TB6575FNG

TOSHIBA CMOS Integrated Circuit Silicon Monolithic

TB6575FNG
PWM Sensorless Controller for 3-Phase Full-Wave BLDC Motors

The TB6575FNG provides sensorless commutation and PWM

current control for 3-phase full-wave BLDC motors. It controls
rotation speed by changing a PWM duty cycle by analog voltage.

Features
• 3-phase full-wave sensorless drive
• PWM chopper drive
• PWM duty cycle control by analog input
• 20-mA current sink capability on PWM output pins
• Overcurrent protection
Weight: 0.14 g (typ.)
• Forward/reverse rotation
• Lead angle control (7.5° and 15°)
• Overlap commutation
• Rotation speed sensing signal
• DC excitation mode to improve startup characteristic
• DC excitation time and forced commutation time for startup operation can be changed.
• Forced commutation frequency can be selected. (fXT/(6 × 216), fXT/(6 × 217), fXT/(6 × 218) )
• Output polarity switching (P-channel + N-channel, N-channel + N-channel)

The following conditions apply to solderability:

*Solderability
1. Use of Sn-37Pb solder bath
*solder bath temperature = 230ºC
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature = 245ºC
*dipping time = 5 seconds
*number of times = once
*use of R-type flux

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 TB6575FNG
Block Diagram

Duty VDD OS FG_OUT

19 21 3 7

Startup time 6-bit AD PWM

VSP 5 13 OUT_UP
setting converter control

15 OUT_VP
SC 2
PWM 17 OUT_WP
START 8 generator
DC excitation
control circuit 14 OUT_UN
IP 9
16 OUT_VN
Forced
FST 24 commutation Timing
frequency setting 18 OUT_WN
control
Maximum
FMAX 4 commutation
frequency setting
Overcurrent
22 OC
Lead angle protection
LA 12
setting

CW_CCW 6

SEL_LAP 20

Clock Position
23 WAVE
generation recognition

10 11 1
XTout XTin GND

Pin Assignment

GND 1 24 FST

SC 2 23 WAVE

OS 3 22 OC

FMAX 4 21 VDD

VSP 5 20 SEL_LAP

CW_CCW 6 19 Duty

FG_OUT 7 18 OUT_WN

START 8 17 OUT_WP

IP 9 16 OUT_VN

XTout 10 15 OUT_VP

XTin 11 14 OUT_UN

LA 12 13 OUT_UP

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 TB6575FNG
Pin Description

Pin No. Symbol I/O Description

1 GND ⎯ Ground pin

Connection pin for a capacitor to set a startup commutation time and duty cycle ramp-up
2 SC I
time
Select the polarity of transistors.
High or open : High-side transistor = P-channel (active low)
Low-side transistor = N-channel (active low)
3 OS I
Low : High-side transistor = N-channel (active low)
Low-side transistor = N-channel (active low)
The pin has a pull-up resistor.
Set an upper limit of the maximum commutation frequency.
<Fst=Low>
FMAX =High or Open , Maximum commutation frequency fMX = fXT/ (6×2 )
11

FMAX =Low , Maximum commutation frequency fMX = fXT/(6 × 2 )

12
4 FMAX I
<Fst=High or Middle>
FMAX =High or Open , Maximum commutation frequency fMX = fXT/ (6×2 )
8

FMAX =Low , Maximum commutation frequency fMX = fXT/(6 × 2 )

9

The pin has a pull-up resistor.

Duty cycle control input
0 ≤ VSP ≤ VAD (L): Output off
5 VSP I VAD (L) ≤ VSP ≤ VAD (H): Set the PWM duty cycle according to the analog input.
VAD (H) ≤ VSP ≤ VDD: Duty cycle = 100% (31/32)
The pin has a pull-down resistor.
Rotation direction input
High : Reverse rotation (U → W → V)
6 CW_CCW I
Low or open : Forward rotation (U → V → W)
The pin has a pull-down resistor.
Rotation speed sensing output
The pin is low at startup or upon a detection of a fault. This pin drives three pulses per
7 FG_OUT O
rotation (3 ppr) based on the back-EMF (electromotive force) sensing. (In the case of 4
pole motor, 6 pulse output per rotation.)
8 START O DC excitation time setting pins
When VSP ≥ 1 V (typ.), the START pin goes low to start DC excitation.
9 IP I After the IP pin reaches VDD/2, the TB6575FNG moves from DC excitation to forced
commutation mode.
10 XT ⎯ Connection pins for a crystal oscillator
11 XTin ⎯ These pins have a feedback resistor.

Lead angle control input

LA = Low or open : Lead angle of 7.5°
12 LA I
LA = high : Lead angle of 15°
The pin has a pull-down resistor.
PWM output signal for the high-side (positive-side) transistor driving motor phase U
13 OUT_UP O
The PWM polarity can be specified by pin 3.
PWM output signal for the low-side (negative-side) transistor driving motor phase U
14 OUT_UN O
This signal is active high.
PWM output signal for the high-side (positive-side) transistor driving motor phase V
15 OUT_VP O
The PWM polarity can be specified by pin 3.
PWM output signal for the low-side (negative-side) transistor driving motor phase V
16 OUT_VN O
This signal is active high.
PWM output signal for the high-side (positive-side) transistor driving motor phase W
17 OUT_WP O
The PWM polarity can be specified by pin 3.
PWM output signal for the low-side (negative-side) transistor driving motor phase W
18 OUT_WN O
This signal is active high.
PWM output monitor pin
19 Duty O This pin drives PWM output whose duty cycle corresponds to the VSP input. It also
reflects the information at the OC pin.
Overlap commutation select pin
20 SEL_LAP I Low: Overlap commutation High: 120° commutation
The pin has a pull-up resistor.

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 TB6575FNG

Pin No. Symbol I/O Description

21 VDD ⎯ 5-V power supply pin

Overcurrent detection input
22 OC I The all PWM output signals are stopped when OC ≥ 0.5 (V).
The pin has a pull-up resistor.
Position sensing input
23 WAVE I 3-phase voltage is applied to this pin.
The pin has a pull-up resistor.
Forced commutation frequency select pin
High or open : Forced commutation frequency fST = fXT/(6 × 2 )
16

: Forced commutation frequency fST = fXT/(6 × 2 )

17
24 FST I Middle
: Forced commutation frequency fST = fXT/(6 × 2 )
18
Low
The pin has a pull-up resistor.

Functional Description
1. Sensorless drive
On receiving an analog voltage command input, the rotor is aligned to a known position in DC excitation
mode, and then the rotation is started in forced commutation mode by applying a PWM signal to the motor.
As the rotor moves, back-EMF is acquired.
When a signal indicating the polarity of each of the phase voltages including back-EMF is applied to the
position signal input pin, automatic switching occurs from the forced commutation PWM signal to the
natural commutation PWM signal (which is generated based on the back-EMF sensing) to drive a BLDC
motor in sensorless mode.

2. Startup operation
When the motor is stationary, there is no back-EMF and the motor position is unknown. For this reason,
the rotor is aligned to a known position in DC excitation mode and then the rotation is started in forced
commutation mode. An external capacitor sets the times that the TB6575FNG stays in DC excitation and
forced commutation modes. Those times vary depending on the motor type and motor loading. Thus, they
must be adjusted experimentally.

VSP ≥ 1.0 (V)

VSP (5 pin)

VSP

VAD (L)
SC (2 pin) TUP TUP (typ.) = C1 × VSP/3.8 µA (s)
START_SP (8 pin) VDD

IP (9 pin)

VDD
2
(a) (b) GND

VSP 5

TB6575FNG
(a): DC excitation period : TFIX (typ.) = 0.69 × C1 × R1 (s) 2
(b): Forced commutation period C1

9 8
R1

C2

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 TB6575FNG

The rotor is aligned to a known position in DC excitation mode for period (a), during which the IP pin voltage

decreases to half VDD level. The time constant for the period is determined by C２ and R1. After that, switching
occurs to forced commutation mode represented by (b). The duty cycles for DC excitation and forced commutation

modes are determined according to the SC pin voltage. When the number of turn of a motor is time more than

forced commutation frequency, the motor switches to sensorless mode. The duty cycle for sensorless mode is
determined by the VSP value.

3. Forced commutation frequency

The forced commutation frequency for startup operation is set as follows.
The optimal frequency varies depending on the motor type and motor loading. Thus, It must be adjusted
experimentally.
FST = High or Open : Forced commutation frequency fST = fXT/(6 × 216)
FST = Middle : Forced commutation frequency fST = fXT/(6 × 217)
FST = Low TFIX commutation frequency fST = fXT/(6 × 2 )
: Forced 18

* fXT: Crystal oscillator frequency

4. PWM frequency
The PWM frequency is determined by an external oscillator.
PWM frequency (fPWM) = fXT/256
* fXT: Crystal oscillator frequency
The PWM frequency must be sufficiently high, compared with the electrical frequency of the motor and
within the switching performance of the transistors.

OS = High or Open

PWM signal driving

high-side transistors

PWM signal driving

low-side transistors

Motor pin voltage

5. Speed control VSP pin

An analog voltage applied to the VSP pin is converted by the 6-bit AD converter to control the duty cycle
of the PWM. Duty cycle

0 ≤ VDUTY ≤ VAD (L) 100%

→ Duty cycle = 0%
VAD (L) ≤ VDUTY ≤ VAD (H)
→ Figure at the right (1/64 to 63/64)
VAD (H) ≤ VDUTY ≤ VDD
→ Duty cycle = 100% (63/64)

0% VSP
VAD (L) VAD (H)
1 V (typ.) 4 V (typ.)

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 TB6575FNG
6. Fault protection
When a signal indicating the following faults is applied to the WAVE pin, the output transistors are
disabled. After about one second, the motor is restarted. This operation is repeated as long as a fault is
detected.
• The maximum commutation frequency is exceeded.
• The rotation speed falls below the forced commutation frequency.

VSP = 1 V or higher

VSP (Pin5)

When the SC pin capacitor = 0.47 µF

Output pin ON OFF ON and VSP = 4 V
CSC × (VSP − 1)
(a): TOFF =
START (Pin8) i
0.47 µF × ( 4 − 1)
=
1.5 µA

IP (Pin9) = 940 ms (typ.)

(a)

SC (Pin9) VSP

1V

Fault detected

7. Motor position detection error

A position detection is synchronized with the PWM signal generated in the IC. Thus, a position detection
error relative to the PWM signal frequency may occur. Keep this in mind especially when the TB6575FNG
is used for a high-speed motor.
A detection is performed on the falling edge of the PWM signal. An error is recognized when the pin
voltage exceeds the reference voltage.

Detection error time < 1/fp fp: PWM frequency = fXT/256 fXT: Crystal oscillator frequency

Output ON

Internal PWM signal

Pin voltage
Pin voltage
Reference voltage

Position sensing input

Ideal detection timing Actual detection timing

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 TB6575FNG
8. Lead angle control
The motor runs with a lead angle of 0° in forced commutation mode at startup. After switching to natural
commutation, the lead angle automatically changes to the value set by the LA pin.

Back-EMF U V W
PWM signal
(1) Lead angle of 0° 30°

OUT_UP
OUT_UN
OUT_VP
OUT_VN
OUT_WP
OUT_WN
(2) Lead angle of 7.5° 22.5°

OUT_UP
OUT_UN
OUT_VP
OUT_VN
OUT_WP
OUT_WN
(3) Lead angle of 15° 15°

OUT_UP
OUT_UN
OUT_VP
OUT_VN
OUT_WP
OUT_WN

*OS = High

9. Overlap commutation
When SEL_LAP = high, the TB6575FNG is configured to allow for 120° commutation. When SEL_LAP =
low, it is configured to allow for overlap commutation. In overlap commutation, there is an overlap period
during which both the outgoing transistor and incoming transistor are conducting (as shown in the shaded
areas). This period varies according to the lead angle.

Back-EMF U V W
PWM signal
(1) Lead angle of 7.5°
OUT_UP
OUT_UN
OUT_VP
OUT_VN
OUT_WP
OUT_WN
(2) Lead angle of 15°
OUT_UP
OUT_UN
OUT_VP
OUT_VN
OUT_WP
OUT_WN

*OS = High

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 TB6575FNG
Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Power supply voltage VDD 5.5 V

Input voltage Vin −0.3~VDD + 0.3 V
Turn-on signal output current IOUT 20 mA
Power dissipation PD 780 (Note) mW
Operating temperature Topr −30~105 °C
Storage temperature Tstg −55~150 °C

Note: Without a PCB, stand-alone operation

Recommended Operating Conditions (Ta = −30 to 105°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Power supply voltage VDD ⎯ 4.5 5.0 5.5 V

VDD
Input voltage Vin ⎯ −0.3 ⎯ V
+ 0.3
Oscillation frequency fXT ⎯ 2.0 4.0 8.0 MHz

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 TB6575FNG
Electrical Characteristics (Ta = 25°C, VDD = 5 V)
Test
Characteristics Symbol Test Condition Min Typ. Max Unit
Circuit
Static power supply current IDD ⎯ VSP = 0 V, XTin = H ⎯ 0.7 １ mA
VSP = 2.5 V, XTin = 4 MHz,
Dynamic power supply current IDD (opr) ⎯ ⎯ 2 6 mA
Output open
VIN = 5 V, OC, WAVE, SEL_LAP
IIN-1 (H) ⎯ ⎯ 0 1
FMAX, FST, OS
VIN = 0 V, OC, WAVE, SEL_LAP,
Input current IIN-1 (L) ⎯ −75 −50 ⎯ µA
FMAX, FST, OS
IIN-2 (H) ⎯ VIN = 5 V, CW_CCW, LA, VSP ⎯ 50 75
IIN-2 (L) ⎯ VIN = 0 V, CW_CCW, LA, VSP −1 0 ⎯
OC, SEL_LAP, CW_CCW
VIN-1 (H) ⎯ 3.5 ⎯ 5
WAVE, LA, FMAX, OS
OC, SEL_LAP, CW_CCW
VIN-1 (L) ⎯ GND ⎯ 1.5
WAVE, LA, FMAX, OS
Input voltage V
VIN-2 (H) ⎯ FST 4 ⎯ 5
VIN-2 (M) ⎯ FST 2 ⎯ 3
VIN-2 (L) ⎯ FST GND ⎯ 1

Input hysteresis voltage VH ⎯ ⎯ 0.45 ⎯ V

WAVE, ＩＰ
IOH = −2 mA
VO-1 (H) ⎯ 4.5 ⎯ VDD
OUT_UP, OUT_VP, OUT_WP
IOL = 20 mA
VO-1 (L) ⎯ GND ⎯ 0.5
OUT_UP, OUT_VP, OUT_WP
IOH = −20 mA
VO-2 (H) ⎯ 4.5 ⎯ VDD
OUT_UN, OUT_VN, OUT_WN
Output voltage V
IOL = 2 mA
VO-2 (L) ⎯ GND ⎯ 0.5
OUT_UN, OUT_VN, OUT_WN
IOH = −0.5 mA
VO-3 (H) ⎯ 4.5 ⎯ VDD
FG_OUT
IOL = 0.5 mA
VO-3 (L) ⎯ GND ⎯ 0.5
FG_ OUT
VDD = 5.5 V, VOUT = 0 V
OUT_UP, OUT_VP, OUT_WP,
IL (H) ⎯ ⎯ 0 10
OUT_UN, OUT_VN, OUT_WN,
FG_OUT
Output leak current µA
VDD = 5.5 V, VOUT = 5.5 V
OUT_UP, OUT_VP, OUT_WP
IL (L) ⎯ ⎯ 0 10
OUT_UN, OUT_VN, OUT_WN,
FG_OUT
VAD (L) 0.8 1.0 1.2
PWM input voltage ⎯ VSP V
VAD (H) 3.8 4.0 4.2
CSC charge current ISC ⎯ SC 2.6 3.8 5.0 µA
Fault retry time TOFF ⎯ VSP = 4 V, SC pin = 0.47 µF ⎯ 940 ⎯ ms
Overcurrent detection voltage VOC ⎯ OC 0.46 0.5 0.54 V

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 TB6575FNG
Input Equivalent Circuit
1. VSP pin 2. SEL_LAP, FMAX, FST, WAVE and OS pins

VDD VDD VDD

100 kΩ
1 kΩ
Input pin Startup time Input pin Internal logic
100 kΩ
setting block 1 kΩ

Hysteresis width
WAVE : 450 mV (typ.)

3. LA and CW_CCW pins 4. OUT_UP, OUT_UN, OUT_VP, OUT_VN, OUT_WP,

OUT_WN and FG_OUT pins

VDD VDD

1 kΩ
Input pin Internal logic
100 kΩ

Internal logic Output pin

5. XTin and XTout pins 6. OC pin

VDD VDD VDD VDD

１ＭΩ
100 kΩ

150 Ω 150 Ω
XTin pin XTout pin OC pin Internal logic
200 kΩ
5 pF

0.5 V

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 TB6575FNG
Application Circuit Example MCU
5V
Duty VM
19 21 24 7
VDD OS FG_OUT
Speed command
(analog voltage) VSP
Startup time 6-bit AD PWM OUT_UP
5 13
setting converter control
OUT_VP M
SC 15
2 OUT_WP
START PWM 17
8 generator
1-phase excitation OUT_UN
IP 14

100 kΩ × 3
control circuit
VDD 9
OUT_VN
2 16
FST
Startup commutation OUT_WN
24 Timing
frequency setting 18
setting

1Ω
FMAX
Maximum commutation
4
frequency setting
Overcurrent OC
VDD 22

100 kΩ
LA protection

10 kΩ
12 Lead angle setting (*1)
1 kΩ
CW_CCW

22 pF
6

100 kΩ
SEL_LAP
20
TA75393P
Clock Position WAVE
23
generation recognition
XTout XTin GND
10 11 1

4-MHz crystal oscillator

Note 1: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults,
or faults due to improper grounding, or by short-circuiting between contiguous pins.
Note 2: The above application circuit including component values is reference only. Because the values may vary depending on the motor type, the optimal values must be
determined experimentally.
*1: Connect a resistor, if necessary, to prevent malfunction due to noise.

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 TB6575FNG
Package Dimensions

Weight: 0.14 g (typ.)

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 TB6575FNG

Notes on Contents

1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.

2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for
explanatory purposes.

3. Timing Charts
Timing charts may be simplified for explanatory purposes.

4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.

5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.

IC Usage Considerations
Notes on handling of ICs

[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.

[2] Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.

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 TB6575FNG

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