GLCD 128x64 Datasheet
GLCD 128x64 Datasheet
CUSTOMER : MIKROELEKTRONIKA
APPROVED BY:
PAGE NO.
0 2009/11/10 First issue
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MODLE NO:
REVISED
VERSION DATE SUMMARY
PAGE NO.
0 2009/11/10 First issue
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Contents
3.General Specification
5.Electrical Characteristics
6.Optical Characteristics
9.Timing Characteristics
11.Detailed Explanation
12.Reliability
13.Backlight Information
14.Inspection specification
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1.Module Classification Information
W D G 0151- T M I- V# N00
Custom:D
N→ TN Negative,
F→ FSTN Positive
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2.Precautions in Use of LCD Module
(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of
LCD Module.
3.General Specification
ITEM STANDARD VALUE UNIT
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4.Absolute Maximum Ratings
ITEM SYMBOL MIN. TYP. MAX. UNIT
5.Electrical Characteristics
ITEM SYMBOL CONDITION MIN. TYP. MAX. UNIT
Vdd
LCM
VR Vo
10K~20K Module
Vee
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6.Optical Characteristics
ITEM SYMBAL CONDITION MIN TYP MAX UNIT
(V)θ CR≧ 2 20 - 40 deg.
View Angle
(H)φ CR≧ 2 -30 - 30 deg.
Contrast Ratio CR - - 3 - -
Non-selected state
X φ
Bs
Bns
θY Operating voltage for LCD driving
■ Response time
90 %
Brightness
100 %
10 %
tr Page 7 of 30 td
Rise Time Decay Time ( fall time tf )
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7.Interface Pin Function
Pin No. Symbol Level Description
3 Vss 0V Ground
8 E H Enable signal
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8.Counter Drawing & Block diagram
7 8 .0 0 .5 1 CS1
2 .0 7 4 .0 2 CS2
8 .0 6 2 .0 (V A ) 3 V ss
1 0 .8 5 5 6 .3 (A A ) 4 VDD
1 3 .0 P 2 .5 4 * 1 9 = 4 8 .2 6
1 4 .3 M a x 5 Vo
2.54
2.54
1 .8 2 0 - 1 .0 P T H 9 .7 6 D /I
2 0 - 2 .0 P A D 7 R /W
7.4
8 E
13.0
15.81
1 20
9 DB0
10 DB1
11 DB2
12 DB3
38.38(AA)
70.0 0.5
44.0(VA)
1 2 8 X 6 4 D o ts
64.92
55.2
13 DB4
14 DB5
15 DB6
16 DB7
17 RST
18 VEE
19 A
4 - 2 .5 P T H 1 .6
5 .0 6 8 .0 4 - 5 .0 P A D 20 K
L E D B /L
0 .4 4
0 .4 2 T h e n o n -sp e cified to le ran c e o f d im e n sio n is 0 .3 m m .
0.58
0.6
D O T S IZ E
S C A L E 1 0 /1
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NT7107C
Com Driver
Com1~64
128X64 DOT
FR,M,CL,CLK1,CLK2
NT7108C NT7108C
Seg1~64 Seg65~128
Seg Driver Seg Driver
Power Circuit
Vdd
Bias and
E VO VR
MPU Vss 10K or 20K
D/I
R/W
80 series
or DB0~DB7
68 series Vee
Generator
CS1
N.V.
CS2
RST
Power on
Optional
reset circuit
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9.Timing Characteristics
MPU Interface (T=25℃, VDD=+5.0V±0.5)
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10.Display Control Instruction
The display control instructions control the internal state of the NT7108. Instruction is received from
MPU to NT7108 for the display control. The following table shows various instructions.
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11.Detailed Explanation
The display data appears when D is 1 and disappears when D is 0. Though the data is not on the
screen with D=0, it remains in the display data RAM. Therefore, you can make it appear by
Y address (AC0-AC5) of the display data RAM is set in the Y address counter. An address is set by
X address (AC0-AC2) of the display data RAM is set in the X address register. Writing or reading to
or from MPU is executed in this specified page until the next page is set.
Z address (AC0-AC5) of the display data RAM is set in the display start line register and displayed
at the top of the screen. When the display duty cycle is 1/64 or others (1/32-1/64), the data of total
line number of LCD screen, from the line specified by display start line instruction, is displayed.
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STATUS READ
BUSY
When BUSY is 1, the Chip is executing internal operation and no instructions are accepted.
ON/OFF
RESET
When RESET is 0, initializing has finished and the system is in usual operation condition.
Writes data (D0-D7) into the display data RAM. After writing instruction, Y address is increased by
1automatically.
Reads data (D0-D7) from the display data RAM. After reading instruction, Y address is increased by
1 automatically.
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12.RELIABILITY
℃)
Content of Reliability Test (wide temperature, -20℃~70℃
Environmental Test
Test Item Content of Test Test Condition Note
High Temperature Endurance test applying the high storage 80℃ 2
storage temperature for a long time. 200hrs
Low Temperature Endurance test applying the high storage -30℃ 1,2
storage temperature for a long time. 200hrs
Endurance test applying the electric stress
High Temperature 70℃
(Voltage & Current) and the thermal stress to ——
Operation 200hrs
the element for a long time.
Low Temperature Endurance test applying the electric stress -20℃ 1
Operation under low temperature for a long time. 200hrs
The module should be allowed to stand at 60
℃,90%RH max
High Temperature/ For 96hrs under no-load condition excluding 60℃,90%RH 1,2
Humidity Operation the polarizer, 96hrs
Then taking it out and drying it at normal
temperature.
The sample should be allowed stand the
following 10 cycles of operation
-20℃ 25℃ 70℃
Thermal shock -20℃/70℃ ——
resistance 10 cycles
30min 5min 30min
1 cycle
Total fixed amplitude :
1.5mm
Vibration Frequency :
Endurance test applying the vibration during
Vibration test 10~55Hz 3
transportation and using.
One cycle 60 seconds to
3 directions of X,Y,Z
for Each 15 minutes
VS=800V,RS=1.5k
Endurance test applying the electric stress to
Static electricity test CS=100pF ——
the terminal.
1 time
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Note3: Vibration test will be conducted to the product itself without putting it in a container.
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13.Backlight Information
PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION
Reverse Voltage VR - - 5 V
Color White
Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
R
A
B/L
K
LCM
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14. Inspection specification
NO Item Criterion AQL
2.5
LCD black
spots, white
03 spots,
contamination
(non-display)
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If bubbles are visible, Size Acceptable Q TY
judge using black spot
specifications, not easy Accept no dense
to find, must check in
Polarizer specify direction.
04 2.5
bubbles 3
2
0
Total Q TY 3
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NO Item Criterion AQL
05 Scratches Follow NO.3 LCD black spots, white spots, contamination
Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length:
C C C
Chipped
06 2.5
glass
C C C
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NO Item Criterion AQL
C C C
Glass
06 cra 2.5
ck
C C C
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L
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NO Item Criterion AQL
07 Cracked glass LCD 2.5
0.65
Backlight 2.5
08
elements LCD
0.65
2.5
09 Bezel
0.65
C 2.5
2.5
0.65
C C
The height of the COB should not exceed the height indicated in the 2.5
assembly diagram.
10.4 There may not be more than 2mm of sealant outside the seal area on 2.5
the PCB. And there should be no more than three places. 0.65
10.5 No oxidation or contamination PCB terminals.
10 PCB COB 10.6 Parts on PCB must be the same as on the production characteristic
chart. There should be no wrong parts, missing parts or excess 0.65
parts.
10.7 The jumper on the PCB should conform to the product characteristic 2.5
chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold 2.5
pad, make sure it is smoothed down.
10.9 The Scraping testing standard for Copper Coating of PCB
X
Y
X * Y<=2mm2
2.5
C 2.5
2.5
0.65
11 Soldering
C
C
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NO Item Criterion AQL
2.5
L C
L C 0.65
2.5
2.5
C C 2.5
2.5
General
12
appearance
2.5
0.65
0.65
0.65
LCD
0.65
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15. Material List of Components for
RoHS
1. WINSTAR Display Co., Ltd hereby declares that all of or part of products (with the mark
“#”in code), including, but not limited to, the LCM, accessories or packages, manufactured
and/or delivered to your company (including your subsidiaries and affiliated company)
not intentionally contain any of the substances listed in all applicable EU directives and
(1) Use the Sn/Ag/Cu soldering surface the surface of Pb-free solder is rougher than we used before.
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LCM Sample Estimate Feedback Sheet
Page: 1
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5 Electronic Characteristics of Page: 2
Module:
6 Summary:
:
Sales signature:
:
Customer Signature: :
Date: / /
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