S T M9435
S amHop Microelectronics C orp.
P reliminary May.21,2004
P -C hannel E nhancement Mode Field E ffect Transistor
P R ODUC T S UMMAR Y
V DS S
-30V
F E AT UR E S
( m W ) Max
ID
-4.8A
R DS (ON)
S uper high dense cell design for low R DS (ON ).
55 @ V G S = -10V 85 @ V G S = -4.5V
R ugged and reliable. S urface Mount P ackage.
D
8
D
7
D
6
D
5
S O-8 1
1 2 3 4
ABS OLUTE MAXIMUM R ATINGS (T A=25 C unless otherwise noted)
P arameter Drain-S ource Voltage Gate-S ource Voltage Drain C urrent-C ontinuous a @ T J =125 C b -P ulsed Drain-S ource Diode Forward C urrent a Maximum P ower Dissipation a Operating Junction and S torage Temperature R ange S ymbol V DS V GS ID IDM IS PD T J , T S TG Limit - 30 20 - 4.8 - 24 -1.7 2.5 -55 to 150 Unit V V A A A W C
THE R MAL C HAR AC TE R IS TIC S
Thermal R esistance, Junction-to-Ambient a R JA 50 C /W
S T M9435
E LE CTR ICAL CHAR ACTE R IS TICS (T A =25 C unless otherwise noted)
Parameter
5
S ymbol
BV DS S IDS S IGS S V GS (th) R DS (ON) ID(ON) gFS
c
Condition
V GS = 0V, ID = -250uA V DS = -24V, V GS = 0V V GS = 20V, V DS = 0V V DS = V GS , ID = -250uA V GS = -10V, ID =-5.3A V GS = -4.5V, ID = -4.2A V DS = -5V, V GS = -10V V DS = -5V, ID = - 5.3A
Min Typ C Max Unit
-30 -1 100 -1 -1.5 -2.5 45 75 -20 5 582 125 86 55 V uA nA V
m-ohm
OFF CHAR ACTE R IS TICS
Drain-S ource Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage
ON CHAR ACTE R IS TICS b
Gate Threshold Voltage Drain-S ource On-S tate R esistance On-S tate Drain Current Forward Transconductance
85 m-ohm A S
PF PF PF
DYNAMIC CHAR ACTE R IS TICS
Input Capacitance Output Capacitance R everse Transfer Capacitance
C IS S C OS S CRSS
c
V DS =-15V, V GS = 0V f =1.0MH Z
S WITCHING CHAR ACTE R IS TICS
Turn-On Delay Time R ise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-S ource Charge Gate-Drain Charge
tD(ON) tr tD(OFF) tf Qg Q gs Q gd
2
V D = -15V ID = -1A V GE N = - 10V R GE N = 6 ohm R L = 15 ohm V DS =-15V,ID =-5.3A,V GS =-10V V DS =-15V,ID =-5.3A,V GS =-4.5V V DS =-15V, ID = -5.3A V GS =-10V
9 10 37 23 11.7 5.7 2.1 2.9
ns ns ns ns nC nC nC nC
S T M9435
E LE CTR ICAL CHAR ACTE R IS TICS (T A=25 C unless otherwise noted)
Parameter
Diode Forward Voltage
S ymbol
VSD
Condition
V GS = 0V, Is =-1.7A
Min Typ C Max Unit
-0.84 -1.2 V
DR AIN-S OUR CE DIODE CHAR ACTE R IS TICS b
Notes a.Surface Mounted on FR 4 Board, t <=10sec. b.Pulse Test:Pulse Width<=300us, Duty Cycle<= 2%. c.Guaranteed by design, not subject to production testing.
25
-V G S =10,9,8,7,6,5V
25 125 C
20
20
-I D , Drain C urrent (A)
-I D , Drain C urrent (A)
15
15
25 C
-55 C
10 5 0
-V G S =3.5V
10
5 0
10
12
0.8
1.6
2.4
3.2
4.0
4.8
-V DS , Drain-to-S ource Voltage (V )
-V G S , G ate-to-S ource Voltage (V )
F igure 1. Output C haracteris tics
R DS (ON) , On-R es is tance(Ohms ) (Normalized)
900 750 1.8 1.6 1.4 1.2 1.0 0.8
F igure 2. Trans fer C haracteris tics
V G S =-10V I D =-5.3A
C , C apacitance (pF )
600 450 300 150 0
C is s
C os s C rs s 0 5 10 15 20 25 30
0.6 -55
-25
25
50
75
100
125
-V DS , Drain-to S ource Voltage (V )
T j, J unction T emperature ( C )
F igure 3. C apacitance
F igure 4. On-R es is tance Variation with Temperature
S T M9435
B V DS S , Normalized Drain-S ource B reakdown V oltage V th, Normalized G ate-S ource T hres hold V oltage
1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 -25 0 25 50 75 100 125 V DS =V G S I D =-250uA 1.15 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 I D =-250uA
T j, J unction T emperature ( C )
T j, J unction T emperature ( C )
F igure 5. G ate T hres hold V ariation with T emperature
10
F igure 6. B reakdown V oltage V ariation with T emperature
20.0 V G S =0V
gF S , T rans conductance (S )
-Is , S ource-drain current (A)
20
8 6 4 2 V DS =-15V 0 0 5 10 15
10.0
1.0 0.4 0.6 0.7 0.9 1.1 1.3
-I DS , Drain-S ource C urrent (A)
-V S D , B ody Diode F orward V oltage (V )
F igure 7. T rans conductance V ariation with Drain C urrent
10
-V G S , G ate to S ource V oltage (V ) -I D , Drain C urrent (A)
F igure 8. B ody Diode F orward V oltage V ariation with S ource C urrent
50
8 6 4 2 0 0
V DS =-15V I D =-5.3A
10
RD
S
) ON
L im
it
10
10
1s
DC
ms
0m
0.1 0.03
V G S =-10V S ingle P ulse T A =25 C 0.1 1 10 30 50
10
12
14
16
Qg, T otal G ate C harge (nC )
-V DS , Drain-S ource V oltage (V )
F igure 9. G ate C harge 4
F igure 10. Maximum S afe O perating Area
S T M9435
-V DD ton V IN D VG S R GE N G
90%
toff tr
90%
RL V OUT
td(on) V OUT
td(off)
90% 10%
tf
10%
V IN
50% 10%
50%
INVE R TE D P ULS E WIDTH
F igure 11. S witching T es t C ircuit
F igure 12. S witching Waveforms
r(t),Normalized E ffective T ransient T hermal Impedance
1 Duty C ycle=0.5
0.2 0.1 0.1 0.05 0.02 S ingle P uls e 0.01 10
-4
P DM t1 1. 2. 3. 4. 10
-2
t2
R thJ A (t)=r (t) * R thJ A R thJ A =S ee Datas heet T J M-T A = P DM* R thJ A (t) Duty C ycle, D=t1/t2 10 100
10
-3
10
-1
S quare Wave P uls e Duration (s ec)
F igure 13. Normalized T hermal T rans ient Impedance C urve
S T M9435
PAC K AG E OUT LINE DIME NS IONS S O-8
1 L
E D
0.015X45
e
0.05 TYP.
0.016 TYP.
A1
0.008 TYP.
S Y MB OLS A A1 D E H L
MILLIME T E R S MIN 1.35 0.10 4.80 3.81 5.79 0.41 0 MAX 1.75 0.25 4.98 3.99 6.20 1.27 8 MIN 0.053 0.004 0.189 0.150 0.228 0.016 0
INC HE S MAX 0.069 0.010 0.196 0.157 0.244 0.050 8
S T M9435
SO-8 Tape and Reel Data
SO-8 Carrier Tape
unit:
PACKAGE SOP 8N 150 A0
6.40
B0
5.20
K0
2.10
D0
1.5 (MIN)
D1
1.5 + 0.1 - 0.0
E
12.0 0.3
E1
1.75
E2
5.5 0.05
P0
8.0
P1
4.0
P2
2.0 0.05
T
0.3 0.05
SO-8 Reel
UNIT:
TAPE SIZE
12
REEL SIZE
330
M
330 1
N
62 1.5
W
12.4 + 0.2
W1
16.8 - 0.4
H
12.75 + 0.15
S
2.0 0.15
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