Linear LT1613
Linear LT1613
U
TYPICAL APPLICATIO
L1
D1
Efficiency Curve
4.7µH
VIN VOUT 100
3.3V 5V
95
200mA
VIN SW R1
90 VIN = 4.2V
37.4k
+ C1 + C2 85
15µF LT1613 22µF
EFFICIENCY (%)
80
SHDN SHDN FB VIN = 3.5V
75
GND R2 VIN = 2.8V
12.1k 70
65
L1: MURATA LQH3C4R7M24 OR SUMIDA CD43-4R7 VIN = 1.5V
60
C1: AVX TAJA156M010
C2: AVX TAJB226M006 1613 TA01 55
D1: MBR0520
50
0 50 100 150 200 250 300 350 400
Figure 1. 3.3V to 5V 200mA DC/DC Converter
LOAD CURRENT (mA)
1613 TA01a
1
LT1613
W W W U U W U
ABSOLUTE MAXIMUM RATINGS PACKAGE/ORDER INFORMATION
(Note 1)
VIN Voltage .............................................................. 10V ORDER PART NUMBER
SW Voltage ................................................– 0.4V to 36V LT1613CS5
TOP VIEW
FB Voltage ..................................................... VIN + 0.3V
Current into FB Pin ............................................... ±1mA SW 1 5 VIN
ELECTRICAL CHARACTERISTICS The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. Commercial grade 0°C to 70°C, VIN = 1.5V, VSHDN = VIN unless
otherwise noted. (Note 2)
Note 1: Absolute Maximum Ratings are those values beyond which the life Note 2: The LT1613C is guaranteed to meet performance specifications
of a device may be impaired. from 0°C to 70°C. Specifications over the – 40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 3: Current limit guaranteed by design and/or correlation to static test.
2
LT1613
U W
TYPICAL PERFOR A CE CHARACTERISTICS
Oscillator Frequency vs
Switch VCESAT vs Switch Current Temperature SHDN Pin Current vs VSHDN
700 2.00 50
TA = 25°C TA = 25°C
600 1.75 VIN = 5V
30
400
1.00
300
0.75 20
200
0.50
10
100 0.25
0 0 0
0 100 200 300 400 500 600 700 –50 –25 0 25 50 75 100 0 1 2 3 4 5
SWITCH CURRENT (mA) TEMPERATURE (°C) SHDN PIN VOLTAGE (V)
1613 G01 1613 G02 1613 G03
900
1.24
FEEDBACK PIN VOLTAGE (V)
800
CURRENT LIMIT (mA)
70°C VOLTAGE
700
1.23
600 25°C
500 1.22
–40°C
400
1.21
300
200 1.20
10 20 30 40 50 60 70 80 –50 –25 0 25 50 75 100
DUTY CYCLE (%) TEMPERATURE (°C)
1613 G04 1613 G05
VOUT
100mV/DIV
AC COUPLED
VSW
5V/DIV
ISW
200mA/DIV
3
LT1613
U U U
PIN FUNCTIONS
SW (Pin 1): Switch Pin. Connect inductor/diode here. SHDN (Pin 4): Shutdown Pin. Tie to 1V or more to enable
Minimize trace area at this pin to keep EMI down. device. Ground to shut down.
GND (Pin 2): Ground. Tie directly to local ground plane. VIN (Pin 5): Input Supply Pin. Must be locally bypassed.
FB (Pin 3): Feedback Pin. Reference voltage is 1.23V.
Connect resistive divider tap here. Minimize trace area at
FB. Set VOUT according to VOUT = 1.23V(1 + R1/R2).
W
BLOCK DIAGRAM
VIN 5 VIN
R5 R6
40k 40k
VOUT 1 SW
+ COMPARATOR
R1 A1 –
(EXTERNAL) gm DRIVER
FF
– A2 R Q Q3
FB RC + S
FB 3
Q1 Q2
RAMP
GENERATOR Σ
x10
CC +
R2 R3 0.15Ω
(EXTERNAL) 30k
1.4MHz –
OSCILLATOR
R4
140k
SHDN
4 SHUTDOWN 2 GND
1613 • BD
U
OPERATIO
The LT1613 is a current mode, internally compensated, subharmonic oscillations at duty factors greater than
fixed frequency step-up switching regulator. Operation 50%) exceeds the VC signal, comparator A2 changes
can be best understood by referring to the Block Diagram. state, resetting the flip flop and turning off the switch.
Q1 and Q2 form a bandgap reference core whose loop is More power is delivered to the output as switch current is
closed around the output of the regulator. The voltage increased. The output voltage, attenuated by external
drop across R5 and R6 is low enough such that Q1 and Q2 resistor divider R1 and R2, appears at the FB pin, closing
do not saturate, even when VIN is 1V. When there is no the overall loop. Frequency compensation is provided
load, FB rises slightly above 1.23V, causing VC (the error internally by RC and CC. Transient response can be opti-
amplifier’s output) to decrease. Comparator A2’s output mized by the addition of a phase lead capacitor CPL in
stays high, keeping switch Q3 in the off state. As increased parallel with R1 in applications where large value or low
output loading causes the FB voltage to decrease, A1’s ESR output capacitors are used.
output increases. Switch current is regulated directly on a As the load current is decreased, the switch turns on for a
cycle-by-cycle basis by the VC node. The flip flop is set at shorter period each cycle. If the load current is further
the beginning of each switch cycle, turning on the switch. decreased, the converter will skip cycles to maintain
When the summation of a signal representing switch output voltage regulation.
current and a ramp generator (introduced to avoid
4
LT1613
U
OPERATIO
LAYOUT L1A
C3
1µF
VIN 22µH
4V TO
The LT1613 switches current at high speed, mandating 7V
PCB layout. Note the direct path of the switching loops. C1, C2: AVX TAJA156M016
Input capacitor C1 must be placed close (< 5mm) to the IC C3: TAIYO YUDEN JMK325BJ226MM
D1: MOTOROLA MBR0520
package. As little as 10mm of wire or PC trace from CIN to L1, L2: MURATA LQH3C220 1613 F03
VIN will cause problems such as inability to regulate or Figure 3. Single-Ended Primary Inductance Converter (SEPIC)
oscillation. Generates 5V from An Input Voltage Above or Below 5V
C3
A SEPIC (single-ended primary inductance converter) +
1 5
schematic is shown in Figure 3. This converter topology C2
GROUND R1
L1 + 1613 F04
C1 VIN
VOUT D1
Figure 4. Recommended Component Placement for SEPIC
+
C2 1 5
COMPONENT SELECTION
2
3 4 SHUTDOWN
Inductors
VIAS TO
GROUND
PLANE
Inductors used with the LT1613 should have a saturation
R2
current rating (where inductance is approximately 70% of
zero current inductance) of approximately 0.5A or greater.
R1
GROUND
1613 F02
DCR of the inductors should be 0.5Ω or less. For boost
converters, inductance should be 4.7µH for input voltage
Figure 2. Recommended Component Placement for Boost less than 3.3V and 10µH for inputs above 3.3V. When
Converter. Note Direct High Current Paths Using Wide PCB
Traces. Minimize Area at Pin 3 (FB). Use Vias to Tie Local using the device as a SEPIC, either a coupled inductor or
Ground Into System Ground Plane. Use Vias at Location Shown two separate inductors can be used. If using separate
to Avoid Introducing Switching Currents Into Ground Plane inductors, 22µH units are recommended for input voltage
above 3.3V. Coupled inductors have a beneficial mutual
inductance, so a 10µH coupled inductor results in the
same ripple current as two 20µH uncoupled units.
5
LT1613
U
OPERATIO
Table 1 lists several inductors that will work with the lower ESR will result in lower output ripple.
LT1613, although this is not an exhaustive list. There are
Ceramic capacitors can be used with the LT1613 provided
many magnetics vendors whose components are suitable
loop stability is considered. A tantalum capacitor has
for use.
some ESR and this causes an “ESR zero” in the regulator
Diodes loop. This zero is beneficial to loop stability. The internally
compensated LT1613 does not have an accessible com-
A Schottky diode is recommended for use with the LT1613. pensation node, but other circuit techniques can be em-
The Motorola MBR0520 is a very good choice. Where the ployed to counteract the loss of the ESR zero, as detailed
input to output voltage differential exceeds 20V, use the in the next section.
MBR0530 (a 30V diode). If cost is more important than
efficiency, the 1N4148 can be used, but only at low current Some capacitor types appropriate for use with the LT1613
loads. are listed in Table 2.
6
LT1613
U
OPERATIO
effect on loop stability, as long as minimum capacitance resulting in a severely underdamped response. By adding
requirements are met). The transient response to a load R3 and CPL as detailed in Figure 8’s schematic, phase
step of 50mA to 100mA is pictured in Figure 6. Note the margin is restored, and transient response to the same
“double trace,” due to the ESR of C2. The loop is stable and load step is pictured in Figure 9. R3 isolates the device FB
settles in less than 100µs. In Figure 7, C2 is replaced by a pin from fast edges on the VOUT node due to parasitic PC
10µF ceramic unit. Phase margin decreases drastically, trace inductance.
L1 Figure 10’s circuit details a 5V to 12V boost converter,
D1
VIN
10µH
VOUT delivering up to 130mA. The transient response to a load
2.5V 5V step of 10mA to 130mA, without CPL, is pictured in
+ C1 VIN SW R1 Figure␣ 11. Although the ringing is less than that of the
15µF 37.4k
+ previous example, the response is still underdamped and
LT1613 C2
22µF can be improved. After adding R3 and CPL, the improved
SHDN SHDN FB
GND
transient response is detailed in Figure 12.
R2
12.1k
Figure 13 shows a SEPIC design, converting a 3V to 10V
C1: AVX TAJA156M010R input to a 5V output. The transient response to a load step
C2: AVX TAJA226M006R
D1: MOTOROLA MBR0520
of 20mA to 120mA, without CPL and R3, is pictured in
L1: MURATA LQH3C100 1613 F05
Figure␣ 14. After adding these two components, the im-
Figure 5. 2.5V to 5V Boost Converter with “A” proved response is shown in Figure 15.
Case Size Tantalum Input and Output Capacitors
L1
10µH D1
VIN VOUT
2.5V 5V
CPL
+ C1 VIN SW 330pF
VOUT 15µF
R1
20mV/DIV LT1613 R3 C2
37.4k
AC COUPLED 10k 10µF
SHUTDOWN SHDN FB
GND R2
12.1k
100mA
LOAD CURRENT
50mA C1: AVX TAJA156M010R
200µs/DIV 1613 F06
C2: TAIYO YUDEN LMK325BJ106MN
D1: MBR0520
L1: MURATA LQH3C100K04 1613 F08
Figure 6. 2.5V to 5V Boost Converter Transient
Response with 22µF Tantalum Output Capacitor. Figure 8. 2.5V to 5V Boost Converter with Ceramic
Apparent Double Trace on VOUT Is Due to Switching Output Capacitor. CPL Added to Increase Phase Margin,
Frequency Ripple Current Across Capacitor ESR R3 Isolates FB Pin from Fast Edges
VOUT VOUT
20mV/DIV 20mV/DIV
AC COUPLED AC COUPLED
100mA 100mA
LOAD CURRENT LOAD CURRENT
50mA 50mA
200µs/DIV 1613 F07 200µs/DIV 1613 F09
Figure 7. 2.5V to 5V Boost Converter with Figure 9. 2.5V to 5V Boost Converter with 10µF Ceramic
10µF Ceramic Output Capacitor, No CPL Output Capacitor, 330pF CPL and 10k in Series with FB Pin
7
LT1613
U
OPERATIO
L1 C3
D1 L1
10µH VOUT 1µF
VIN VIN 22µH
12V
5V 3V TO
130mA
CPL 10V
+ C1 VIN SW 200pF +
L2 CPL D1
C1 VIN SW 22µH 330pF
22µF 22µF
R1
LT1613 R3 C2
107k LT1613 R3
10k 4.7µF 10k
SHUTDOWN SHDN FB VOUT
SHUTDOWN SHDN FB
GND 5V
R2 GND R1
R2 C2
12.3k 37.4k
12.1k 10µF
VOUT VOUT
100mV/DIV 50mV/DIV
AC COUPLED AC COUPLED
130mA 120mA
LOAD CURRENT LOAD CURRENT
10mA 20mA
200µs/DIV 1613 F11 200µs/DIV 1613 F14
Figure 11. 5V to 12V Boost Converter Figure 14. 5V Output SEPIC with 10µF
with 4.7µF Ceramic Output Capacitor Ceramic Output Capacitor. No CPL. VIN = 4V
VOUT VOUT
100mV/DIV 50mV/DIV
AC COUPLED AC COUPLED
130mA 120mA
LOAD CURRENT LOAD CURRENT
10mA 20mA
200µs/DIV 1613 F12 200µs/DIV 1613 F15
Figure 12. 5V to 12V Boost Converter with 4.7µF Figure 15. 5V Output SEPIC with 10µF Ceramic Output
Ceramic Output Capacitor and 200pF Phase-Lead Capacitor, 330pF CPL and 10k in Series with FB Pin
Capacitor CPL and 10k in Series with FB Pin
8
LT1613
U
OPERATIO
START-UP/SOFT-START time required to reach final value increases to 1.7ms. In
Figure 19, CS is increased to 33nF. Input current does not
When the LT1613 SHDN pin voltage goes high, the device
exceed the steady-state current the device uses to supply
rapidly increases the switch current until internal current
power to the 50Ω load. Start-up time increases to 4.3ms.
limit is reached. Input current stays at this level until the
CS can be increased further for an even slower ramp, if
output capacitor is charged to final output voltage. Switch
desired.
current can exceed 1A. Figure 16’s oscillograph details
start-up waveforms of Figure 17’s SEPIC into a 50Ω load
without any soft-start. The output voltage reaches final VOUT
2V/DIV
value in approximately 200µs, while input current reaches
400mA. Switch current in a SEPIC is 2x the input current,
so the switch is conducting approximately 800mA peak. IIN
200mA/DIV
Soft-start reduces the inrush current by taking more time
to reach final output voltage. A soft-start circuit consisting VS
5V/DIV
of Q1, RS1, RS2 and CS1 as shown in Figure 17 can be used 500µs/DIV 1613 F18
to limit inrush current to a lower value. Figure 18 pictures Figure 18. Soft-Start Components in Figure 17’s SEPIC
VOUT and input current with RS2 of 33kΩ and CS of 10nF. Reduces Inrush Current. CSS = 10nF, RLOAD = 50Ω
Input current is limited to a peak value of 200mA as the
VOUT VOUT
2V/DIV 2V/DIV
IIN IIN
200mA/DIV 200mA/DIV
VSHDN VS
5V/DIV 5V/DIV
200µs/DIV 1613 F16 1ms/DIV 1613 F18
C3
L1
1µF
22µH
VIN
4V
C1 +
L2 CPL D1
22µF VIN SW 22µH 330pF
SOFT-START COMPONENTS
RS1 LT1613 R3
33k 10k
VOUT
VS SHDN FB
5V
Q1 GND R2 R1
2N3904 37.4k RLOAD
CS 12.1k
RS2 C2
10nF/ 33k
33nF 10µF
1613 F17
9
LT1613
U
TYPICAL APPLICATIO S
4-Cell to 5V SEPIC DC/DC Converter
C3
L1
1µF D1
22µH
6.5V TO 4V
VOUT
+ C1 VIN SW 5V
15µF 175mA
L2
LT1613 374k
4-CELL 22µH + C2
SHDN SHDN FB 22µF
GND
121k
D1: MBR0520
50
0 10 20 30 40 50 60 70 80 90 100
LOAD CURRENT (mA)
1613 TA04a
3.3V to 8V/70mA, – 8V/5mA, 24V/5mA TFT LCD Bias Supply Uses All Ceramic Capacitors
D2
VOFF
– 8V
1µF 5mA
D3 VON
24V
0.22µF 0.22µF 1µF 5mA
LT1613 274k
C1 C2
4.7µF 4.7µF
SHDN FB
GND
48.7k
1613 TA05
10
LT1613
U
TYPICAL APPLICATIO S
4-Cell to 5V/50mA, 12V/10mA, 15V/10mA Digital Camera Power Supply
D3
C1: TAIYO YUDEN JMK316BJ106ML 15V/10mA
2 C3
C2, C3, C4: TAIYO YUDEN EMK212BJ105MG
C5: TAIYO YUDEN JMK212BJ475MG 1µF
D1: MOTOROLA MBR0520
D2, D3: BAT54 D2
T1: COILCRAFT CCI8245A (847) 639-6400 12V/10mA
5 C4
1µF
VIN 7V TO 3.6V T1 D1
5V/50mA
6 3
C5
4.7µF
1 4
C1
10µF
C2
VIN SW 1µF 270pF
LT1613
102k
SHUTDOWN SHDN FB
GND
33.2k
1613 TA07
VIN 7V TO 3.6V T1
6 3
C4
1µF
D3
1 4
–7.5V/10mA
C1
10µF
C2
VIN SW 1µF 270pF
LT1613
102k
SHUTDOWN SHDN FB
GND
33.2k
1613 TA08
U
PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted.
S5 Package
5-Lead Plastic SOT-23
(LTC DWG # 05-08-1633)
2.60 – 3.00
(0.102 – 0.118)
2.80 – 3.00
1.50 – 1.75 (0.110 – 0.118)
0.00 – 0.15 0.90 – 1.45
(0.059 – 0.069) (NOTE 3)
(0.00 – 0.006) (0.035 – 0.057)
0.35 – 0.55
(0.014 – 0.022)
0.09 – 0.20 0.35 – 0.50 0.90 – 1.30
0.95
(0.004 – 0.008) (0.014 – 0.020) (0.035 – 0.051)
1.90 (0.037)
(NOTE 2) FIVE PLACES (NOTE 2)
(0.074) REF
NOTE: REF S5 SOT-23 0599
1. DIMENSIONS ARE IN MILLIMETERS
2. DIMENSIONS ARE INCLUSIVE OF PLATING
3. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
4. MOLD FLASH SHALL NOT EXCEED 0.254mm
5. PACKAGE EIAJ REFERENCE IS SC-74A (EIAJ)
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