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LMT01
SNIS189C – JUNE 2015 – REVISED JUNE 2017

LMT01 0.5°C Accurate 2-Pin Digital Output Temperature Sensor With Pulse Count
Interface
1 Features 3 Description
1• High Accuracy Over –50°C to 150°C Wide The LMT01 device is a high-accuracy, 2-pin
Temperature Range temperature sensor with an easy-to-use pulse count
current loop interface, which makes it suitable for
– –20°C to 90°C: ±0.5°C (Maximum) onboard and offboard applications in automotive,
– 90°C to 150°C: ±0.625°C (Maximum) industrial, and consumer markets. The LMT01 digital
– –50°C to –20°C: ±0.7°C (Maximum) pulse count output and high accuracy over a wide
temperature range allow pairing with any MCU
• Precision Digital Temperature Measurement without concern for integrated ADC quality or
Simplified in a 2-Pin Package availability, while minimizing software overhead. TI’s
• Pulse Count Current Loop Easily Read by LMT01 device achieves a maximum ±0.5°C accuracy
Processor. Number of Output Pulses is with very fine resolution (0.0625°C) over a
Proportional to Temperature With 0.0625°C temperature range of –20°C to 90°C without system
Resolution calibration or hardware and software compensation.
• Communication Frequency: 88 kHz The LMT01’s pulse count interface is designed to
• Conversion Current: 34 µA directly interface with a GPIO or comparator input,
thereby simplifying hardware implementation.
• Continuous Conversion Plus Data-Transmission Similarly, the LMT01's integrated EMI suppression
Period: 100 ms and simple 2-pin architecture makes it suitable for
• Floating 2-V to 5.5-V (VP–VN) Supply Operation onboard and offboard temperature sensing in a noisy
With Integrated EMI Immunity environment. The LMT01 device can be easily
• Multiple 2-Pin Package Offerings: TO-92/LPG (3.1 converted into a two-wire temperature probe with a
mm × 4 mm × 1.5 mm) – ½ the Size of Traditional wire length up to two meters. See LMT01-Q1 for the
automotive qualified version.
TO-92 and WSON With Wettable Flanks
Device Information(1)
2 Applications PART NUMBER PACKAGE BODY SIZE (NOM)
• Digital Output Wired Probes LMT01LPG TO-92 (2) 4.00 mm × 3.15 mm
• White Goods LMT01DQX WSON (2) 1.70 mm × 2.50 mm
• HVAC (1) For all available packages, see the orderable addendum at
• Power Supplies the end of the data sheet.

• Industrial Internet of Things (IoT)

2-Pin IC Temperature Sensor
• Battery Management
VDD: 3.0V to 5.5V

LMT01 Accuracy GPIO

Up to 2m
1.0 MCU/
0.8 Max Limit VP FPGA/
Min 2.0V
Temperature Accuracy (ƒC)

0.6
LMT01 ASIC
0.4
0.2 VN
0.0 GPIO/
-0.2 COMP
-0.4 LMT01 Pulse Count Interface
-0.6 Conversion Time
-0.8 Min Limit ADC Conversion Result

-1.0 Power Off

±50 ±25 0 25 50 75 100 125 150
LMT01 Junction Temperaure (ƒC) C014
Power On

Typical units plotted in center of curve.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 7.2 Functional Block Diagram ....................................... 13
2 Applications ........................................................... 1 7.3 Feature Description................................................. 13
3 Description ............................................................. 1 7.4 Device Functional Modes........................................ 16
4 Revision History..................................................... 2 8 Application and Implementation ........................ 17
8.1 Application Information............................................ 17
5 Pin Configuration and Functions ......................... 3
8.2 Typical Application .................................................. 18
6 Specifications......................................................... 4
8.3 System Examples .................................................. 20
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings.............................................................. 4 9 Power Supply Recommendations...................... 22
6.3 Recommended Operating Conditions ...................... 4 10 Layout................................................................... 23
6.4 Thermal Information .................................................. 4 10.1 Layout Guidelines ................................................. 23
6.5 Electrical Characteristics........................................... 5 10.2 Layout Example .................................................... 23
6.6 Electrical Characteristics - TO-92/LPG Pulse Count 11 Device and Documentation Support ................. 24
to Temperature LUT................................................... 6 11.1 Receiving Notification of Documentation Updates 24
6.7 Electrical Characteristics - WSON/DQX Pulse Count 11.2 Community Resources.......................................... 24
to Temperature LUT................................................... 7 11.3 Trademarks ........................................................... 24
6.8 Switching Characteristics .......................................... 7 11.4 Electrostatic Discharge Caution ............................ 24
6.9 Timing Diagram......................................................... 8 11.5 Glossary ................................................................ 24
6.10 Typical Characteristics ............................................ 9 12 Mechanical, Packaging, and Orderable
7 Detailed Description ............................................ 13 Information ........................................................... 24
7.1 Overview ................................................................. 13

4 Revision History
Changes from Revision B (April 2017) to Revision C Page

• Removed Electrical Characteristics: WSON/DQX table; Combined the LPG and DQX Electrical Characteristics
tables together ........................................................................................................................................................................ 5
• Changed IOL maximum value from: 39 µA to: 40 µA .............................................................................................................. 5
• Changed leakage value from: 1 µA to 3.5 µA ........................................................................................................................ 5
• Moved the thermal response time parameters to the Electrical Characteristics table ........................................................... 5
• Added Missing Cross References ........................................................................................................................................ 13

Changes from Revision A (June 2015) to Revision B Page

• Added new WSON/DQX package throughout data sheet ..................................................................................................... 1

• Changed updated package information. ................................................................................................................................ 3
• Added Electrical Characteristics - WSON/DQX Pulse Count to Temperature LUT ............................................................... 7
• Added -40 for Sample Calculations Table ........................................................................................................................... 14
• Added missing cross reference ........................................................................................................................................... 15

Changes from Original (June 2015) to Revision A Page

• Added full datasheet. ............................................................................................................................................................. 1

• Added clarification note. ........................................................................................................................................................ 1

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5 Pin Configuration and Functions

DQX Package
2-Pin WSON
Bottom View

VP VN

LPG Package
2-Pin TO-92
Top View

VN
VP

Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
VP 1 Input Positive voltage pin; may be connected to system power supply or bias resistor.
VN 2 Output Negative voltage pin; may be connected to system ground or a bias resistor.

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6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
See .
MIN MAX UNIT
Voltage drop (VP – VN) −0.3 6 V
Storage temperature, Tstg −65 175 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.

6.2 ESD Ratings

VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±750

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
Free-air temperature −50 150 °C
Voltage drop (VP – VN) 2 5.5 V

6.4 Thermal Information

LMT01
(1)
THERMAL METRIC DQX (WSON) LPG (TO-92) UNIT
2 PINS 2 PINS
RθJA Junction-to-ambient thermal resistance 213 177 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 71 94 °C/W
RθJB Junction-to-board thermal resistance 81 152 °C/W
ψJT Junction-to-top characterization parameter 2.4 33 °C/W
ψJB Junction-to-board characterization parameter 79 152 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

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6.5 Electrical Characteristics

Over operating free-air temperature range and operating VP-VN range (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ACCURACY
150°C –0.625 0.625 °C
125°C -0.625 0.625 °C
120°C –0.625 0.625 °C
110°C –0.5625 0.5625 °C

(1) (2) VP – VN of 100°C –0.5625 0.5625 °C

Temperature accuracy
2.15 V to 5.5 V 90°C –0.5 0.5 °C
25°C –0.5 ±0.125 0.5 °C
–20°C –0.5 0.5 °C
–30°C –0.5625 0.5625 °C
–40°C –0.625 0.625 °C
(1) (2) VP – VN of
Temperature accuracy –50°C –0.6875 ±0.4 0.6875 °C
2.15 V to 5.5 V
PULSE COUNT TRANSFER FUNCTION
Number of pulses at 0°C 800 808 816
15 3228
Output pulse range Theoretical max (exceeds
1 4095
device rating)
Resolution of one pulse 0.0625 °C
OUTPUT CURRENT
IOL Low level 28 34 40 µA
Output current variation
IOH High level 112.5 125 143 µA
High-to-Low level output current ratio 3.1 3.7 4.5
POWER SUPPLY
Accuracy sensitivity to change in VP – VN 2.15 V ≤ VP – VN ≤ 5. 0 V (3) 40 133 m°C/V
Leakage Current VP – VN VDD ≤ 0.4 V 0.002 3.5 µA
THERMAL RESPONSE
Stirred oil thermal response time to 63% of final value DQX (WSON) 0.4
s
(package only) LPG (TO-92) 0.8
Still air thermal response time to 63% of final value DQX (WSON) 9.4
s
(package only) LPG (TO-92) 28

(1) Calculated using Pulse Count to Temperature LUT and 0.0625°C resolution per pulse, see section Electrical Characteristics - TO-
92/LPG Pulse Count to Temperature LUT and Electrical Characteristics - WSON/DQX Pulse Count to Temperature LUT.
(2) Error can be linearly interpolated between temperatures given in table as shown in the Accuracy vs Temperature curves in section
Typical Characteristics.
(3) Limit is using end point calculation.

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6.6 Electrical Characteristics - TO-92/LPG Pulse Count to Temperature LUT

Over operating free-air temperature range and VP-VN operating range (unless otherwise noted). LUT is short for Look-up
Table.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
–50°C 15 26 37
–40°C 172 181 190
–30°C 329 338 347
–20°C 486 494 502
–10°C 643 651 659
0°C 800 808 816
10°C 958 966 974
20°C 1117 1125 1133
30°C 1276 1284 1292
40°C 1435 1443 1451
Digital output code 50°C 1594 1602 1610 pulses
60°C 1754 1762 1770
70°C 1915 1923 1931
80°C 2076 2084 2092
90°C 2237 2245 2253
100°C 2398 2407 2416
110°C 2560 2569 2578
120°C 2721 2731 2741
130°C 2883 2893 2903
140°C 3047 3057 3067
150°C 3208 3218 3228

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6.7 Electrical Characteristics - WSON/DQX Pulse Count to Temperature LUT

Over operating free-air temperature range and 2.15 V ≤ VP – VN ≤ 5. 0 V power supply operating range (unless otherwise
noted). LUT is short for Look-up Table.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
–50°C 15 26 37
–40°C 172 181 190
–30°C 328 337 346
–20°C 486 494 502
–10°C 643 651 659
0°C 800 808 816
10°C 958 966 974
20°C 1117 1125 1133
30°C 1276 1284 1292
40°C 1435 1443 1451
50°C 1594 1603 1611
Digital output code pulses
60°C 1754 1762 1771
70°C 1915 1923 1931
80°C 2076 2084 2092
90°C 2237 2245 2254
100°C 2398 2407 2416
110°C 2560 2569 2578
120°C 2721 2731 2741
125°C 2802 2814 2826
130°C 2883 2894 2904
140°C 3047 3058 3068
150°C 3210 3221 3231

6.8 Switching Characteristics

Over operating free-air temperature range and operating VP – VN range (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tR, tF Output current rise and fall time CL = 10 pF, RL = 8 k 1.45 µs
fP Output current pulse frequency 82 88 94 kHz
Output current duty cycle 40% 50% 60%
tCONV Temperature conversion time (1) 2.15 V to 5.5 V 46 50 54 ms
tDATA Data transmission time 44 47 50 ms

(1) Conversion time includes power up time or device turn on time that is typically 3 ms after POR threshold of 1.2 V is exceeded.

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6.9 Timing Diagram

tCONV tDATA

Power
125µA 34µA
tR
Power Off
Output
Current tF
1/fP

Figure 1. Timing Specification Waveform

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6.10 Typical Characteristics

1.0 1.0
0.8 Max Limit 0.8 Max Limit
Temperature Accuracy (ƒC)

Temperature Accuracy (ƒC)

0.6 0.6
0.4 0.4
0.2 0.2
0.0 0.0
-0.2 -0.2
-0.4 -0.4
-0.6 -0.6
-0.8 Min Limit -0.8 Min Limit

-1.0 -1.0
±50 ±25 0 25 50 75 100 125 150 ±50 ±25 0 25 50 75 100 125 150
LMT01 Junction Temperaure (ƒC) C017 LMT01 Junction Temperaure (ƒC) C016

Using Electrical Characteristics - TO-92/LPG Pulse Count to Using Electrical Characteristics - TO-92/LPG Pulse Count to
Temperature LUT Temperature LUT
VP – VN = 2.15 V VP – VN = 2.4 V

Figure 2. Accuracy vs LMT01 Junction Temperature Figure 3. Accuracy vs LMT01 Junction Temperature
1.0 1.0
0.8 Max Limit 0.8 Max Limit
Temperature Accuracy (ƒC)

Temperature Accuracy (ƒC)

0.6 0.6
0.4 0.4
0.2 0.2
0.0 0.0
-0.2 -0.2
-0.4 -0.4
-0.6 -0.6
-0.8 Min Limit -0.8 Min Limit

-1.0 -1.0
±50 ±25 0 25 50 75 100 125 150 ±50 ±25 0 25 50 75 100 125 150
LMT01 Junction Temperaure (ƒC) C015 LMT01 Junction Temperaure (ƒC) C014

Using Electrical Characteristics - TO-92/LPG Pulse Count to Using Electrical Characteristics - TO-92/LPG Pulse Count to
Temperature LUT Temperature LUT
VP – VN = 2.7 V VP – VN = 3 V

Figure 4. Accuracy vs LMT01 Junction Temperature Figure 5. Accuracy vs LMT01 Junction Temperature
1.0 1.0
0.8 Max Limit 0.8 Max Limit
Temperature Accuracy (ƒC)

Temperature Accuracy (ƒC)

0.6 0.6
0.4 0.4
0.2 0.2
0.0 0.0
-0.2 -0.2
-0.4 -0.4
-0.6 -0.6
-0.8 Min Limit -0.8 Min Limit

-1.0 -1.0
±50 ±25 0 25 50 75 100 125 150 ±50 ±25 0 25 50 75 100 125 150
LMT01 Junction Temperaure (ƒC) C013 LMT01 Junction Temperaure (ƒC) C012

Using Electrical Characteristics - TO-92/LPG Pulse Count to Using Electrical Characteristics - TO-92/LPG Pulse Count to
Temperature LUT Temperature LUT
VP – VN = 4 V VP – VN = 5 V

Figure 6. Accuracy vs LMT01 Junction Temperature Figure 7. Accuracy vs LMT01 Junction Temperature

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Typical Characteristics (continued)

1.00
0.80 Max Limit -0.625°C 0.625°C
Min Limit Max Limit
Temperature Accuracy (ƒC)

0.60
0.40

Frequency
0.20
0.00
-0.20
-0.40
-0.60
Min Limit
-0.80
-1.00
±50 ±25 0 25 50 75 100 125 150 -1 0 +1
LMT01 Junction Temperature (ƒC) Accuracy (ƒC)
C011 C025

Using Electrical Characteristics - TO-92/LPG Pulse Count to Using Electrical Characteristics - TO-92/LPG Pulse Count to
Temperature LUT Temperature LUT
VP – VN = 5.5 V VP – VN = 2.15 V to 5.5 V

Figure 8. Accuracy vs LMT01 Junction Temperature Figure 9. Accuracy Histogram at 150°C

-0.5°C 0.5°C -0.5°C 0.5°C

Min Limit Max Limit Min Limit Max Limit
Frequency

Frequency

-1 0 +1 -1 0 +1
Accuracy (ƒC) Accuracy (ƒC)
C024 C023

Using Electrical Characteristics - TO-92/LPG Pulse Count to Using Electrical Characteristics - TO-92/LPG Pulse Count to
Temperature LUT Temperature LUT
VP – VN = 2.15 V to 5.5 V VP – VN = 2.15 V to 5.5 V

Figure 10. Accuracy Histogram at 30°C Figure 11. Accuracy Histogram at –20°C

0.5625°C 0.5625°C
-0.5625°C -0.5625°C
Max Limit Max Limit
Min Limit Min Limit
Frequency
Frequency

-1 0 +1 -1 0 +1
Accuracy (ƒC) Accuracy (ƒC)
C022 C021

Using LUT Electrical Characteristics - TO-92/LPG Pulse Count to Using Electrical Characteristics - TO-92/LPG Pulse Count to
Temperature LUT Temperature LUT
VP – VN = 2.15 V to 5.5 V VP – VN = 2.15 V to 5.5 V

Figure 12. Accuracy Histogram at -30°C

Figure 13. Accuracy Histogram at -40°C

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Typical Characteristics (continued)

3.0

2.5

Temperature Accuracy (ƒC)

-0.6875°C 0.6875°C
Min Limit Max Limit 2.0

1.5
Frequency

1.0

0.5

0.0

-0.5

-1.0
-1 0 +1 ±50 ±25 0 25 50 75 100 125 150
Accuracy (ƒC) LMT01 Junction Temperaure (ƒC)
C020 C018

Using LUT Electrical Characteristics - TO-92/LPG Pulse Count to Using Temp = (PC/4096 × 256°C ) – 50°C
Temperature LUT VP – VN = 2.15 V
VP – VN = 2.15 V to 5.5 V

Figure 14. Accuracy Histogram at -50°C Figure 15. Accuracy Using Linear Transfer Function
3.0 150

2.5
125
Temperature Accuracy (ƒC)

2.0
Output Current (µA)

High Level Current

100
1.5

1.0 75

0.5 Low Level Current

50
0.0
25
-0.5

-1.0 0
±50 ±25 0 25 50 75 100 125 150 2 3 4 5 6
LMT01 Junction Temperaure (ƒC) C019 VP - VN (V) C004

Using Temp = (PC/4096 × 256°C ) – 50°C

VP – VN = 5.5V TA = 30°C

Figure 16. Accuracy Using Linear Transfer Function Figure 17. Output Current vs VP-VN Voltage
150 110
100
Percent of (Final - Initial) Value (%)

125 90
80
Output Current (µA)

High Level Current

100
70
60
75
50
Low Level Current 40
50
30
25 20
10
0 0
±50 ±25 0 25 50 75 100 125 150 0 120 240 360 480 600 720 840 960 1080 1200
LMT01 Juntion Temperature (ƒC) C003 Time (seconds) C033

VP – VN = 3.3 V
VP – VN = 3.3 V TINITIAL = 23°C, TFINAL = 70°C

Figure 18. Output Current vs Temperature Figure 19. Thermal Response in Still Air (TO92S/LPG
Package)

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Typical Characteristics (continued)

110 110
100 100
Percent of (Final - Initial) Value (%)

Percent of (Final - Initial) Value (%)

90 90
80 80
70 70
60 60
50 50
40 40
30 30
20 20
10 10
0 0
0 20 40 60 80 100 120 140 160 180 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
Time (seconds) C032 Time (seconds) C031

VP – VN = 3.3 V Air Flow = 2.34 VP – VN = 3.3 V

TINITIAL = 23°C, TFINAL = 70°C meters/sec TINITIAL = 23°C, TFINAL = 70°C

Figure 20. Thermal Response in Moving Air (TO92S/LPG Figure 21. Thermal Response in Stirred Oil (TO92S/LPG
Package) Package)

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7 Detailed Description

7.1 Overview
The LMT01 temperature output is transmitted over a single wire using a train of current pulses that typically
change from 34 µA to 125 µA. A simple resistor can then be used to convert the current pulses to a voltage. With
a 10-kΩ resistor, the output voltage levels range from 340 mV to 1.25 V, typically. A simple microcontroller
comparator or external transistor can be used convert this signal to valid logic levels the microcontroller can
process properly through a GPIO pin. The temperature can be determined by gating a simple counter on for a
specific time interval to count the total number of output pulses. After power is first applied to the device the
current level will remain below 34 µA for at most 54 ms while the LMT01 is determining the temperature. When
the temperature is determined, the pulse train begins. The individual pulse frequency is typically 88 kHz. The
LMT01 will continuously convert and transmit data when the power is applied approximately every 104 ms
(maximum).
The LMT01 uses thermal diode analog circuitry to detect the temperature. The temperature signal is then
amplified and applied to the input of a ΣΔ ADC that is driven by an internal reference voltage. The ΣΔ ADC
output is then processed through the interface circuitry into a digital pulse train. The digital pulse train is then
converted to a current pulse train by the output signal conditioning circuitry that includes high and low current
regulators. The voltage applied across the pins of the LMT01 is regulated by an internal voltage regulator to
provide a consistent Chip VDD that is used by the ADC and its associated circuitry.

7.2 Functional Block Diagram

VP

Chip VDD

Chip VSS
Voltage
Regulator
and
Thermal Diode Output
Analog Circuitry Data Signal
ADC Interface
Conditioning

VREF

LMT01

VN
7.3 Feature Description
7.3.1 Output Interface
The LMT01 provides a digital output in the form of a pulse count that is transmitted by a train of current pulses.
After the LMT01 is powered up, it transmits a very low current of 34 µA for less than 54 ms while the part
executes a temperature to digital conversion, as shown in Figure 22. When the temperature-to-digital conversion
is complete, the LMT01 starts to transmit a pulse train that toggles from the low current of 34 µA to a high current
level of 125 µA. The pulse train total time interval is at maximum 50 ms. The LMT01 transmits a series of pulses
equivalent to the pulse count at a given temperature as described in Electrical Characteristics - TO-92/LPG Pulse
Count to Temperature LUT. After the pulse count has been transmitted the LMT01 current level will remain low
for the remainder of the 50 ms. The total time for the temperature to digital conversion and the pulse train time
interval is 104 ms (maximum). If power is continuously applied, the pulse train output will repeat start every 104
ms (maximum).

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Feature Description (continued)

Power Start of data End of data Start of next End of data

ON transmission conversion result data

54ms
104ms max
max

Power
50ms max 50ms max

Power
Off
Pulse
Train

Figure 22. Temperature to Digital Pulse Train Timing Cycle

The LMT01 can be powered down at any time to conserve system power. Take care to ensure that a minimum
power-down wait time of 50 ms is used before the device is turned on again.

7.3.2 Output Transfer Function

The LMT01 outputs at minimum 1 pulse and a theoretical maximum 4095 pulses. Each pulse has a weight of
0.0625°C. One pulse corresponds to a temperature less than –50°C while a pulse count of 4096 corresponds to
a temperature greater than 200°C. Note that the LMT01 is only ensured to operate up to 150°C. Exceeding this
temperature by more than 5°C may damage the device. The accuracy of the device degrades as well when
150°C is exceeded.
Two different methods of converting the pulse count to a temperature value are discussed in this section. The
first method is the least accurate and uses a first order equation, and the second method is the most accurate
and uses linear interpolation of the values found in the look-up table (LUT) as described in Electrical
Characteristics - TO-92/LPG Pulse Count to Temperature LUT.
The output transfer function appears to be linear and can be approximated by Equation 1:
§ PC ·
Temp ¨ u 256qC ¸ 50qC
© 4096 ¹
where
• PC is the Pulse Count
• Temp is the temperature reading (1)
Table 1 shows some sample calculations using Equation 1.

Table 1. Sample Calculations Using Equation 1

TEMPERATURE (°C) NUMBER OF PULSES
–49.9375 1
–49.875 2
–40 160
–20 480
0 800
30 1280
50 1600
100 2400
150 3200

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The curve shown in Figure 23 shows the output transfer function using equation Equation 1 (blue line) and the
look-up table (LUT) found in Electrical Characteristics - TO-92/LPG Pulse Count to Temperature LUT (red line).
The LMT01 output transfer function as described by the LUT appears to be linear, but upon close inspection, it
can be seen as truly not linear. To actually see the difference, the accuracy obtained by the two methods must
be compared.
4096

3584

3072

Pulse Count
2560

2048

1536

1024

512

0
±50 ±25 0 25 50 75 100 125 150 175 200 225
LMT01 Junction Temperature (ƒC) C002

Figure 23. LMT01 Output Transfer Function

For more exact temperature readings the output pulse count can be converted to temperature using linear
interpolation of the values found in Electrical Characteristics - TO-92/LPG Pulse Count to Temperature LUT.
The curves in Figure 24 and Figure 25, show the accuracy of typical units when using the Equation 1 and linear
interpolation using Electrical Characteristics - TO-92/LPG Pulse Count to Temperature LUT, respectively. When
compared, the improved performance when using the LUT linear interpolation method can clearly be seen. For a
limited temperature range of 25°C to 80°C, the error shown in Figure 24 is flat, so the linear equation will provide
good results. For a wide temperature range, TI recommends that linear interpolation and the LUT be used.

3.0 1.0

2.5 0.8 Max Limit

Temperature Accuracy (ƒC)

Temperature Accuracy (ƒC)

0.6
2.0
0.4
1.5
0.2
1.0 0.0

0.5 -0.2
-0.4
0.0
-0.6
-0.5 Min Limit
-0.8
-1.0 -1.0
±50 ±25 0 25 50 75 100 125 150 ±50 ±25 0 25 50 75 100 125 150
LMT01 Junction Temperaure (ƒC) C018 LMT01 Junction Temperaure (ƒC) C017

Figure 24. LMT01 Typical Accuracy When Using First Figure 25. LMT01 Accuracy Using Linear Interpolation of
Order Equation Equation 1 – 92 Typical Units Plotted at LUT Found In Electrical Characteristics - TO-92/LPG Pulse
(VP – VN) = 2.15 V Count to Temperature LUT – 92 typical units plotted at
(VP – VN) = 2.15 V

7.3.3 Current Output Conversion to Voltage

The minimum voltage drop across the LMT01 must be maintained at 2.15 V during the conversion cycle. After
the conversion cycle, the minimum voltage drop can decrease to 2.0 V. Thus the LMT01 can be used for low
voltage applications. See Application Information for more information on low voltage operation and other
information on picking the actual resistor value for different applications conditions. The resistor value is
dependent on the power supply level and the variation and the threshold level requirements of the circuitry the
resistor is driving (that is, MCU, GPIO, or Comparator).

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Stray capacitance can be introduced when connecting the LMT01 through a long wire. This stray capacitance
influences the signal rise and fall times. The wire inductance has negligible effect on the AC signal integrity. A
simple RC time constant model as shown in Figure 26 can be used to determine the rise and fall times.
POWER
tHL
LMT01
VF
VHL
OUTPUT
C 34 and R
VS
100pF 125 µA 10k

Figure 26. Simple RC Model for Rise and Fall Times

§ V VS ·
tHL Ru Cu In ¨ F ¸
© VF VHL ¹
where
• RC as shown in Figure 26
• VHL is the target high level
• the final voltage VF = 125 µA × R
• the start voltage VS = 34 µA × R (2)
For the 10% to 90% level rise time (tr), Equation 2 simplifies to:
tr = R×C×2.197 (3)
Take care to ensure that the LMT01 voltage drop does not exceed 300 mV under reverse bias conditions, as
given in the Absolute Maximum Ratings .

7.4 Device Functional Modes

The only functional mode the LMT01 has is that it provides a pulse count output that is directly proportional to
temperature.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.1.1 Mounting, Temperature Conductivity, and Self-Heating

The LMT01 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be
glued or cemented to a surface to ensure good temperature conductivity. The temperatures of the lands and
traces to the leads of the LMT01 also affect the temperature reading, so they must be a thin as possible.
Alternatively, the LMT01 can be mounted inside a sealed-end metal tube, and then can be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the LMT01 and accompanying wiring and circuits must be
kept insulated and dry to avoid excessive leakage and corrosion. Printed-circuit coatings are often used to
ensure that moisture cannot corrode the leads or circuit traces.
The junction temperature of the LMT01 is the actual temperature being measured by the device. The thermal
resistance junction-to-ambient (RθJA) is the parameter (from Thermal Information) used to calculate the rise of a
device junction temperature (self-heating) due to its average power dissipation. The average power dissipation of
the LMT01 is dependent on the temperature it is transmitting as it effects the output pulse count and the voltage
across the device. Equation 4 is used to calculate the self-heating in the die temperature of the LMT01 (TSH).
ª§ tCONV · § ª§ PC I I · § 4096 PC ·º tDATA · º
TSH «¨IOL u u VCONV ¸ ¨ «¨ u OL OH ¸ ¨ u IOL ¸» u ¸ u VDATA » u RTJA
tCONV tDATA ¨ © 4096 ¹¼ t CONV tDATA ¸
¬«© ¹ ©¬ 2 ¹ © 4096 ¹ ¼»
where
• TSH is the ambient temperature
• IOL and IOH are the output low and high current level, respectively
• VCONV is the voltage across the LMT01 during conversion
• VDATA is the voltage across the LMT01 during data transmission
• tCONV is the conversion time
• tDATA is the data transmission time
• PC is the output pulse count
• RθJA is the junction to ambient package thermal resistance (4)
Plotted in the curve Figure 27 are the typical average supply current (black line using left y axis) and the resulting
self-heating (red and violet lines using right y axis) during continuous conversions. A temperature range of –50°C
to +150°C, a VCONV of 5 V (red line) and 2.15 V (violet line) were used for the self-heating calculation. As can be
seen in the curve, the average power supply current and thus the average self-heating changes linearly over
temperature because the number of pulses increases with temperature. A negligible self-heating of about 45m°C
is observed at 150°C with continuous conversions. If temperature readings are not required as frequently as
every 100 ms, self-heating can be minimized by shutting down power to the part periodically thus lowering the
average power dissipation.

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Application Information (continued)

60 0.06

50 0.05

Average Current (µA)

Self Heating (ƒC)

40 0.04

30 0.03

20 0.02

10 0.01
Average Current
Self Heating at VP-VN=5V
0 Self Heating at VP-VN=2.15V 0.00
-100 -50 0 50 100 150 200
Temperature (ƒC) C001

Figure 27. Average Current Draw and Self-Heating Over Temperature

8.2 Typical Application

8.2.1 3.3-V System VDD MSP430 Interface - Using Comparator Input

VDD 3.3V

MSP430
GPIO
Divider VREF
2.73V
VP or
2.24V
LMT01
TIMER2
VN
COMP_B CLOCK
+
R
VR
6.81k
IR = 34
1%
and 125 µA

Figure 28. MSP430 Comparator Input Implementation

8.2.1.1 Design Requirements

The design requirements listed in Table 2 are used in the detailed design procedure.

Table 2. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE
VDD 3.3 V
VDD minimum 3.0 V
LMT01 VP – VN minimum during conversion 2.15 V
LMT01 VP – VN minimum during data
2.0 V
transmission
Noise margin 50 mV minimum
Comparator input current over temperature range
< 1 uA
of interest
Resistor tolerance 1%

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8.2.1.2 Detailed Design Procedure

First, select the R and determine the maximum logic low voltage and the minimum logic high voltage while
ensuring that when the LMT01 is converting, the minimum (VP – VN) requirement of 2.15 V is met.
1. Select R using minimum VP-VN during data transmission (2 V) and maximum output current of the LMT01
(143.75 µA)
– R = (3.0 V – 2 V) / 143.75 µA = 6.993 k the closest 1% resistor is 6.980 k
– 6.993 k is the maximum resistance so if using 1% tolerance resistor the actual resistor value needs to be
1% less than 6.993 k and 6.98 k is 0.2% less than 6.993 k thus 6.81 k must be used.
2. Check to see if the 2.15-V minimum voltage during conversion requirement for the LMT01 is met with the
maximum IOL of 39 µA and maximum R of 6.81 k + 1%:
– VLMT01 = 3 V – (6.81 k × 1.01) × 39 µA = 2.73 V
3. Find the maximum low level voltage range using the maximum R of 6.81 k and maximum IOL of 39 µA:
– VRLmax = (6.81 k × 1.01) × 39 µA = 268 mV
4. Find the minimum high level voltage using the minimum R of 6.81 k and minimum IOH of 112.5 µA:
– VRHmin = (6.81 k × 0.99) × 112.5 µA = 758 mV
Now select the MSP430 comparator threshold voltage that enables the LMT01 to communicate to the MSP430
properly.
1. The MSP430 voltage is selected by selecting the internal VREF and then choosing the appropriate 1 of n/32
settings for n of 1 to 31.
– VMID= (VRLmax – VRHmin) / 2 + VRHmin = (758 mV – 268 mV) / 2 + 268 mV = 513 mV
– n = (VMID / VREF ) × 32 = (0.513 / 2.5) × 32 = 7
2. To prevent oscillation of the comparator, output hysteresis must be implemented. The MSP430 allows this by
enabling different n for the rising edge and falling edge of the comparator output. For a falling comparator
output transition, N must be set to 6.
3. Determine the noise margin caused by variation in comparator threshold level. Even though the comparator
threshold level theoretically is set to VMID, the actual level varies from device to device due to VREF tolerance,
resistor divider tolerance, and comparator offset. For proper operation, the COMP_B worst case input
threshold levels must be within the minimum high and maximum low voltage levels presented across R,
VRHmin and VRLmax, respectively
N N_TOL
VCHmax VREF u 1 V_REF_TOL u COMP_OFFSET
32
where
• VREF is the MSP430 COMP_B reference voltage for this example at 2.5 V
• V_REF_TOL is the tolerance of the VREF of 1% or 0.01,
• N is the divisor for the MSP430 or 7
• N_TOL is the tolerance of the divisor or 0.5
• COMP_OFFSET is the comparator offset specification or 10 mV (5)
N N_TOL
VCLmin VREF u 1 V_REF_TOL u COMP_OFFSET
32
where
• VREF is the MSP430 COMP_B reference voltage for this example at 2.5 V,
• V_REF_TOL is the tolerance of the VREF of 1% or 0.01,
• N is the divisor for the MSP430 for the hysteresis setting or 6,
• N_TOL is the tolerance of the divisor or 0.5,
• COMP_OFFSET is the comparator offset specification or 10 mV (6)
The noise margin is the minimum of the two differences:
(VRHmin – VCHmax) or (VCHmin – VRLmax) (7)
which works out to be 145 mV.

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VDD
Pulse
VRHmax

Comparator Threshold and VR

Count
Signal
VRHmin
Noise Margin
VCHmax
VMID
VCHmin
Noise Margin
VRLmax
VRLmin

GND
Time (µs)
Figure 29. Pulse Count Signal Amplitude Variation

8.2.1.2.1 Setting the MSP430 Threshold and Hysteresis

The comparator hysteresis determines the noise level that the signal can support without causing the comparator
to trip falsely and resulting in an inaccurate pulse count. The comparator hysteresis is set by the precision of the
MSP430 and what thresholds it is capable of. For this case, as the input signal transitions high, the comparator
threshold is dropped by 77 mV. If the noise on the signal is kept below this level as it transitions, the comparator
will not trip falsely. In addition, the MSP430 has a digital filter on the COMP_B output that be used to further filter
output transitions that occur too quickly.

8.2.1.3 Application Curves

Amplitude = 200 mV/div Δy at cursors = 500 mV Amplitude = 200 mV/div Δy at cursors = 484 mV
Time Base = 10 µs/div Δx at cursors = 11.7 µs Time Base = 10 µs/div Δx at cursors = 11.7 µs

Figure 30. MSP430 COMP_B Input Signal No Capacitance Figure 31. MSP430 COMP_B Input Signal 100-pF
Load Capacitance Load

8.3 System Examples

The LMT01 device can be configured in a number of ways. Transistor level shifting can be used so that the
output pulse of the device can be read with a GPIO (see Figure 32). An isolation block can be inserted to
achieve electrical isolation (see Figure 33). Multiple LMT01 devices can be controlled with GPIOs enabling
temperature monitor for multiple zones. Lastly, the LMT01 device can be configured to have a common ground
with a high side signal (see Figure 35).

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System Examples (continued)

3.3V

VDD

MCU/
VP FPGA/
LMT01 ASIC
100k
VN GPIO

MMBT3904
34 and
125 µA 7.5k

Figure 32. Transistor Level Shifting

3V to 5.5V 3V to 5.5V

ISO734x
VCC1 VCC2 VDD

VP MCU/FPGA/
ASIC
Min
LMT01
ISOLATION

2.0V
100k
VN
GPIO

MMBT3904
34 and
125 µA 7.5k

GND1 GND2

Figure 33. Isolation

VDD
3V to 5.5V

GPIO1
GPIO2

GPIO n
Up to 2.0m MCU/FPGA/
VP VP VP ASIC
LMT01 LMT01 LMT01 Min
2.0V
U1 U2 Un
VN VN VN
GPIO/
COMP
34 and
125 µA 6.81k
(for 3V)

Note: to turn off an LMT01 set the GPIO pin connected to VP to high impedance state as setting it low would cause
the off LMT01 to be reverse biased. Comparator input of MCU must be used.

Figure 34. Connecting Multiple Devices to One MCU Input Pin

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System Examples (continued)

3.3V

VDD

34 and
125 µA 7.5k
MCU/
FPGA/
ASIC
MMBT3906
VP

LMT01 GPIO

VN

100k

Note: the VN of the LMT01 must be connected to the MCU GND.

Figure 35. Common Ground With High-Side Signal

9 Power Supply Recommendations

Because the LMT01 is only a 2-pin device the power pins are common with the signal pins, thus the LMT01 has
a floating supply that can vary greatly. The LMT01 has an internal regulator that provides a stable voltage to
internal circuitry.
Take care to prevent reverse biasing of the LMT01 as exceeding the absolute maximum ratings may cause
damage to the device.
Power supply ramp rate can effect the accuracy of the first result transmitted by the LMT01. As shown in
Figure 36 with a 1-ms rise time, the LMT01 output code is at 1286, which converts to 30.125°C. The scope photo
shown in Figure 37 reflects what happens when the rise time is too slow. In Figure 37, the power supply (yellow
trace) is still ramping up to final value while the LMT01 (red trace) has already started a conversion. This causes
the output pulse count to decrease from the previously shown 1286, to 1282 (or 29.875°C). Thus, for slow ramp
rates, TI recommends that the first conversion be discarded. For even slower ramp rates, more than one
conversion may have to be discarded as TI recommends that either the power supply be within final value before
a conversion is used or that ramp rates be faster than 2.5 ms.

Yellow trace = 1 V/div, Red trace = 100 mV/div, Time Base = 20 Yellow trace = 1V/div, Red trace = 100 mV/div, Time base = 20
ms/div ms/div
TA= 30°C LMT01 Pulse Count = 1286 TA=30°C LMT01 Pulse Count = 1282
VP-VN = 3.3 V Rise Time = 1 ms VP-VN=3.3 V Rise Time = 100 ms

Figure 36. Output Pulse Count With Appropriate Power Figure 37. Output Pulse Count With Slow Power Supply
Supply Rise Time Rise Time

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10 Layout

10.1 Layout Guidelines

The LMT01 can be mounted to a PCB as shown in Figure 38 and Figure 39. Take care to make the traces
leading to the pads as small as possible to minimize their effect on the temperature the LMT01 is measuring.

10.2 Layout Example

VP

VN
Figure 38. Layout Example (TO92S/LPG Package)

VN

VP
Figure 39. Layout Example for the DQX (WSON) Package

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11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

24 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated

Product Folder Links: LMT01

 PACKAGE OPTION ADDENDUM

www.ti.com 28-Apr-2017

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

LMT01DQXR ACTIVE WSON DQX 2 3000 Green (RoHS CU Level-1-260C-UNLIM -50 to 150 13N
& no Sb/Br)
LMT01DQXT ACTIVE WSON DQX 2 250 Green (RoHS CU Level-1-260C-UNLIM -50 to 150 13N
& no Sb/Br)
LMT01LPG ACTIVE TO-92 LPG 2 1000 Green (RoHS CU SN N / A for Pkg Type -50 to 150 LMT01
& no Sb/Br)
LMT01LPGM ACTIVE TO-92 LPG 2 3000 Green (RoHS CU SN N / A for Pkg Type -50 to 150 LMT01
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 28-Apr-2017

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LMT01 :

• Automotive: LMT01-Q1

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 2
 PACKAGE OUTLINE
LPG0002A SCALE 1.300
TO-92 - 5.05 mm max height
TO-92

4.1
3.9

3.25
3.05 0.51
3X
0.40 5.05
MAX
1 2
2.3 2 MAX
2.0

6X 0.076 MAX

2X
15.5
15.1

0.48 0.51
3X 3X
0.33 0.33
2X 1.27 0.05
2.64
2.44

2.68
2.28
1.62
2X (45° ) 1.42

1 2
(0.55) 0.86
0.66
4221971/A 03/2015

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.

www.ti.com
 EXAMPLE BOARD LAYOUT
LPG0002A TO-92 - 5.05 mm max height
TO-92

0.05 MAX (1.07) METAL

ALL AROUND TYP 3X ( 0.75) VIA
TYP

(1.7) (1.7)

1 2
(R0.05) TYP (1.07)
(1.27)
SOLDER MASK
OPENING (2.54)
TYP

LAND PATTERN EXAMPLE

NON-SOLDER MASK DEFINED
SCALE:20X

4221971/A 03/2015

www.ti.com
 PACKAGE OUTLINE
DQX0002A SCALE 5.200
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

1.75 B
A
1.65

PIN 1 INDEX AREA

2.55
2.45

C
0.8 MAX

SEATING PLANE

0.05
0.00 (0.2) TYP
(0.45)
0.3
4X 2X (0.1) MIN
0.2
2

2X (0.05)
(0.15)

SYMM

PIN 1 ID
(45 X0.2)

1.1
0.9

1
SYMM (0.2) TYP
0.8
0.6
0.1 C A B

4222491/C 01/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M
2. This drawing is subject to change without notice.

www.ti.com
 EXAMPLE BOARD LAYOUT
DQX0002A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

(0.7) 0.05 MIN

ALL AROUND
SYMM
METAL UNDER
SOLDER MASK SOLDER MASK
TYP OPENING
TYP

EXPOSED METAL
1
TYP

(1.2)

SYMM
(1.7)

(1.25)
2

(0.25)

(R0.05) TYP (0.35)

( 0.2) VIA TYP 4X (0.25)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:30X

4222491/C 01/2017

NOTES: (continued)

3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view.
It is recommended that vias under paste be filled, plugged or tented.

www.ti.com
 EXAMPLE STENCIL DESIGN
DQX0002A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

METAL UNDER (0.225) TYP

SOLDER MASK
TYP 1

SOLDER MASK EDGE

TYP

(1.225)
TYP
2X (0.6)

(0.55)
2X (0.7) SYMM

METAL UNDER
SOLDER MASK
(0.15) TYP

4X (0.45)

(R0.05) TYP 2
4X (0.25)

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

81% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:30X

4222491/C 01/2017
NOTES: (continued)

5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

www.ti.com
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circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
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Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
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TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
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Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
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third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
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INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
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DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
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Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.

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