SN54AHC08

SN74AHC08
www.ti.com SCLS236I – MARCH 1996 – REVISED MAY 2013

QUADRUPLE 2-INPUT POSITIVE-AND GATES

Check for Samples: SN54AHC08, SN74AHC08

1FEATURES
• Operating Range 2-V to 5.5-V • ESD Protection Exceeds JESD 22
• Latch-Up Performance Exceeds 250 mA Per – 2000-V Human-Body Model (A114-A)
JESD 17 – 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)

SN54AHC08 . . . JORWP ACKAGE SN74AHC08 . . . RGY PACKAGE SN54AHC08 . . . FK PACKAGE

SN74AHC08 . . . D,DB,DGV,N,NS, (TOP VIEW) (TOP VIEW)
OR PW PACKAGE

VCC
NC
VCC

1B
1A

4B
(TOP VIEW)

1A
1A 1 14 VCC 1 14 3 2 1 20 19
1Y 4 18 4A
1B 2 13 4B 1B 2 13 4B
NC 5 17 NC
1Y 3 12 4A 1Y 3 12 4A
2A 6 16 4Y
2A 4 11 4Y 2A 4 11 4Y
NC 7 15 NC
2B 5 10 3B 2B 5 10 3B
2B 8 14 3B
2Y 6 9 3A 2Y 6 9 3A 9 10 11 12 13
GND 7 8 3Y 7 8

2Y

3Y
3A
GND
NC
3Y
GND

NC − No internal connection

DESCRIPTION
The ’AHC08 devices are quadruple 2-input positive-AND gates. These devices perform the Boolean function Y =
A • B or Y = A + B in positive logic.

FUNCTION TABLE
INPUTS OUTPUT
A B Y
H H H
L X L
X L L

LOGIC DIAGRAM, EACH GATE (POSITIVE LOGIC)

A
Y
B

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1996–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN54AHC08
SN74AHC08
SCLS236I – MARCH 1996 – REVISED MAY 2013 www.ti.com

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted) (1)
VALUE UNIT
Supply voltage range, VCC –0.5 to 7 V
Input voltage range, VI (2) –0.5 to 7 V
Output voltage range, VO (2) –0.5 to VCC + 0.5 V
Input clamp current, IIK (VI < 0) –20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) ±20 mA
Continuous output current, IO (VO = 0 to VCC) ±25 mA
Continuous current through VCC or GND ±50 mA
(3)
D package 86
DB package (3) 96
DGV package (3) 127
Package thermal impedance, θJA N package (3) 80 °C/W
NS package (3) 76
PW package (3) 113
RGY package (4) 47
Storage temperature range, Tstg –65 to 150 °C

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) The package thermal impedance is calculated in accordance with JESD 51-5

RECOMMENDED OPERATING CONDITIONS (1)

SN54AHC08 SN74AHC08
UNIT
MIN MAX MIN MAX
VCC Supply voltage 2 5.5 2 5.5 V
VCC= 2 V 1.5 1.5
VIH High-level input voltage VCC= 3V 2.1 2.1 V
VCC= 5.5 V 3.85 3.85
VCC= 2 V 0.5 0.5
VIL Low-level Input voltage VCC= 3 V 0.9 0.9 V
VCC= 5.5 V 1.65 1.65
VI Input voltage 0 5.5 0 5.5 V
VO Output voltage 0 VCC 0 VCC V
VCC= 2 V –50 –50
IOH High-level output current VCC= 3.3 V ± 0.3 V –4 –4 mA
VCC= 5 V ± 0.5 V –8 –8
VCC= 2 V 50 50
IOL Low-level output current VCC= 3.3 V ± 0.3 V 4 4 mA
VCC= 5 V ± 0.5 V 8 8
VCC= 3.3 V ± 0.3 V 100 100
Δt/Δv Input Transition rise or fall rate ns/V
VCC= 5 V ± 0.5 V 20 20
TA Operating free-air temperature –55 125 –40 125 °C

(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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Product Folder Links: SN54AHC08 SN74AHC08

 SN54AHC08
SN74AHC08
www.ti.com SCLS236I – MARCH 1996 – REVISED MAY 2013

ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
TA = –55°C TO TA = –40°C TO TA = –40°C TO
125°C 85°C 125°C
TA = 25°C
PARAMETER TEST CONDITIONS VCC Recommended UNIT
SN54AHC08 SN74AHC08
SN74AHC08
MIN TYP MAX MIN MAX MIN MAX MIN MAX
2V 1.9 2 1.9 1.9 1.9
IOH = –50 µA 3V 2.9 3 2.9 2.9 2.9
VOH 4.5 V 4.4 4.5 4.4 4.4 4.4 V
IOH = –4 mA 3V 2.58 2.48 2.48 2.48
IOH = –8 mA 4.5 V 3.94 3.8 3.8 3.8
2V 0.1 0.1 0.1 0.1
IOL = 50 µA 3V 0.1 0.1 0.1 0.1
VOL 4.5 V 0.1 0.1 0.1 0.1 V
IOH = 4 mA 3V 0.36 0.5 0.44 0.5
IOH = 8 mA 4.5 V 0.36 0.5 0.44 0.5
0 V to 5.5 (1)
II VI = 5.5 V or GND ±0.1 ±1 ±1 ±1 µA
V
VI = VCC or
ICC IO = 0 5.5 V 2 20 20 20 µA
GND,
Ci VI = VCC or GND 5V 4 10 10 pF

(1) On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.

SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
TA = –40°C TO
TA = –55°C TO TA = –40°C TO 125°C
TA = 25°C 125°C 85°C
FROM TO LOAD Recommended
PARAMETER UNIT
(INPUT) (OUTPUT) CAPACITANCE
SN54AHC08 SN74AHC08 SN74AHC08
TYP MAX MIN MAX MIN MAX MIN MAX
tPLH 6.2 (1) 8.8 (1) 1 (1) 10.5 (1) 1 10.5 1 10.5
A or B Y CL = 15 pF ns
tPHL 6.2 (1) 8.8 (1) 1 (1) 10.5 (1) 1 10.5 1 10.5
tPLH 8.7 12.3 1 14 1 14 1 14
A or B Y CL = 50 pF ns
tPHL 8.7 12.3 1 14 1 14 1 14

(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.

SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
TA = –40°C TO
TA = –55°C TO TA = –40°C TO 125°C
TA = 25°C 125°C 85°C
FROM TO LOAD Recommended
PARAMETER UNIT
(INPUT) (OUTPUT) CAPACITANCE
SN54AHC08 SN74AHC08 SN74AHC08
TYP MAX MIN MAX MIN MAX MIN MAX
tPLH 4.3 (1) 5.9 (1) 1 (1) 7 (1) 1 7 1 7.0
A or B Y CL = 15 pF ns
tPHL 4.3 (1) 5.9 (1) 1 (1) 7 (1) 1 7 1 7.0
tPLH 5.8 7.9 1 9 1 9 1 9.0
A or B Y CL = 50 pF ns
tPHL 5.8 7.9 1 9 1 9 1 9.0

(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.

Copyright © 1996–2013, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: SN54AHC08 SN74AHC08
SN54AHC08
SN74AHC08
SCLS236I – MARCH 1996 – REVISED MAY 2013 www.ti.com

NOISE CHARACTERISTICS
VCC = 5 V, CL = 50 pF, TA = 25°C (1)
SN74AHC08 UNIT
PARAMETER
MIN MAX
VOL(P) Quiet output, maximum dynamic VOL 0.8 V
VOL(V) Quiet output, minimum dynamic VOL –0.8 V
VOH(V) Quiet output, minimum dynamic VOH 4.4 V
VIH(D) High-level dynamic input voltage 3.5 V
VIL(D) Low-level dynamic input voltage 1.5 V

(1) Characteristics are for surface-mount packages only.

OPERATING CHARACTERISTICS
VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load, f = 1 MHz 18 pF

4 Submit Documentation Feedback Copyright © 1996–2013, Texas Instruments Incorporated

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 SN54AHC08
SN74AHC08
www.ti.com SCLS236I – MARCH 1996 – REVISED MAY 2013

PARAMETER MEASUREMENT INFORMATION

VCC
RL = 1 kΩ S1 Open
From Output Test From Output TEST S1
Under Test Point Under Test GND tPLH/tPHL Open
CL CL tPLZ/tPZL VCC
(see Note A) (see Note A) tPHZ/tPZH GND
Open Drain VCC

LOAD CIRCUIT FOR LOAD CIRCUIT FOR

TOTEM-POLE OUTPUTS 3-STATE AND OPEN-DRAIN OUTPUTS

VCC
Timing Input 50% VCC
tw 0V
th
VCC tsu
VCC
Input 50% VCC 50% VCC
Data Input 50% VCC 50% VCC
0V 0V
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PULSE DURATION SETUP AND HOLD TIMES

VCC VCC
Output
Input 50% VCC 50% VCC 50% VCC 50% VCC
Control
0V 0V

tPLH tPHL tPZL tPLZ

Output
VOH Waveform 1 ≈VCC
In-Phase 50% VCC 50% VCC 50% VCC
Output S1 at VCC VOL + 0.3 V
VOL (see Note B) VOL
tPHL tPLH tPZH tPHZ
Output
VOH VOH
Out-of-Phase Waveform 2
50% VCC 50% VCC 50% VCC VOH − 0.3 V
Output S1 at GND
VOL (see Note B) ≈0 V
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES
INVERTING AND NONINVERTING OUTPUTS LOW- AND HIGH-LEVEL ENABLING
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output
control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output
control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf
≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms

Copyright © 1996–2013, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Links: SN54AHC08 SN74AHC08
SN54AHC08
SN74AHC08
SCLS236I – MARCH 1996 – REVISED MAY 2013 www.ti.com

REVISION HISTORY

Changes from Revision H (July 2003) to Revision I Page

• Changed document format from Quicksilver to DocZone. .................................................................................................... 1

• Extended operating temperature range to 125°C ................................................................................................................. 2

6 Submit Documentation Feedback Copyright © 1996–2013, Texas Instruments Incorporated

Product Folder Links: SN54AHC08 SN74AHC08

 PACKAGE OPTION ADDENDUM

www.ti.com 20-Jan-2014

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

5962-9682001Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9682001Q2A
SNJ54AHC
08FK
SN74AHC08D ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08
& no Sb/Br)
SN74AHC08DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI -40 to 125
SN74AHC08DBR ACTIVE SSOP DB 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08DE4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08
& no Sb/Br)
SN74AHC08DG4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08
& no Sb/Br)
SN74AHC08DGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08DGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08DGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08DR ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08
& no Sb/Br)
SN74AHC08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08
& no Sb/Br)
SN74AHC08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08
& no Sb/Br)
SN74AHC08N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 125 SN74AHC08N
(RoHS)
SN74AHC08NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 125 SN74AHC08N
(RoHS)

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 20-Jan-2014

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

SN74AHC08NSR ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08
& no Sb/Br)
SN74AHC08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08
& no Sb/Br)
SN74AHC08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08
& no Sb/Br)
SN74AHC08PW ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125
SN74AHC08PWR ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA08
& no Sb/Br)
SN74AHC08RGYR ACTIVE VQFN RGY 14 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 HA08
& no Sb/Br)
SN74AHC08RGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 HA08
& no Sb/Br)
SNJ54AHC08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9682001Q2A
SNJ54AHC
08FK

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 20-Jan-2014

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54AHC08, SN74AHC08 :

• Catalog: SN74AHC08
• Enhanced Product: SN74AHC08-EP, SN74AHC08-EP
• Military: SN54AHC08

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Enhanced Product - Supports Defense, Aerospace and Medical Applications

Addendum-Page 3
 PACKAGE OPTION ADDENDUM

www.ti.com 20-Jan-2014

• Military - QML certified for Military and Defense Applications

Addendum-Page 4
 PACKAGE MATERIALS INFORMATION

www.ti.com 23-Oct-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AHC08DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74AHC08DGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74AHC08DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74AHC08NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AHC08PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74AHC08PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74AHC08RGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 23-Oct-2013

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AHC08DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74AHC08DGVR TVSOP DGV 14 2000 367.0 367.0 35.0
SN74AHC08DR SOIC D 14 2500 367.0 367.0 38.0
SN74AHC08NSR SO NS 14 2000 367.0 367.0 38.0
SN74AHC08PWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74AHC08PWRG4 TSSOP PW 14 2000 367.0 367.0 35.0
SN74AHC08RGYR VQFN RGY 14 3000 367.0 367.0 35.0

Pack Materials-Page 2
 MECHANICAL DATA

MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000

DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE

24 PINS SHOWN

0,23
0,40 0,07 M
0,13
24 13

0,16 NOM
4,50 6,60
4,30 6,20

Gage Plane

0,25

0°–
8°
0,75
1 12
0,50
A

Seating Plane

0,15
1,20 MAX 0,08
0,05

PINS **
14 16 20 24 38 48 56
DIM

A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40

A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20

4073251/E 08/00

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38
0,65 0,15 M
0,22
28 15

0,25
0,09
5,60 8,20
5,00 7,40

Gage Plane

1 14 0,25

A 0°–ā8° 0,95
0,55

Seating Plane

2,00 MAX 0,05 MIN 0,10

PINS **
14 16 20 24 28 30 38
DIM

A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90

A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
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Wireless Connectivity www.ti.com/wirelessconnectivity

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