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AFE7769
SBASA09 – AUGUST 2019

AFE7769 Quad-Channel RF Transceiver With Feedback Path

1 Features 3 Description
1• Quad transmitters based on direct up-conversion The AFE7769 device is a high-performance,
architecture: multichannel transceiver, integrating four direct up-
conversion transmitter chains, four direct down-
– Up to 600 MHz of RF transmitted bandwidth conversion receiver chains, and two wideband RF
per chain sampling digitizing auxiliary chains (feedback paths).
• Quad receivers based on 0-IF down-conversion The high dynamic range of the transmitter and
architecture: receiver chains enables wireless base stations to
generate and receive 2G, 3G, 4G, and 5G signals.
– Up to 200 MHz of RF received bandwidth per
chain The low power dissipation and large channel
• Feedback chain based on RF sampling ADC: integration of the AFE7769 allows the device to
address the power and size constraints of 4G and 5G
– Up to 600 MHz of RF received bandwidth massive MIMO base stations. The wideband and high
• RF frequency range: 600 MHz to 6 GHz dynamic range feedback path can assist the Digital
• Four wideband fractional-N PLL, VCO for TX and Pre-Distortion (DPD) of the power amplifiers in the
RX LO transmitter chain. The fast SerDes speed can help
reduce the number of lanes required to transfer the
• Dedicated integer-N PLL, VCO for data converters data in and out.
clock generation
• JESD204B and JESD204C SerDes interface Device Information(1)
support: PART NUMBER PACKAGE BODY SIZE (NOM)
– 8 SerDes transceivers up to 29.5 Gbps AFE7769 FCBGA (400) 17.00 mm × 17.00 mm
– 8b/10b and 64b/66b encoding (1) For all available packages, see the orderable addendum at
– 16-bit, 12-bit, 24-bit and 32-bit formatting the end of the data sheet.

– Subclass 1 multi-device synchronization AFE7769 Block Diagram

• Package: 17-mm × 17-mm FCBGA, 0.8-mm pitch

VDD1p8RX

VDD1p2RX
VDD1p8FB

VDD1p2FB

VSSRX

VSSRX
VSSFB

VSSFB

1RXB+/-

2RXB+/-
DVDD

VDDA

VDDT
DVSS

VSST
1FB+/-

VSS
2 Applications RF PLL 3

LO
• Macro remote radio unit (RRU) VDD1p2TX
VSSTX
Dist
PLL-VCO

TX Chain 1 1SRX
• Small cell base station 1TX+/-
DAC
DAC 1STX
RF ADC

Chain11
From

• Active antenna system mMIMO (AAS)

RX Chain 2
SPI

RXChain

2SRX
VDD1p8TX

4x SerDes BLK1
ADC
ADC

ADC
ADC

VSSTX TX Chain 2
2STX
RX

• Distributed Antenna Systems (DAS) 2TX+/-

DAC
DAC
3SRX
SYSREF TX DIG
From
• Repeater SPI
3STX
RX DIG

RX DIG
FB DIG

Digital Backplane & JESD204C

TX DIG
PLL-VCO

PLL-VCO

PLL-VCO
Ref CLK

REFCLK_+/ 4SRX
-
Controller / Mux

4STX
RF PLL 0

RF PLL 2

DC CLK

VDD1p8PLL
Common Dig
Dist

Dist

Dist
LO

LO

VSSPLL
LO

Syncbin/out
From
SPI

5SRX
RX DIG

RX DIG

TX Chain 4 TX DIG
FB DIG

5STX
DAC TX DIG
3TX+/- DAC
4x SerDes BLK1

6SRX
From
VDD1p8TX
SPI 6STX
VSSTX TX Chain 3
RX Chain 3

4
RX Chain 4
RX Chain 3

ADC
Chain
ADC

DAC 7SRX
ADC
ADC

4TX+/- DAC
RF ADC

7STX
RX

VDD1p2TX
From SPI
VSSTX
8SRX

MCU 8STX
««.

GPIO
GPIOs
.

RF PLL 4
ADC

Config
SPIB

LO
SPI

Dist
PLL-VCO
1FB+/-

4RXB+/-
3RXB+/-
VDD1p8GPIO

VDD1p2FB

VDD1p8FB
VSSGPIO

VDD1p2RX
VSSFB

VSS
VDD1p8RX

VDDA

VDDT
VSSRX

VSST
VSSRX
VSSFB

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE7769
SBASA09 – AUGUST 2019 www.ti.com

Table of Contents
1 Features .................................................................. 1 6.1 Receiving Notification of Documentation Updates.... 4
2 Applications ........................................................... 1 6.2 Community Resources.............................................. 4
3 Description ............................................................. 1 6.3 Trademarks ............................................................... 4
6.4 Electrostatic Discharge Caution ................................ 4
4 Revision History..................................................... 2
6.5 Glossary .................................................................... 4
5 Description (cont.) ................................................. 3
7 Mechanical, Packaging, and Orderable
6 Device and Documentation Support.................... 4
Information ............................................................. 4

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE REVISION NOTES

August 2019 * Initial release.

2 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated

Product Folder Links: AFE7769

 AFE7769
www.ti.com SBASA09 – AUGUST 2019

5 Description (cont.)
Each receiver chain of the AFE7769 includes a 28-dB range digital step attenuator (DSA), followed by a
wideband passive IQ demodulator, and a baseband amplifier with integrated programmable antialiasing low pass
filters, driving a continuous-time sigma-delta ADC. The RX chain can receive an instantaneous bandwidth (IBW)
up to 200 MHz. Each receiver channel has two analog peak power detectors and various digital power detectors
to assist an external or internal autonomous AGC control for receiver channels, and a RF overload detector for
device reliability protection. The integrated QMC (quadrature mismatch compensation) algorithm is capable to
continuously monitor and correct for the RX chain I and Q imbalance mismatch without the need to inject any
specific signals or perform offline calibration.
Each transmitter chain includes two 14-bit, 3-Gsps IQ DACs, followed by a programmable reconstruction and
DAC image rejection filter, an IQ modulator driving a wideband RF amplifier with 39-dB range gain control. The
TX chain integrated QMC and LO leakage cancellation algorithms, leveraging the FB path can constantly track
and correct for the TX chain IQ mismatch and LO leakage.
Each FB path is based on RF sampling architecture, and includes an input RF DSA driving a 14-bit, 3-Gsps RF
ADC. The direct sampling architecture provides an inherently wideband receiver chain and simplifies the
calibration of the TX chains impairments. The FB path integrates two independent NCO that allows a fast
switching between two observed RF input bands.
The synthesizer section integrates four fractional-N RF PLL that can generate four different RF LO, allowing the
device to support up to two different bands, each one configured as two transmitters, two receivers and one
feedback paths.

Copyright © 2019, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: AFE7769
AFE7769
SBASA09 – AUGUST 2019 www.ti.com

6 Device and Documentation Support

6.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

6.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

6.3 Trademarks
E2E is a trademark of Texas Instruments.
6.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

6.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

4 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated

Product Folder Links: AFE7769

 PACKAGE OPTION ADDENDUM

www.ti.com 12-Mar-2021

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

AFE7769IABJ ACTIVE FCBGA ABJ 400 90 RoHS & Green SNAGCU Level-3-260C-168 HR -40 to 85 AFE7769

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 PACKAGE OUTLINE
ABJ0400A SCALE 0.750
FCBGA - 2.65 mm max height
BALL GRID ARRAY

17.2
BALL A1 CORNER A
16.8

17.2
( 16)
16.8

2.65 MAX
(2.08) 0.2 C
C

SEATING PLANE
0.76 NOTE 4
BALL TYP
0.56
0.12 C
0.5
TYP
0.3
15.2 TYP

SYMM
0.8 TYP (0.9) TYP

Y
W
V
U
T
R
P
N 15.2
M SYMM
L TYP
K
J
H
G
0.55 F
400X E
0.45 D
0.15 C A B C
B
0.08 C NOTE 3 A
1 3 5 7 9 11 13 15 17 19
2 4 6 8 10 12 14 16 18 20 0.8 TYP
4221311/B 04/2020

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.

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 EXAMPLE BOARD LAYOUT
ABJ0400A FCBGA - 2.65 mm max height
BALL GRID ARRAY

(0.8) TYP

A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

(0.8) TYP C
D
E
F
0.415 G
400X
0.385
H
J
K SYMM
L
M
N
P
R
T
U
V
W
Y

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:6X

( 0.4) 0.025 MAX

METAL 0.025 MIN METAL
UNDER
MASK

SOLDER MASK EXPOSED EXPOSED ( 0.4)

OPENING METAL METAL SOLDER MASK
OPENING
NON-SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE
4221311/B 04/2020
NOTES: (continued)

5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).

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 EXAMPLE STENCIL DESIGN
ABJ0400A FCBGA - 2.65 mm max height
BALL GRID ARRAY

(0.8) TYP ( 0.4) TYP

A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

(0.8) C
TYP
D
E
F
G
H
J
K SYMM

L
M
N
P
R
T
U
V
W
Y

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.15 mm THICK STENCIL
SCALE:6X

4221311/B 04/2020

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

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