DSP 25
Phase-leg VRRM = 1200/1600 V
Rectifier Diode IF(RMS) = 2x43 A
IF(AV)M = 2x28 A
TO-247 AD TO-268 AA
VRSM VRRM TO-247 AD TO-268 AA ISOPLUS 247 TM Version A Version AT
V V Type
1300 1200 DSP 25-12A DSP 25-12AT 1 2 3 1 1
1700 1600 DSP 25-16A DSP 25-16AT DSP 25-16AR 2
3 3
2 (TAB) 2 (TAB)
Symbol Test Conditions Maximum Ratings ISOPLUS 247 TM
Version AR
IF(RMS) TVJ = TVJM 43 A
IF(AV)M Tcase = 100°C; 180° sine 28 A
1
IFSM TVJ = 45°C; t = 10 ms (50 Hz), sine 300 A 2
3 TAB
t = 8.3 ms (60 Hz), sine 330 A
TVJ = 150°C; t = 10 ms (50 Hz), sine 270 A 1 = Cathode, 2 = Anode/Cathode, 3 = Anode
t = 8.3 ms (60 Hz), sine 300 A
Features
I2t TVJ = 45°C t = 10 ms (50 Hz), sine 450 A2s ●
International standard packages
t = 8.3 ms (60 Hz), sine 450 A2s
JEDEC TO-247 AD and TO-268 AA
TVJ = 150°C; t = 10 ms (50 Hz), sine 340 A2s surface mountable
t = 8.3 ms (60 Hz), sine 325 A2s ●
For single and three phase bridge
TVJ -40...+180 °C configuration
TVJM 180 °C
●
Planar passivated chips
Tstg -40...+150 °C
●
Epoxy meets UL 94V-0 flammability
classification
Md * mounting torque M3 0.8...1.2 Nm ●
Version AR isolated and
FC mounting force with clip 20...120 N UL registered E153432
VISOL ** 50/60 Hz, RMS, t = 1 minute, leads-to-tab 2500 V~
TO-247 AD and ISOPLUS 247 TM
Weight TO-268 / TO-247 4/6 g
* Verson A only; ** Version AR only
Symbol Test Conditions Characteristic Values
IR TVJ = 150°C VR = VRRM ≤ 2 mA
VF IF = 55 A; TVJ = 25°C ≤ 1.6 V
VT0 For power-loss calculations only 0.8 V
rT TVJ = TVJM 15 mΩ
RthJC DC current 1.5 K/W
RthCH DC current (with heatsink compound) 0.4 K/W
a Maximum allowable acceleration 100 m/s2
Dim. Millimeter Inches
Min. Max. Min. Max.
TO-268 AA Outline A 19.81 20.32 0.780 0.800
Dim. Millimeter Inches
Min. Max. Min. Max.
B 20.80 21.46 0.819 0.845
A 4.9 5.1 .193 .201 C 15.75 16.26 0.610 0.640
A1 2.7 2.9 .106 .114 D* 3.55 3.65 0.140 0.144
A2 .02 .25 .001 .010
b 1.15 1.45 .045 .057 E 4.32 5.49 0.170 0.216
b2 1.9 2.1 .75 .83 F 5.4 6.2 0.212 0.244
C .4 .65 .016 .026
G 1.65 2.13 0.065 0.084
D 13.80 14.00 .543 .551 H - 4.5 - 0.177
E 15.85 16.05 .624 .632
E1 13.3 13.6 .524 .535 J 1.0 1.4 0.040 0.055
e 5.45 BSC .215 BSC K 10.8 11.0 0.426 0.433
H 18.70 19.10 .736 .752
L 2.40 2.70 .094 .106 L 4.7 5.3 0.185 0.209
L1 1.20 1.40 .047 .055 M 0.4 0.8 0.016 0.031
L2 1.00 1.15 .039 .045 N 1.5 2.49 0.087 0.102
L3 0.25 BSC .010 BSC
L4 3.80 4.10 .150 .161 TM
* ISOPLUS 247 without hole
Data according to IEC 60747 and refer to a single diode
211
IXYS reserves the right to change limits, test conditions and dimensions
© 2002 IXYS All rights reserved 1-2
DSP 25
70 200 103
50 Hz, 80% VRRM VR = 0 V
A
A A2s
60
2
IFSM It
IF 50 TVJ = 45°C
40 TVJ = 45°C
100
30
TVJ = 150°C
TVJ = 25°C TVJ = 150°C
20 TVJ = 150°C
10
0 0 102
0.0 0.5 1.0 1.5 V 2.0 0.001 0.01 0.1 s 1 1 2 3 4 5 6 7 ms
8 910
VF t t
Fig. 1 Forward current versus voltage Fig. 2 Surge overload current Fig. 3 I2t versus time per diode
drop per diode
60 30
W A
RthJA:
50
Id(AV)M
Ptot 0.5 KW
1.8 KW
40 3 KW 20
5 KW
8 KW
30 15 KW
20 10
10
0 0
0 5 10 15 20 25 A 0 40 80 120 160 °C 0 30 60 90 120 150 180°C
Id(AV)M Tamb TC
Fig. 4 Power dissipation versus direct output current and ambient temperature, sine 180° Fig. 5 Max. forward current versus
case temperature
1.6
K/W
1.4
1.2
1.0
0.8 Constants for ZthJC calculation:
0.6
i Rthi (K/W) ti (s)
0.4 1 0.06075 0.0004
2 0.183 0.00256
0.2 3 0.3405 0.0045
DSP25
4 0.543 0.0242
0.0 5 0.3728 0.15
0.0001 0.001 0.01 0.1 1 s 10
t
Fig. 6 Transient thermal impedance junction to case
© 2002 IXYS All rights reserved 2-2
