PRELIMINARY DATA SHEET
SKY65170-11: 860 – 900 MHz, 0.5 W High Power Power
Amplifier
Applications Description
CDMA2000 cellular band Skyworks SKY65170-11 is a fully-matched, 0.5 W Power
Amplifier (PA) with high efficiency, designed for use in the 860 to
WCDMA, Band V 900 MHz band.
Femtocell transmitters The device is fabricated using Skyworks high reliability Indium
Gallium Phosphide (InGaP) Heterojunction Bipolar Transistor (HBT)
Features technology. This process allows for single supply operation while
maintaining high efficiency and good linearity.
Wideband frequency operation: 860 to 900 MHz The SKY65170-11 contains all of the active bias and RF matching
High gain: > 30 dB circuits, which make it easy to integrate into 50 Ω RF systems.
OP1dB: > +27 dBm The internal input and output match are optimized for gain, 1 dB
Compression Point (P1dB), Adjacent Channel Leakage Ratio
ACPR ≤ –48 dB for POUT > +18 dBm (ACLR), and efficiency when integrated in a 50 Ω system.
Single DC supply: 5 V The primary bias to the SKY65170-11 can be supplied directly
Internal RF match and bias circuits from a single 5 VDC supply. The PA is designed to operate with
Small footprint, MCM (20-pin, 6 x 6 mm) SMT package (MSL3, lower current by reducing the bias voltage.
260 C per JEDEC J-STD-020) The device is internally matched and mounted in a 20-pin,
6 x 6 mm Multi-Chip Module (MCM) Surface-Mounted Technology
Skyworks offers lead (Pb)-free RoHS (Restriction of (SMT) package, which allows for a highly manufacturable low
Hazardous Substances) compliant packaging. cost solution. The device package and pinout for the 20-pin MCM
are shown in Figure 1. A block diagram of the SKY65170-11 is
shown in Figure 2.
VCC1
GND
N/C
N/C
20 19 18 17
GND 1 16 GND
RF_IN 2 15 VCC2
GND 3 14 GND
N/C 4 13 GND
GND 5 12 RF_OUT
VC_BIAS 6
7 8 9 10 11 GND
GND
V_REF1
GND
V_REF2
S2040
Figure 1. SKY65170-11 Pinout – 20-Pin MCM
(Top View)
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PRELIMINARY DATA SHEET • SKY65170-11 0.5 W, HIGH POWER PA
V_REF1 V_REF2
VC_BIAS
Active Bias
Input Inter-Stage Output
RF_IN RF_OUT
Match Match Match
Stage 1 Stage 2
PA PA
VCC1 VCC2 S2041
Figure 2. SKY65170-11 Block Diagram
Technical Description
The SKY65170-11 PA contains all of the needed RF matching and Electrical and Mechanical Specifications
DC biasing circuits. The device is a two-stage, HBT InGaP device
optimized for high linearity and power efficiency. These features Signal pin assignments and functional pin descriptions are
make the device suitable for wideband digital applications, where described in Table 1. The absolute maximum ratings of the
PA linearity and power consumption are of critical importance SKY65170-11 are provided in Table 2. Electrical specifications are
(e.g., femtocell and infrastructure applications). provided in Table 3.
The device has been characterized with a standard CDMA2000
modulated signal. Under these stringent test conditions, the
device exhibits excellent spectral purity and power efficiency.
Table 1. SKY65170-11 Signal Descriptions
Pin # Name Description Pin # Name Description
1 GND Ground 11 GND Ground
2 RF_IN RF input 12 RF_OUT RF output
3 GND Ground 13 GND Ground
4 N/C No connection 14 GND Ground
5 GND Ground 15 VCC2 Stage 2 collector voltage, 5 V
6 VC_BIAS Bias voltage, 5 V 16 GND Ground
7 GND Ground 17 N/C No connection
8 V_REF1 Bias reference 1 voltage, 5 V 18 GND Ground
9 GND Ground 19 VCC1 Stage 1 collector voltage, 5 V
10 V_REF2 Bias reference 2 voltage, 5 V 20 N/C No connection
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PRELIMINARY DATA SHEET • SKY65170-11 0.5 W, HIGH POWER PA
Table 2. SKY65170-11 Absolute Maximum Ratings (Note 1)
Parameter Symbol Minimum Maximum Units
RF output power POUT +30 dBm
Supply voltage VCC1, VCC2, V_REF1, 5.5 V
V_REF2, VC_BIAS
Total supply current ICC 700 mA
Storage temperature TST –65 +125 C
Junction temperature TJ +150 C
Thermal resistance ΘJC 30 C/W
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65170-11 Recommended Operating Conditions
Parameter Symbol Minimum Typical Maximum Units
Frequency range f 860 900 MHz
Supply voltage VCC1, VCC2 4.75 5.00 5.25 V
Bias voltage V_REF1, V_REF2, 4.75 5.00 5.25 V
VC_BIAS
Case operating temperature TC –40 +25 +85 C
Table 4. SKY65170-11 Electrical Specifications (Note 1)
(VCC1 = VCC2 = V_REF1 = V_REF2 = VC_BIAS = 5 V, TC = +25 C, f = 880 MHz, Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
Output power @ 1 dB compression OP1dB CW +27 +28 dBm
Small signal gain |S21| CW, PIN = –15 dBm 30 32 dB
Adjacent Channel Power Rejection ACPR @750 kHz,
POUT = +18 dBm –51 –48 dBc
@1.98 MHz,
POUT = +18 dBm –66 –63 dBc
rd
3 Order Output Intercept Point OIP3 PTONE = +15 dBm, +45 dBm
frequency spacing =
1 MHz
Quiescent Current IQ No RF input 200 mA
Operating current ICC POUT = +18 dBm 300 mA
Noise Figure NF 6.5 dB
Input return loss |S11| PIN = –15 dBm 10 14 dB
Output return loss |S22| PIN = –15 dBm 9 12 dB
Voltage Standing Wave Ratio for stable VSWR CW 8:1 –
operation
Note 1: Performance is guaranteed only under the conditions listed in this Table.
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PRELIMINARY DATA SHEET • SKY65170-11 0.5 W, HIGH POWER PA
Evaluation Board Description Package and Handling Information
The SKY65170-11 Evaluation Board is used to test the Since the device package is sensitive to moisture absorption, it is
performance of the SKY65170-11 High Power PA. A schematic baked and vacuum packed before shipping. Instructions on the
diagram of the SKY65170-11 Evaluation Board is shown in Figure shipping container label regarding exposure to moisture after the
3. An assembly drawing for the Evaluation Board is shown in container seal is broken must be followed. Otherwise, problems
Figure 4 and the layer detail is provided in Figure 5. The layer related to moisture absorption may occur when the part is
detail physical characteristics are noted in Figure 6. subjected to high temperature during solder assembly.
The SKY65170-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 C. It can be used for lead or lead-free soldering. For
Package Dimensions additional information, refer to Skyworks Application Note, PCB
The PCB layout footprint for the SKY65170-11 is provided in Design and SMT Assembly/Rework Guidelines for MCM-L
Figure 6. Package dimensions for the 20-pin MCM are shown in Packages, document number 101752.
Figure 7, and tape and reel dimensions are provided in Figure 8. Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Stage 1 Collector
Voltage, 5 V C15 C5
10 μF 3300 pF
× ×
20 19 18 17
1 16
N/C
VCC1
GND
N/C
GND GND
J1 2 15
RF Input RF_IN VCC2 Stage 2 Collector
C8
3300 pF
C16
10 μF
Voltage, 5 V
3 14
GND GND
4 13
× N/C GND
5 12 J2
GND RF_OUT RF Output
V_REF1
V_REF2
Bias Voltage, 6 11
GND
GND
5V VC_BIAS GND
C11 C1
10 μF 3300 pF
7 8 9 10
R1 R2
200 Ω 200 Ω
Bias Reference 1 Bias Reference 2
Voltage, 5 V C4 C2 Voltage, 5 V
68 pF 68 pF
S2044
Figure 3. SKY65170-11 Evaluation Board Schematic
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PRELIMINARY DATA SHEET • SKY65170-11 0.5 W, HIGH POWER PA
J1
C3
R5 C6
C11 C1
C15
C4 R1 C5
J3 J4
L2 C7 R4
C2 R2
C8
C16
J2
S2042
Figure 4. SKY65170-11 Evaluation Board Assembly Drawing
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PRELIMINARY DATA SHEET • SKY65170-11 0.5 W, HIGH POWER PA
Layer 1: Top – Metal
Layer 2: Ground
Layer 3: Ground Plane
Layer 4: Solid Ground Plane
S2047
Figure 5. SKY65170-11 Evaluation Board Layer Detail
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PRELIMINARY DATA SHEET • SKY65170-11 0.5 W, HIGH POWER PA
Cross Section Name Thickness (mm) Material εr
Pri 0.036 Cu, 1 oz. –
Die1 0.250 Rogers 4350 3.38
L2 0.036 Cu, 1 oz. –
Die2 0.175 FR4-4 4.35
L3 0.036 Cu, 1 oz. –
Die3 0.250 FR4-12 4.35
Sec 0.036 Cu, 1 oz. –
S2043
Figure 6. Layer Detail Physical Characteristics
*** TBD ***
Figure 7. SKY65170-11 PCB Layout Footprint
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PRELIMINARY DATA SHEET • SKY65170-11 0.5 W, HIGH POWER PA
12X 2.9
12X 1.5
12X 0.5
Pin 20
6 B See Detail B
Pin 1
C
Pin 1
4X 2.5
12X 1.5
12X 0.5
0
6
8X 2.9
20X SMT Pad
1.35 ± 0.1 A 16X Solder Mask Opening 0.15 A B C
See Detail C
0.15 A B C 0.1 0.2 A B C
Top View Side View Bottom View
0.5 ± 0.1
(0.1)
0.875 0.875
0.2 x 0.2
0.5 ± 0.05 0.875 0.875
Metal Pad Solder Mask Edges
Edge Solder Mask Edges
Detail A Detail B 15X Detail C
Pad Scale: 3X Scale: 2X Scale: 2X
6X This rotation
All dimensions are in millimeters 6X Rotated 180o
Dimensioning and tolerancing according 4X Rotated 90o CW
to ASME Y14.5M-1994 4X Rotated 90o CCW S2017
Figure 8. SKY65170-11 20-Pin MCM Package Dimensions
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PRELIMINARY DATA SHEET • SKY65170-11 0.5 W, HIGH POWER PA
2.00 ± 0.05
8.00 4.00
∅1.50 ± 0.10
0.30 ± 0.02
Pin #1 Indicator B 1.75 ± 0.10
(see Notes)
5.50 ± 0.05
12.00 ± 0.30
A A
6.35
7o Max. B
∅1.50 Min.
1.59
6.35
B 8o Max.
Notes:
1. Carrier tape: black conductive polystyrene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
4. All dimensions are in millimeters A
5. Pin 1 orientation is in top left corner for the following Skyworks products:
SKY73022-21, -31
SKY73023-21, -31
For all other 6 x 6 mm MCM/RFLGA products, pin 1 orientation is
in top right corner. S1183
Figure 9. SKY65170-11 20-Pin MCM Tape and Reel Dimensions
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PRELIMINARY DATA SHEET • SKY65170-11 0.5 W, HIGH POWER PA
Ordering Information
Model Name Manufacturing Part Number Evaluation Kit Part Number
SKY65170-11 0.5 W, High Power Power Amplifier SKY65170-11 TW18-D370
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