SN74LVC07
SN74LVC07
1FEATURES
• Operates From 1.65 V to 5 V • Max tpd of 2.6 ns at 5 V
• Inputs and Open-Drain Outputs Accept • Latch-Up Performance Exceeds 250 mA Per
Voltages up to 5.5 V JESD 17
DESCRIPTION/ORDERING INFORMATION
This hex buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
The outputs of the SN74LVC07A device are open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 24 mA.
Inputs can be driven from 1.8-V, 2.5-V, 3.3-V (LVTTL), or 5-V (CMOS) devices. This feature allows the use of
this device as translators in a mixed-system environment.
ORDERING INFORMATION
TA PACKAGE (1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
QFN – RGY Reel of 1000 SN74LVC07ARGYR LC07A
Tube of 50 SN74LVC07AD
SOIC – D Reel of 2500 SN74LVC07ADRG3 LVC07A
Reel of 250 SN74LVC07ADT
SOP – NS Reel of 2000 SN74LVC07ANSR LVC07A
–40°C to 85°C
SSOP – DB Reel of 2000 SN74LVC07ADBR LC07A
Tube of 90 SN74LVC07APW
TSSOP – PW Reel of 2000 SN74LVC07APWRG3 LC07A
Reel of 250 SN74LVC07APWT
TVSOP – DGV Reel of 2000 SN74LVC07ADGVR LC07A
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. © 1997–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74LVC07A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTION TABLE
(EACH BUFFER/DRIVER)
INPUT OUTPUT
A Y
H H
L L
A Y
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
THERMAL INFORMATION
SN74LVC07A
THERMAL METRIC (1) (14) PINS UNITS
D DB DGV NS PW RGY
θJA Junction-to-ambient thermal resistance 120.8 135.1 157.7 120.3 151.5 79.4
θJCtop Junction-to-case (top) thermal resistance 79.7 86.7 78.3 76.3 77.6 95.7
θJB Junction-to-board thermal resistance 75.1 82.4 90.8 79 92.3 55.4
°C/W
ψJT Junction-to-top characterization parameter 37.2 43.7 21 36.2 21 16.4
ψJB Junction-to-board characterization parameter 74.8 81.9 90.1 78.7 92.7 55.6
θJCbot Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a 34.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP (1) MAX UNIT
IOL = 100 μA 1.65 V to 5.5 V 0.2
IOL = 4 mA 1.65 V 0.45
VOL 2.3 V 0.7 V
IOL = 12 mA
2.7 V 0.4
IOL = 24 mA 3V 0.55
II VI = 5.5 V or GND 3.6 V ±5 μA
Ioff VI or VO = 5.5 V 0V ±10 μA
ICC VI = VCC or GND, IO = 0 3.6 V 10 μA
ΔICC One input at VCC – 0.6 V, Other inputs at VCC or GND 2.7 V to 3.6 V 500 μA
Ci VI = VCC or GND 3.3 V 5 pF
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 4)
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
FROM TO VCC = 2.7 V
PARAMETER ± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V UNIT
(INPUT) (OUTPUT)
MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
tpd A Y 1 5.6 1 3.4 3.3 1 3.6 1 2.6 ns
OPERATING CHARACTERISTICS
TA = 25°C
TEST VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
PARAMETER UNIT
CONDITIONS TYP TYP TYP TYP
Power dissipation capacitance
Cpd f = 10 MHz 1.8 2 2.5 3.78 pF
per buffer/driver
LOAD CIRCUIT
tw
VCC
VCC Input VCC/2 VCC/2
Timing
VCC/2 0V
Input
0V
VOLTAGE WAVEFORMS
PULSE DURATION
tsu th
VCC Output
Data VCC
VCC/2 VCC/2 Control
Input VCC/2 VCC/2
0V (low-level
enabling) 0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
tPZL tPLZ
Output VCC
VCC Waveform 1
Input VCC/2 VCC/2 S1 at 2 × VCC VCC/2 VOL + 0.15 V
0V (see Note B) VOL
LOAD CIRCUIT
tw
VCC
VCC Input VCC/2 VCC/2
Timing
VCC/2 0V
Input
0V
VOLTAGE WAVEFORMS
PULSE DURATION
tsu th
VCC Output
Data VCC
VCC/2 VCC/2 Control
Input VCC/2 VCC/2
0V (low-level
enabling) 0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
tPZL tPLZ
Output VCC
VCC Waveform 1
Input VCC/2 VCC/2 S1 at 2 × VCC VCC/2 VOL + 0.15 V
0V (see Note B) VOL
LOAD CIRCUIT
tw
2.7 V
2.7 V Input 1.5 V 1.5 V
Timing
1.5 V 0V
Input
0V
VOLTAGE WAVEFORMS
PULSE DURATION
tsu th
2.7 V Output
Data 2.7 V
1.5 V 1.5 V Control
Input
0V (low-level 1.5 V 1.5 V
enabling) 0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
tPZL tPLZ
Output
2.7 V 3V
Waveform 1
Input 1.5 V 1.5 V S1 at 6 V 1.5 V VOL + 0.3 V
0V (see Note B) VOL
Output
Waveform 1
S1 at 2 x VCC
(see Note B)
Output
Waveform 2
S1 at 2 x VCC 0.3 V
(see Note B)
www.ti.com 20-Jan-2011
PACKAGING INFORMATION
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 20-Jan-2011
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 20-Jan-2011
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive: SN74LVC07A-Q1
• Enhanced Product: SN74LVC07A-EP
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
0,23
0,40 0,07 M
0,13
24 13
0,16 NOM
4,50 6,60
4,30 6,20
Gage Plane
0,25
0°–8°
0,75
1 12
0,50
A
Seating Plane
0,15
1,20 MAX 0,08
0,05
PINS **
14 16 20 24 38 48 56
DIM
4073251/E 08/00
0,38
0,65 0,15 M
0,22
28 15
0,25
0,09
5,60 8,20
5,00 7,40
Gage Plane
1 14 0,25
A 0°–ā8° 0,95
0,55
Seating Plane
PINS **
14 16 20 24 28 30 38
DIM
4040065 /E 12/01
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