For air-conditioner fan motor

Three phase brushless

fan motor controller
BD62012FS

 General Description  Key Specifications

This controller synthesizes the optimal driving signal Supply voltage range: 10V to 18V
from hall sensor signals, and outputs the synthesized Duty control voltage range: 2.1V to 5.4V
signal to control the external level shifter and power Phase control range: 0° to 30°
transistor. The replacement is also easy because of the Operating temperature: -40°C to 110°
pin compatible with BD62011FS and BD62014FS, and Power dissipation: 1.0W
this controller provides optimum motor drive for a wide
variety of applications, and enables motor unit
standardization.

 Features  Package W(Typ.) x D(Typ.) x H(Max.)

150° commutation logic SSOP-A24 10.00mm x 7.80mm x 2.10mm
PWM control (Upper arm switching)
Phase control supported from 0° to +30° at 1°
intervals
Rotational direction switch
FG signal output with pulse number switch (4 or 12)
VREG output (5V/30mA)
Protection circuits provided: OCP, TSD, UVLO, MLP
and the external fault input (FIB)

 Applications
Air conditioners; air cleaners; water pumps;
dishwashers; washing machines
SSOP-A24
General OA equipment

 Typical Application Circuit

VREG

FG R8 R9
Q1

C13
R1
VSP DTR
BD62012FS C14 C7
C1
C2~C4
C8

HW HV HU VREG
M
R2
C11 C5
C9

C10 R5 R4 R3

VCC C6 R6
BM620X
GND D1

R7
C12

VDC

Fig.1 Application circuit example - BD62012FS & BM620X

Product structure : Silicon monolithic integrated circuit This product is not designed protection against radioactive rays
.http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
1/20
TSZ22111 · 14 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Block diagram and pin configuration

VCC
3
VREG
VREG TSD
VREG
VREG 22 VDC
UVLO
HUP
UH
21
HU 10
HUN
UL
20
9
HVP VH

DRIVER
19 8
HV HVN LOGIC DRIVER VL M
18 7
WH
GND PCT
HWP
6
HW HWN
17
WL RT PC
5
16
VCC VREG
RCL HUP
FG 14
FILTER WL HUN
RCL
5
3 4 WH HVP
PC VL HVN
23 + A/D
VH HWP
UL HWN
PWM

FGS
13
UH VSP
PCT
24 V/I FIB FG
12 CCW
CCW FGS
FIB FAULT
TEST
11
VSP
15
RT
OSC 2

1
GND

Fig.2 Block diagram Fig.3 Pin configuration

 Pin descriptions

Pin Name Function Pin Name Function

1 GND Signal ground 24 PCT VSP offset voltage output pin
2 RT Carrier frequency setting pin 23 PC Phase control input pin
3 VCC Power supply 22 VREG Regulator output
4 RCL Over current sense pin 21 HUP Hall input pin phase U+
5 WL Low side driver output phase W 20 HUN Hall input pin phase U-
6 WH High side driver output phase W 19 HVP Hall input pin phase V+
7 VL Low side driver output phase V 18 HVN Hall input pin phase V-
8 VH High side driver output phase V 17 HWP Hall input pin phase W+
9 UL Low side driver output phase U 16 HWN Hall input pin phase W-
10 UH High side driver output phase U 15 VSP Duty control voltage input pin
11 FIB External fault input (Low active) 14 FG FG signal output
12 CCW Direction switch (H:CCW) 13 FGS FG pulse # switch (H:12, L:4)

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
2/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Functional descriptions

1) Commutation logic
When the hall cycle is about 5Hz or less (e.g. when the motor starts up), the commutation mode is 120° rectangle drive
with an upper and lower switching (no lead angle). The controller monitors the hall cycle, and switches to 150°
commutation drive when the hall cycle reaches or exceeds about 5Hz over four consecutive cycles. Refer to the timing
chart, figure 7 and 8.

Table 1 120° commutation (Six-state) truth table

HU HV HW UH VH WH UL VL WL
--------------------
H L H L PWM L H PWM L
--------------------
H L L L L PWM H L PWM
--------------------
H H L L L PWM L H PWM
--------------------
L H L PWM L L PWM H L
--------------------
L H H PWM L L PWM L H
--------------------
L L H L PWM L L PWM H

2) Duty control
The switching duty can be controlled by forcing the DC voltage to the VSP pin, from VSPMIN to VSPMAX. When the VSP
voltage is higher than VSPTST, the controller forces PC pin voltage to the ground (Testing mode, the maximum duty and no
lead angle). The VSP pin is pulled down internally by a 200kΩ resistor. Therefore, note the impedance when setting the
VSP voltage with the resistance voltage divider.

3) Carrier frequency setting

The carrier frequency setting can be freely adjusted by connecting an external
resistor between the RT pin and ground. The RT pin is biased to a constant
400
voltage, which determines the charge current to the internal capacitor. Carrier FOSC [kHz] =
frequencies can be set within a range from about 16kHz to 50kHz. Refer to the RT [kΩ]
formula to the right.

4) FG signal output
The FG output pulse number can be switched in accordance with the number of FGS No. of pulse
poles and the rotational speed of the motor. The FG signal is output from the FG
pin. The 12 pulses signal is generated from the three hall signals (exclusive NOR), H 12
and 4 pulses signal is the same as hall U signal. It is recommended to pull up to L 4
VREG voltage when malfunctioning because of the noise.

5) Direction of motor rotation setting

The direction of rotation may be switched with the CCW pin. When CCW pin is “H”
or open, the motor rotates for CCW direction. When the real direction is different CCW Direction
from the setting, the commutation mode is 120° rectangle drive (no lead angle). It H CCW
is recommended to pull up to VREG voltage when malfunctioning because of the
noise. L CW

6) Hall signal comparator

The hall comparator provides voltage hysteresis to prevent noise malfunctions. The bias current to the hall elements
should be set to the input voltage amplitude from the element, at a value higher than the minimum input voltage, VHALLMIN.
We recommend connecting a ceramic capacitor from 100pF to 0.01µF, between the differential input pins of the hall
comparator. Note that the bias to hall elements must be set within the common mode input voltage range VHALLCM.

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
3/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

7) Output duty pulse width limiter

PWM switching duty pulse width limitation is provided to ensure proper external level shifter and power transistor
switching. Because of the pulse width limitation, the controller will not output a pulse of less than TMIN (0.8µs minimum),
nor can it output a duty pulse of DMAX or more, because the controller does not keep the external power transistors full on.
Also, since the upper and lower external power transistors cannot be turned on simultaneously, the controller is shut off
for the period TDT (1.6µs minimum) at the upper and lower part of each phase output (for example, UH and UL).
Therefore, the switching maximum duty at the motor starts up is 90 percent (nominal).

8) Phase control setting

The driving signal phase can be advanced to the hall signal - (Phase control). The lead angle is set by forcing the DC
voltage to the PC pin. The input voltage is converted digitally with the 6-bit A/D converter, in which internal VREG voltage
is assumed to be full-scale, and the converted data is processed by logic circuit. The lead angle can be set from 0° to
+30° at 1° intervals, and updated fourth hall cycle of phase W falling edge.
For the phase control function to operate is only 150° commutation mode. However, the controller forces PC pin voltage
to ground (no lead angle) when the testing mode.
The VSP offset voltage (Figure 29) is buffered to PCT pin, to connect an external resistor between PCT pin and ground.
The internal bias current is determined by PCT voltage and the resistor value - VPCT / RPCT -, and mix to PC pin. As a
result, the lead angle setting is followed with the duty control voltage, and the performance of the motor can be improved.
Please select the RPCT value from 50kΩ to 200kΩ in the range on the basis of 100kΩ, because the PCT pin current
capability is a 100µA or less.

VPCT = VSP-VSPMIN PCT

VSP L.A.
VSPMIN
VPCT
RPCT PC
L.A. ADC

RPCL RPCT
VSP

Fig. 4 Phase control setting example 1

VREG
VPCT = VSP-VSPMIN PCT
VSP L.A.
VSPMIN
VPCT R PCH
R PCT PC
L.A. ADC

R PCL RPCT
VSP

Fig. 5 Phase control setting example 2

9) Overcurrent protection (OCP) circuit

The over current protection circuit can be activated by connecting a low value resistor for current detection between the
external output stage ground and the controller IC ground. When the RCL pin voltage reaches or surpasses the threshold
value, the controller forces all the upper switching arm imports low (UH, VH, WH = L, L, L), thus initiating the overcurrent
protection operation. When the RCL pin voltage swings below the ground, it is recommended to insert a resistor - 1.5kΩ
or more - between RCL pin and current detection resistor because of the malfunction prevention. Since this protection
circuit is not a latch type, it returns to normal operation - synchronizing with the carrier frequency - once the RCL pin
voltage falls below the threshold voltage. A filter is built into the overcurrent detection circuit to prevent malfunctions, so
that the protection function does not activate when a short pulse of less than TRCL is input.

10) External fault signal input pin (FIB pin, low active)
The FIB pin can force all controller driver outputs low at any time. The FIB pin is pulled up to VREG internally by a 100kΩ
resistor, therefore, an open drain output can be connected directly. It is recommended to pull up to VREG voltage when
this function is not used and malfunctioning because of the noise.

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
4/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

11) Thermal shutdown (TSD) circuit

The TSD circuit operates when the junction temperature of the controller exceeds the preset temperature (175°C
nominal). At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit,
the chip returns to normal operation when the junction temperature falls below the preset temperature (150°C nominal).
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated,
and do not use the IC in an environment where activation of the circuit is assumed.

12) Under voltage lock out (UVLO) circuit

To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage
malfunctions, a UVLO circuit is built into this controller. When the power supply voltage falls to VUVL or below, the
controller forces all driver outputs low. When the voltage rises to VUVH or above, the UVLO circuit ends the lockout
operation and returns the chip to normal operation.
The voltage monitor circuit (4.0V nominal) is built into for the VREG voltage. Therefore, the UVLO circuit does not
release operation when the VREG voltage rising is delayed behind the VCC voltage rising even if VCC voltage becomes
VUVH or more.

13) Hall signal wrong input detection

Hall element abnormalities may cause incorrect inputs that vary from the normal logic. When all hall input signals go high
or low, the hall signal wrong input detection circuit forces all driver outputs low. And when the controller detects the
abnormal hall signals continuously four times or more a motor rotation, the controller forces all driver outputs low and
latches the state. It is released that if the duty control voltage VSP is forced ground level once.

14) Motor lock protect

When the controller detects the motor locking during the fixed time (4sec. nominal, each edge of the hall signal doesn't
input either), the controller forces all driver outputs low in the under in fixed time (20sec. nominal), and self-returns to the
normal operation. This circuit is enabled the voltage force to VSP over the duty minimum voltage VSPMIN, and note that
the motor cannot starts up when the controller doesn’t detect the motor rotation by the minimum duty control.

15) Internal voltage regulator VCC

The internal voltage regulator VREG is output for the bias of the hall
element, the phase control setting. However, when using the VREG VREG
function, be aware of the IOMAX value. If a capacitor is connected to the
ground in order to stabilize output, a 1µF or more capacitor should be used. R1

In this case, be sure to confirm that there is no oscillation in the output. HUP
HU HUN

HVP
HV HVN

HWP
HW HWN

Controller IC

Fig. 6 VREG output pin application example

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
5/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Timing charts (CW)

Hall signals

HALL U

HALL V

HALL W

Spin up (Hall period < 5Hz)

UH PWM PWM PWM PWM

VHPWM PWM PWM PWM PWM

WH PWM PWM PWM PWM

UL PWM PWM PWM PWM

VLPWM PWM PWM PWM PWM

WL PWM PWM PWM PWM

CW direction (lead=0deg)

UH PWM PWM PWM PWM

VHPWM PWM PWM PWM PWM

WH PWM PWM PWM PWM

UL

VL

WL

CW direction (lead=30deg)

UH PWM PWM PWM

VH
PWM PWM PWM PWM PWM

WH PWM PWM PWM PWM

UL

VL

WL

FG output (FGS=H)

FG

Fig. 7 BD62012FS (Clockwise) timing charts

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
6/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Timing charts (CCW)

Hall signals

HALL U

HALL V

HALL W

Spin up (Hall period < 5Hz)

UH PWM PWM PWM PWM

VHPWM PWM PWM PWM PWM

WH PWM PWM PWM PWM

UL PWM PWM PWM PWM

VLPWM PWM PWM PWM PWM

WL PWM PWM PWM PWM

CW direction (lead=0deg)

UH PWM PWM PWM PWM

VHPWM PWM PWM PWM PWM

WH PWM PWM PWM PWM

UL

VL

WL

CW direction (lead=30deg)

UH PWM PWM PWM PWM

VH
PWM PWM PWM PWM PWM

WH PWM PWM PWM

UL

VL

WL

FG output (FGS=H)

FG

Fig. 8 BD62012FS (Counter clockwise) timing charts

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
7/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Controller outputs and operation mode summary

Detected direction Forward (CW:U~V~W, CCW:U~W~V) Reverse (CW:U~W~V, CCW:U~V~W)

Conditions
Hall sensor period < 5Hz 5Hz < < 5Hz 5Hz <

VSP < VSPMIN

Upper and lower arm off
(Duty off)

Normal VSPMIN < VSP < VSPMAX 150°

operation (Control range) Upper switching
120° 120°
120°
Upper and lower Upper and lower
Upper switching
switching 150° switching
VSPTST < VSP
Upper switching
(Testing mode)
(No lead angle)

Overcurrent Upper arm off Upper and lower arm off

UVLO

TSD
Protect
Upper and lower arm off
operation
Motor lock

External input

Hall sensor abnormally Upper and lower arm off and latch

* The controller monitors both edge of three hall sensors for detecting period.
* For the phase control function to operate is only 150° commutation mode. However, the controller forces no lead angle when the testing mode.

 Absolute maximum ratings (Ta=25°C, All voltages are with respect to ground)

Ratings
Parameter Symbol Unit
BD62012FS
Supply voltage VCC 20*1 V
Duty control voltage VSP -0.3 to 20 V
All others VI/O -0.3 to 5.5 V
Driver outputs IOMAX(OUT) ±15*1 mA
Monitor output IOMAX(FG) ±5*1 mA
VREG outputs IOMAX(VREG) -40*1 mA
Operating temperature TOPR -40 to 110 °C
Storage temperature TSTG -55 to 150 °C
Power dissipation Pd 1.00*2 W
Junction temperature Tjmax 150 °C
*1 Do not, however, exceed Pd or ASO.
*2 Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 8mW/°C above 25°C.

 Operating conditions (Ta=25°C)

Parameter Symbol BD62012FS Unit

Supply voltage VCC 10 to 18 V

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
8/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Electrical characteristics (Unless otherwise specified, Ta=25°C and VCC=15V)

Limits
Parameter Symbol Unit Conditions
Min. Typ. Max.
Power supply
Supply current ICC 1.3 2.5 5.0 mA
VREG voltage VREG 4.5 5.0 5.5 V IO=-30mA
Driver outputs
Output high voltage VOH VREG-0.60 VREG-0.20 VREG V IO=-5mA
Output low voltage VOL 0 0.14 0.60 V IO=5mA
Dead time TDT 1.6 2.0 2.4 µs
Minimum pulse width TMIN 0.8 1.0 1.2 µs
Hall comparators
Input bias current IHALL -2.0 -0.1 2.0 µA VIN=0V
Common mode input VHALLCM 0 - VREG-1.5 V
Minimum input level VHALLMIN 50 - - mVp-p
Hysteresis voltage P VHALLHY+ 5 13 23 mV
Hysteresis voltage N VHALLHY- -23 -13 -5 mV
Duty control
Input bias current ISP 15 25 35 µA VIN=5V
Duty minimum voltage VSPMIN 1.7 2.1 2.5 V
Duty maximum voltage VSPMAX 5.0 5.4 5.8 V
Testing operation range VSPTST 13 - 18 V
Minimum output duty DMIN 1.2 1.8 2.4 % FOSC=18kHz
Maximum output duty DMAX 92 95 98 % FOSC=18kHz
Mode switch and the external input - FGS, CCW and FIB
Input bias current IIN -70 -50 -30 µA VIN=0V
Input high voltage VINH 3 - VREG V
Input low voltage VINL 0 - 1 V
Hysteresis voltage VINHY 0.2 0.5 0.8 V
Monitor output - FG
Output high voltage VMONH VREG-0.40 VREG-0.08 VREG V IO=-2mA
Output low voltage VMONL 0 0.06 0.40 V IO=2mA
Overcurrent protection
Input bias current IRCL -30 -20 -10 µA VIN=0V
Threshold voltage VRCL 0.48 0.50 0.52 V
Noise masking time TRCL 0.8 1.0 1.2 µs
Phase control
Minimum lead angle PMIN - 0 1 deg VPC=0V
Maximum lead angle PMAX 29 30 - deg VPC=1/2·VREG
OSC
Carrier frequency FOSC 16 18 20 kHz RT=22kΩ
UVLO
Release voltage VUVH 8.5 9.0 9.5 V
Lockout voltage VUVL 7.5 8.0 8.5 V
Hysteresis voltage VUVHY 0.5 1.0 1.5 V

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
9/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Typical performance curves (Reference data)

4 5.4
110°C 25°C
25°C 110°C
-40°C -40°C
3 5.2

VREG voltage : V REG [V]

Circuit Current : I CC [mA]

2 5.0

1 4.8

0 4.6
9 12 15 18 21 9 12 15 18 21
Supply Voltage : VCC [V] Supply Voltage : VCC [V]

Fig.9 Circuit current Fig.10 VREG vs VCC

5.4 0.0
25°C
110°C
Output Drop Voltage : VOH [V]

-40°C
5.2 -0.4
VREG voltage : V REG [V]

5.0 -0.8

4.8 -1.2
-40°C
25°C
110°C
4.6 -1.6
0 10 20 30 40 0 4 8 12 16
Output Current : IOUT [mA] Output Current : IOUT [mA]

Fig.11 VREG drive capability Fig.12 High side output voltage

(XH, XL)

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
10/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Typical performance curves (Reference data) - Continued

1.6 0.00
110°C
25°C
-40°C

Input Bias Current : I HALL [µA]

Output Voltage : VOL [V] _

1.2 -0.05

0.8 -0.10

0.4 -0.15
110°C
25°C
-40°C
0.0 -0.20
0 4 8 12 16 0 1 2 3 4
Output Current : IOUT [mA] Input Voltage : VINHXP [V]

Fig.13 Low side output voltage Fig.14 Hall comparator input bias current
(XH, XL) (HXP, HXN)

6 200

110°C
5
25°C
Input Bias Current : ISP [µA]

-40°C 150
Output Voltage : V WH [V]

3
100
2

1
50
110°C 110°C
0 25°C 25°C
-40°C -40°C
-1 0
-30 -15 0 15 30 0 5 10 15 20
Differential Voltage : VHUP-VHUN [mV] VSP Voltage : VSP [V]

Fig.15 Hall comparator hysteresis voltage Fig.16 VSP input bias current

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
11/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Typical performance curves (Reference data) - Continued

100 1.5

80
1.0
Output Duty : D SP [%]

Internal Logic : H/L [-]

60

0.5

40
110°C
25°C
-40°C 0.0
20 110°C
25°C
-40°C
0 -0.5
0 2 4 6 8 0 5 10 15 20
VSP Voltage : VSP [V] VSP Voltage : VSP [V]

Fig.17 Output duty – VSP voltage Fig.18 Testing mode threshold voltage

0.0 0.8
110°C
25°C
-40°C
Output Drop Voltage : VOH [V]

Output Voltage : VOL [V] _

-0.2 0.6

-0.4 0.4

-0.6 0.2
-40°C
25°C
110°C
-0.8 0.0
0 2 4 6 0 2 4 6
Output Current : IOUT [mA] Output Current : IOUT [mA]

Fig.19 High side output voltage Fig.20 Low side output voltage
(FG) (FG)

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
12/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Typical performance curves (Reference data) - Continued

60 1.5
110°C 110°C 110°C
25°C 25°C 25°C
50 -40°C -40°C -40°C
Input Bias Current : IIN [µA]

1.0

Internal Logic : H/L [-]

40

30 0.5

20
0.0
10

0 -0.5
0 1 2 3 4 5 1.7 1.9 2.1 2.3 2.5 2.7 2.9
Input Voltage : VIN [V] Input Voltage : VIN [V]

Fig.21 Input bias current Fig.22 Input threshold voltage

(CCW, FIB) (CCW, FIB)

30 1.5

110°C
RCL Input Bias Current : IRCL [µA]

25°C
-40°C 1.0
Internal Logic : H/L [-]

20

0.5

10
0.0
110°C
25°C
-40°C
0 -0.5
0 1 2 3 4 5 0.48 0.49 0.50 0.51 0.52
RCL Input Voltage : VRCL [V] Input Voltage : VRCL [V]

Fig.23 RCL input bias current Fig.24 RCL input threshold voltage

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
13/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Typical performance curves (Reference data) - Continued

60 1.5
110°C 110°C 110°C
25°C 25°C 25°C
50 -40°C -40°C
-40°C
Input Bias Current : IIN [µA]

1.0

Internal Logic : H/L [-]

40

30 0.5

20
0.0
10

0 -0.5
0 1 2 3 4 5 1.7 1.9 2.1 2.3 2.5 2.7 2.9
Input Voltage : VIN [V] Input Voltage : VIN [V]

Fig.25 Input bias current Fig.26 Input threshold voltage

(FGS) (FGS)

1.5 6

5
1.0
Internal Logic : H/L [-]

UH Voltage : V UH [V]

4
-40°C 110°C
110°C -40°C
0.5 3 25°C 25°C

2
0.0
1

-0.5 0
125 150 175 200 7.0 7.5 8.0 8.5 9.0 9.5 10.0
Junction Temperature : Tj [°C] Supply Voltage : VCC [V]

Fig.27 Thermal shut down Fig.28 Under voltage lock out

(VCC)

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
14/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Typical performance curves (Reference data) - Continued

5 4

4
3
PCT Voltage : V PCT [V]

PC Voltage : V PC [V]
3

2
110°C
25°C
-40°C 1
1 110°C
-40°C
25°C
0 0
0 1 2 3 4 5 6 7 0 1 2 3 4
VSP Voltage : VSP [V] PCT Voltage : VPCT [V]

Fig.29 VSP-PCT offset voltage Fig.30 PCT-PC linearity

(RPCT=RPC=100kΩ)

60 30
110°C 110°C
25°C 25°C
50 -40°C -40°C
25
Frequency : F OSC [kHz]

40
Phase : LA [deg]

30 20

20
15
10

0 10
0.0 0.2 0.4 0.6 0.8 1.0 14 18 22 26 30
VPC/VREG (Normalized) : [V/V] External Resistor : RT [kohm]

Fig.31 PC voltage normalized - Lead angle Fig.32 Carrier frequency - RT

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
15/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Application circuit example

VREG

FG R8 R9
Q1

C13
R1
VSP DTR
IC1 C14 C7
C1
C2~C4
C8

HW HV HU VREG
M
R2
C11 C5

C9

C10 R5 R4 R3

VCC C6 R6
GND D1
IC2
R7
C12

VDC

Fig.33 Application circuit example (150° commutation driver)

Parts list
Parts Value Manufacturer Type Parts Value Ratings Type
IC1 - ROHM BD62012FS C1 0.1µF 50V Ceramic
IC2 - ROHM BM6201FS C2~4 2200pF 50V Ceramic
R1 1kΩ ROHM MCR18EZPF1001 C5 10µF 50V Ceramic
R2 150Ω ROHM MCR18EZPJ151 C6 10µF 50V Ceramic
R3 22kΩ ROHM MCR18EZPF2202 C7~9 1µF 50V Ceramic
R4 100kΩ ROHM MCR18EZPF1003 C10 0.1µF 50V Ceramic
R5 51kΩ ROHM MCR18EZPF5102 C11 1µF 50V Ceramic
R6 0.5Ω ROHM MCR50JZHFL1R50 x 3 C12 100pF 50V Ceramic
R7 10kΩ ROHM MCR18EZPF1002 C13 0.1µF 630V Ceramic
R8 0Ω ROHM MCR18EZPJ000 C14 0.1µF 50V Ceramic
R9 0Ω ROHM MCR18EZPJ000 HX - - Hall elements
Q1 - ROHM DTC124EUA
D1 - ROHM KDZ20B

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
16/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Interfaces

VCC
VREG
VREG
100k
250k VSP VREG

100k
RT RCL
2k

Fig.34 RT Fig.35 RCL Fig.36 VSP Fig.37 VREG, VCC

VREG
HUP
UH,VH,WH HUN
UL,VL,WL HVP 2k
FG HVN
HWP
HWN

Fig.38 XH, XL, FG Fig.39 HXP, HXN

VREG VREG

100k
FGS 2k
2k
CCW PC
FIB 2k
PCT

Fig.40 FGS, CCW, FIB Fig.41 PC, PCT

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
17/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Notes for use

1) Absolute maximum ratings

Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because
the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider
circuit protection measures - such as adding fuses - if any value in excess of absolute maximum ratings is to be
implemented.

2) Electrical potential at GND

Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine
whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena.
However, note that even if the voltage does not fall below GND in any other operating condition, it can still swing below
GND potential when the motor generates back electromotive force at the RCL terminal. The chip layout in this product is
designed to avoid this sort of electrical potential problem, but pulling excessive current may still result in malfunctions.
Therefore, it is necessary to observe operation closely to conclusively confirm that there is no problem in actual operation.
If there are a small signal GND and a high current GND, it is recommended to separate the patterns for the high current
GND and the small signal GND and provide a proper grounding to the reference point of the set not to affect the voltage at
the small signal GND with the change in voltage due to resistance component of pattern wiring and high current. Also for
GND wiring pattern of the component externally connected, pay special attention not to cause undesirable change to it.

3) Driver outputs
The high voltage semiconductor generally driven by this product is connected to the next stage via the controller. If any
special mode in excess of absolute maximum ratings is to be implemented with this product or its application circuits, it is
important to take physical safety measures, such as providing voltage clamping diodes or fuses.

4) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

5) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together. Also, connecting the power supply in reverse polarity can damage the IC.
Take precautions against reverse polarity when connecting the power supply lines, such as establishing an external diode
between the power supply and the IC power supply pin.

6) Operation in strong electromagnetic fields

Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic
fields.

7) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.

8) Regarding the input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by
which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin.

Resistor Transistor (NPN)

Pin A Pin B B Pin B
C
Pin A E

C
N B
N N P+ P
N P
+
P P+
N Parasitic P+
N
element E

P substrate P substrate
GND
Parasitic
GND GND GND element
Parasitic element Parasitic element Other adjacent elements
Appendix: Example of monolithic IC structure

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
18/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Ordering information

B D 6 2 0 1 2 F S - E 2
ROHM Part Number Package Packaging specification
FS : SSOP-A24 E2 : Embossed taping

 Physical dimension, tape and reel information

 Marking diagram

SSOP-A24 PRODUCT NAME

(TOP VIEW)

BD62012FS

1PIN MARK LOT No.

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
19/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
BD62012FS Datasheet

 Revision history
Date Revision Changes
26.MAR.2012 001 New release

http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0828ABB00020-1-2
20/20
TSZ22111 · 15 · 001 26.MAR.2012 Rev.001
 Datasheet

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.

© 2012 ROHM Co., Ltd. All rights reserved.

 Datasheet

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.

For details, please refer to ROHM Mounting specification

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

QR code printed on ROHM Products label is for ROHM’s internal use only.

When disposing Products please dispose them properly using an authorized industry waste company.

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.

1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.

© 2012 ROHM Co., Ltd. All rights reserved.

 Datasheet

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

© 2012 ROHM Co., Ltd. All rights reserved.