Frequency :
Endurance test applying the vibration during 10~55Hz
Vibration test 3
transportation and using. One cycle 60
seconds to 3
directions of X,Y,Z
for Each
15 minutes
VS=800V,RS=1.5k
Endurance test applying the electric stress to the Ω
Static electricity test ——
terminal. CS=100pF
1 time
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.

19
 15.Backlight Information

Specification

PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION

Supply Current ILED 14.4 16 20 mA V=3.5V

Supply Voltage V 3.4 3.5 3.6 V －

Reverse Voltage VR － － 5 V －
Luminous
IV 264 330 － CD/M2 ILED=16mA
Intensity

Chromaticity x － 0.300 － － －

y － 0.310 － － －
LED Life Time ≦16mA
ILED≦
(For Reference － － 50K － Hr. ℃,50-60%RH,
25℃
only) (Note 1)
Color White

Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
minimum and maximum).
Note1 :50K hours is only an estimate for reference.

2.Drive from pin15,pin16

R R
A
B/L
K

LCM
(Will never get Vee output from pin15)

20
16. Inspection specification

NO Item Criterion AQL

1.1 Missing vertical, horizontal segment, segment contrast defect.

1.2 Missing character , dot or icon.
1.3 Display malfunction.
Electrical 1.4 No function or no display.
01 0.65
Testing 1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.

Black or white 2.1 White and black spots on display ≦0.25mm, no more than
02 spots on LCD three white or black spots present. 2.5
(display only) 2.2 Densely spaced: No more than two spots or lines within 3mm

3.1 Round type : As following drawing

Φ=( x + y ) / 2 SIZE Acceptable Q TY
Φ≦0.10 Accept no dense
2.5
0.10＜Φ≦0.20 2

LCD black 0.20＜Φ≦0.25 1

spots, white 0.25＜Φ 0
03 spots,
contamination
(non-display) 3.2 Line type : (As following drawing)
Length Width Acceptable Q TY
--- W≦0.02 Accept no dense
L≦3.0 0.02＜W≦0.03 2.5
2
L≦2.5 0.03＜W≦0.05
--- 0.05＜W As round type

If bubbles are visible, Size Φ Acceptable Q TY

judge using black spot
Φ≦0.20 Accept no dense
specifications, not easy
Polarizer 0.20＜Φ≦0.50 3
04 to find, must check in 2.5
bubbles
specify direction. 0.50＜Φ≦1.00 2
1.00＜Φ 0
Total Q TY 3

21
NO Item Criterion AQL
05 Scratches Follow NO.3 LCD black spots, white spots, contamination

Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length:

6.1 General glass chip :

6.1.1 Chip on panel surface and crack between panels:

z: Chip thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing area x≦1/8a
Chipped
06 1/2t＜z≦2t Not exceed 1/3k x≦1/8a 2.5
glass
☉If there are 2 or more chips, x is total length of each chip.

6.1.2 Corner crack:

z: Chip thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing area x≦1/8a
1/2t＜z≦2t Not exceed 1/3k x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.

22
NO Item Criterion
AQL
Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :

y: Chip width x: Chip length z: Chip thickness

y≦0.5mm x≦1/8a 0 ＜ z≦t

6.2.2 Non-conductive portion:

Glass
06 2.5
crack

y: Chip width x: Chip length z: Chip thickness

y≦ L x≦1/8a 0 ＜ z≦t

☉If the chipped area touches the ITO terminal, over 2/3 of the ITO must
remain and be inspected according to electrode terminal specifications.
☉If the product will be heat sealed by the customer, the alignment mark
not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width x: length

y≦1/3L x≦a

23
NO Item Criterion AQL
07 Cracked glass The LCD with extensive crack is not acceptable. 2.5

8.1 Illumination source flickers when lit. 0.65

Backlight 8.2 Spots or scratched that appear when lit must be judged. Using 2.5
08
elements LCD spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong. 0.65

9.1 Bezel may not have rust, be deformed or have fingerprints,

2.5
09 Bezel stains or other contamination.
0.65
9.2 Bezel must comply with job specifications.

10.1 COB seal may not have pinholes larger than 0.2mm or 2.5
contamination.
2.5
10.2 COB seal surface may not have pinholes through to the IC.
0.65
10.3 The height of the COB should not exceed the height
indicated in the assembly diagram. 2.5
10.4 There may not be more than 2mm of sealant outside the
seal area on the PCB. And there should be no more than
three places. 2.5
10.5 No oxidation or contamination PCB terminals. 0.65
10 PCB、COB 10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts. 0.65
10.7 The jumper on the PCB should conform to the product
characteristic chart. 2.5
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or
screw hold pad, make sure it is smoothed down. 2.5
10.9 The Scraping testing standard for Copper Coating of PCB

X
Y
X * Y<=2mm2

11.1 No un-melted solder paste may be present on the PCB. 2.5

11.2 No cold solder joints, missing solder connections, oxidation or 2.5
11 Soldering icicle.
2.5
11.3 No residue or solder balls on PCB.
0.65
11.4 No short circuits in components on PCB.

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NO Item Criterion AQL

12.1 No oxidation, contamination, curves or, bends on interface Pin 2.5

(OLB) of TCP.
0.65
12.2 No cracks on interface pin (OLB) of TCP.
2.5
12.3 No contamination, solder residue or solder balls on product. 2.5
12.4 The IC on the TCP may not be damaged, circuits. 2.5
12.5 The uppermost edge of the protective strip on the interface pin
must be present or look as if it cause the interface pin to sever. 2.5
General 12.6 The residual rosin or tin oil of soldering (component or chip
12 2.5
appearance component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened. 0.65
0.65
12.8 Pin type must match type in specification sheet.
0.65
12.9 LCD pin loose or missing pins.
12.10 Product packaging must the same as specified on packaging 0.65
specification sheet.
12.11 Product dimension and structure must conform to product
specification sheet.

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17. Material List of Components for RoHs
1. WINSTAR Display Co., Ltd hereby declares that all of or part of products (with the mark
“#”in code), including, but not limited to, the LCM, accessories or packages, manufactured
and/or delivered to your company (including your subsidiaries and affiliated company)
directly or indirectly by our company (including our subsidiaries or affiliated companies) do
not intentionally contain any of the substances listed in all applicable EU directives and
regulations, including the following substances.

Exhibit A：The Harmful Material List

.

Material (Cd) (Pb) (Hg) (Cr6+) PBBs PBDEs

Limited 100 1000 1000 1000 1000 1000

Value ppm ppm ppm ppm ppm ppm

Above limited value is set up according to RoHS.

2.Process for RoHS requirement：

(1) Use the Sn/Ag/Cu soldering surface；the surface of Pb-free solder is rougher than we used before.
(2) Heat-resistance temp.：
Reflow：250℃,30 seconds Max.；
Connector soldering wave or hand soldering：320℃, 10 seconds max.
(3) Temp. curve of reflow, max. Temp.：235±5℃；
Recommended customer’s soldering temp. of connector：280℃, 3 seconds.

26