CP375

N-Channel MOSFET Die

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Enhancement-Mode
The CP375 medium power N-Channel MOSFET is designed for power management and load
switching applications. The 7.5 mil thick die provides an ultra low profile device that is readily
attached using standard die attach wire bond processes.

APPLICATIONS: FEATURES:
• Load switching • Low on-resistance, rDS(ON)
• Power management • Low gate charge, Qgs
• DC-DC conversion • High drain current density

MECHANICAL SPECIFICATIONS:
Die Size 62 x 38 MILS
Die Thickness 7.5 MILS
Gate Bonding Pad Area 13.7 x 18.8 MILS
Source Bonding Pad Area 30 x 55 MILS
Top Side Metalization Al - 40,000Å
Back Side Metalization Ti/Ni/Ag - 1,000Å/3,000Å/10,000Å
Scribe Alley Width 3.15 MILS
Wafer Diameter 8 INCHES
Gross Die Per Wafer 18,700

MAXIMUM RATINGS: (TA=25°C) SYMBOL UNITS

Drain-Source Voltage VDS 30 V
Gate-Source Voltage VGS 20 V
Continuous Drain Current (Steady State) ID 11 A
Maximum Pulsed Drain Current, tp=10μs IDM 50 A
Operating and Storage Junction Temperature TJ, Tstg -55 to +150 °C

ELECTRICAL CHARACTERISTICS: (TA=25°C unless otherwise noted)

SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
IGSSF, IGSSR VGS=20V, VDS=0 100 nA
IDSS VDS=30V, VGS=0 1.0 μA
BVDSS VGS=0, ID=250μA 30 V
VGS(th) VGS=VDS, ID=250μA 1.0 1.8 3.0 V
VSD VGS=0, IS=2.6A 1.2 V
rDS(ON) VGS=10V, ID=11A 14 20 mΩ
rDS(ON) VGS=4.5V, ID=9.0A 18 30 mΩ
Crss VDS=15V, VGS=0, f=1.0MHz 100 pF
Ciss VDS=15V, VGS=0, f=1.0MHz 860 pF
Coss VDS=15V, VGS=0, f=1.0MHz 120 pF
R0 (13-August 2013)
CP375
N-Channel MOSFET Die
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Enhancement-Mode

ELECTRICAL CHARACTERISTICS - Continued: (TA=25°C unless otherwise noted)

SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Qg(tot) VDD=15V, VGS=5.0V, ID=10A 6.3 nC
Qgs VDD=15V, VGS=5.0V, ID=10A 2.0 nC
Qgd VDD=15V, VGS=5.0V, ID=10A 2.3 nC
ton VDD=15V, VGS=5.0V, ID=10A 20 ns
toff RG=0.3Ω, RL=15Ω 43 ns

R0 (13-August 2013)
CP375
Typical Electrical Characteristics
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R0 (13-August 2013)
BARE DIE PACKING OPTIONS

BARE DIE IN TRAY (WAFFLE) PACK

CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)

CM: S
 ingulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)

UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)

SAWN WAFER ON PLASTIC RING

WR: F
 ull wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)

Please note: Sawn Wafer on Metal Frame (WS)

is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.

Visit the Central website for a complete listing of specifications:

www.centralsemi.com/bdspecs

R2 (3-April 2017)
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OUTSTANDING SUPPORT AND SUPERIOR SERVICES

PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals) • Custom bar coding for shipments
• Inventory bonding • Custom product packing
• Consolidated shipping options

DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air) • Special wafer diffusions
• Online technical data and parametric search • PbSn plating options
• SPICE models • Package details
• Custom electrical curves • Application notes
• Environmental regulation compliance • Application and design sample kits
• Customer specific screening • Custom product and package development
• Up-screening capabilities

REQUESTING PRODUCT PLATING

1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).

CONTACT US

Corporate Headquarters & Customer Support Team

Central Semiconductor Corp.

145 Adams Avenue Worldwide Field Representatives:
Hauppauge, NY 11788 USA www.centralsemi.com/wwreps
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824 Worldwide Distributors:
Support Team Fax: (631) 435-3388 www.centralsemi.com/wwdistributors
www.centralsemi.com

For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms

w w w. c e n t r a l s e m i . c o m (001)
 PDN01158
2/25/21
8/25/21
http://www.centralsemi.com 2/25/22

Summary:The CP375 wafer process is being discontinued and is now classified as End of Life (EOL). Replacement wafer
process CP406 was previously announced in PCN190, June 19, 2020.

Although Central Semiconductor Corp. makes every effort to continue to produce devices that have been proclaimed EOL (End of Life) by
other manufacturers, it is an accepted industry practice to discontinue certain devices when customer demand falls below a minimum level of
sustainability. Accordingly, the following product(s) have been transitioned to End of Life status as part of Central's ongoing Product
Management Process. Any replacement products are noted below. The effective date for placing last purchase orders will be six (6) months
from the date of this notice and twelve (12) months from the notice date for final shipments, and minimum order quantities may apply.
The last purchase and shipment dates may be extended if inventory is available.

* All Plating types (PBFREE,TIN/LEAD) for each item listed are included in this notice.

Central Part Number Replacement

CP375-CWDM3011N-CT CP406-CWDM3011N-CT
CP375-CWDM3011N-WN CP406-CWDM3011N-WN

Central would be happy to assist you by providing additional information or technical data to help locate an alternate source if we
have no replacement available. Please email your requests to engineering@centralsemi.com.