Lamsnduhe 5783
Lamsnduhe 5783
Three-Supply Monitoring
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TL7702A, TL7705A, TL7709A, TL7712A, TL7715A
SLVS028K – APRIL 1983 – REVISED SEPTEMBER 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.4 Device Functional Modes.......................................... 9
2 Applications ........................................................... 1 9 Application and Implementation ........................ 10
3 Description ............................................................. 1 9.1 Application Information............................................ 10
4 Revision History..................................................... 2 9.2 Typical Application .................................................. 10
9.3 System Examples ................................................... 12
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 10 Power Supply Recommendations ..................... 14
6.1 Absolute Maximum Ratings ...................................... 4 11 Layout................................................................... 14
6.2 ESD Ratings.............................................................. 4 11.1 Layout Guidelines ................................................. 14
6.3 Recommended Operating Conditions....................... 4 11.2 Layout Example .................................................... 14
6.4 Thermal Information .................................................. 5 12 Device and Documentation Support ................. 15
6.5 Electrical Characteristics........................................... 5 12.1 Related Links ........................................................ 15
6.6 Switching Characteristics .......................................... 5 12.2 Receiving Notification of Documentation Updates 15
6.7 Typical Characteristics .............................................. 6 12.3 Community Resources.......................................... 15
7 Parameter Measurement Information .................. 7 12.4 Trademarks ........................................................... 15
12.5 Electrostatic Discharge Caution ............................ 15
8 Detailed Description .............................................. 8
12.6 Glossary ................................................................ 15
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8 13 Mechanical, Packaging, and Orderable
8.3 Feature Description................................................... 9
Information ........................................................... 15
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
• Deleted Ordering Information table. ....................................................................................................................................... 1
REF 1 8 VCC
RESIN 2 7 SENSE
CT 3 6 RESET
GND 4 5 RESET
Not to scale
Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
CT 3 I/O External timing-capacitor pin
GND 4 — Device ground
REF 1 O Voltage reference output
RESET 6 O Supervisor reset signal output
RESET 5 O Supervisor reset signal output (inverted)
RESIN 2 I Reset input
SENSE 7 I Sense input
VCC 8 — Power Supply
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage (2) 20 V
VI Input voltage, RESIN –0.3 20 V
TL7702A (3) –0.3 6 V
TL7705A –0.3 20 V
VI Input voltage range SENSE
TL7709A –0.3 20 V
TL7712A, TL7715A –0.3 20 V
IOH High-level output current, IOH, RESET –30 mA
IOL Low-level output current, IOL, RESET 30 mA
TJ Operating virtual junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For proper operation of the TL7702A, the voltage applied to the SENSE terminal should not exceed VCC − 1 V or 6 V, whichever is less
(3) All voltage values are with respect to GND.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For proper operation of the TL7702A, the voltage applied to the SENSE terminal should not exceed VCC − 1 V or 6 V, whichever is less.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(1) All electrical characteristics are measured with 0.1-µF capacitors connected at REF, CT, and VCC to GND.
(1) All switching characteristics are measured with 0.1-µF capacitors connected at REF and VCC to GND.
(2) The rise and fall times are measured with a 4.7-kΩ load resistor at RESET and RESET.
Threshold Voltage
VCC ~ 3.6 V
VCC ~ 2 V
RESET td
td
Output
Undefined Output
Undefined
Figure 2. Assertion Time vs Load Resistance Figure 3. Deassertion Time vs Load Resistance
Figure 4. Assertion Time vs Load Capacitance Figure 5. De-assertion Time vs Load Capacitance
8 Detailed Description
8.1 Overview
The TL77xxA family of integrated-circuit supply-voltage supervisors is designed specifically for use as reset
controllers in microcomputer and microprocessor systems. The supply-voltage supervisor monitors the supply for
undervoltage conditions at the SENSE input. During power up, the RESET output becomes active (low) when
VCC attains a value approaching 3.6 V. At this point (assuming that SENSE is above VIT+), the delay timer
function activates a time delay, after which outputs RESET and RESET go inactive (high and low, respectively).
When an undervoltage condition occurs during normal operation, RESET and RESET go active. To ensure that a
complete reset occurs, the reset outputs remain active for a time delay after the voltage at the SENSE input
exceeds the positive-going threshold value.
During power down and when SENSE is below VIT−, the outputs remain active until VCC falls below 2 V. After
this, the outputs are undefined. An external capacitor (typically 0.1 μF) must be connected to REF to reduce the
influence of fast transients in the supply voltage.
Five versions of this circuit are available:
• TL7705A (Vt = 4.55 V): Application in TTL-systems and microcomputer systems which require a 5 volt supply
(for example, TMS7000)
• TL7709A (Vt = 7.6 V): Application in microcomputer systems using the TMS1XXXNLL
• TL7712A (Vt = 10.8 V): Application in CMOS, microprocessor, and memory circuits with a 12 volt supply.
• TL7715A (Vt = 13.5 V): Application in circuits which operate with a supply voltage of 15 V, as is found often in
analog circuits.
• TL7702A (Vt = 2.5 V): Application in systems where other supply voltages are used. The required trigger level
my be adjusted with an external resistor divider at the SENSE input.
~100 µA
A. TL7702A: R1 = 0 Ω, R2 = open
TL7705A: R1 = 7.8 kΩ, R2 = 10 kΩ
TL7709A: R1 = 19.7 kΩ, R2 = 10 kΩ
TL7712A: R1 = 32.7 kΩ, R2 = 10 kΩ
TL7715A: R1 = 43.4 kΩ, R2 = 10 kΩ
B. Resistor values shown are nominal.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
µC
=
5 5
4.5 4.5
4 4
3.5 3.5
3 3
2.5 2.5
2 2
1.5 1.5
1 1
0.5 0.5
0 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VCC (V) D005
VCC (V) D006
Figure 9. Supervisor RESET Output Voltage vs VCC Figure 10. Supervisor RESET Output Voltage vs VCC
5 5
4.5 4.5
4 4
RESET Voltage (V)
RESET Voltage (V)
3.5 3.5
3 3
2.5 2.5
2 2
1.5 1.5
1 1
0.5 0.5
0 0
4.5 4.52 4.54 4.56 4.58 4.6 4.5 4.52 4.54 4.56 4.58 4.6
VCC (V) D007
VCC (V) D008
Figure 11. Supervisor RESET Output Voltage vs VCC at Figure 12. Supervisor RESET Output Voltage vs VCC at
Transition Transition
CAUTION
These devices risk being damaged when powered by more than 20 V.
11 Layout
1 8
2 7
3 6
4 5
Figure 16. Printed Circuit Layout for the Supply Voltage Supervisor
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 30-Jun-2025
PACKAGING INFORMATION
Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)
TL7702ACD Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7702AC
TL7702ACD.A Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7702AC
TL7702ACDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7702AC
TL7702ACDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7702AC
TL7702ACP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 TL7702ACP
TL7702ACP.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 TL7702ACP
TL7702AID Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 85 7702AI
TL7702AID.A Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 85 7702AI
TL7702AIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 7702AI
TL7702AIDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 7702AI
TL7702AIP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 TL7702AIP
TL7702AIP.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 TL7702AIP
TL7705ACD Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7705AC
TL7705ACD.A Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7705AC
TL7705ACDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7705AC
TL7705ACDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7705AC
TL7705ACP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 TL7705ACP
TL7705ACP.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 TL7705ACP
TL7705ACPSR Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 T7705A
TL7705ACPSR.A Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 T7705A
TL7705AID Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 85 7705AI
TL7705AID.A Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 85 7705AI
TL7705AIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 7705AI
TL7705AIDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 7705AI
TL7705AIP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 TL7705AIP
TL7705AIP.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 TL7705AIP
TL7709ACD Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7709AC
TL7709ACD.A Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7709AC
TL7709ACDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7709AC
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 30-Jun-2025
Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)
TL7709ACDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7709AC
TL7709ACP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 TL7709ACP
TL7709ACP.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 TL7709ACP
TL7712ACD Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7712AC
TL7712ACD.A Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7712AC
TL7712ACDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7712AC
TL7712ACDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7712AC
TL7712ACP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 TL7712ACP
TL7712ACP.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 TL7712ACP
TL7712AIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM - 7712AI
TL7712AIDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7712AI
TL7715ACD Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7715AC
TL7715ACD.A Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 7715AC
TL7715ACP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 TL7715ACP
TL7715ACP.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 TL7715ACP
(1)
Status: For more details on status, see our product life cycle.
(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.
(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 30-Jun-2025
Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.
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makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
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and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Jul-2025
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Jul-2025
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Jul-2025
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Jul-2025
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
TL7715ACP.A P PDIP 8 50 506 13.97 11230 4.32
Pack Materials-Page 4
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
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EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
4214825/C 02/2019
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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