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Lmh6881 DC To 2.4Ghz, High Linearity, Programmable Differential Amplifier

lmh6881

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0% found this document useful (0 votes)
123 views29 pages

Lmh6881 DC To 2.4Ghz, High Linearity, Programmable Differential Amplifier

lmh6881

Uploaded by

Joseph Bernard
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
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LMH6881

www.ti.com

SNOSC72E JUNE 2012 REVISED MARCH 2013

LMH6881 DC to 2.4GHz, High Linearity, Programmable Differential Amplifier


Check for Samples: LMH6881

FEATURES

23

Small Signal Bandwidth: 2400 MHz


OIP3 @ 100 MHz: 44 dBm
HD3 @ 100 MHz: 100 dBc
Noise Figure: 9.7 dB
Voltage Gain Range: 26 dB to 6 dB
Voltage Gain Step Size 0.25 dB
Input Impedance 100
Parallel and Serial Gain Control
Power Down Capability

APPLICATIONS

Oscilloscope Front End


Spectrum Analyzer Gain Block
Differential ADC Driver
Differential Cable Driver
IF / RF and Baseband Gain Blocks
Medical Imaging

DESCRIPTION
The LMH6881 is a high-speed, high-performance,
programmable differential amplifier. With a bandwidth
of 2.4 GHz and high linearity of 44 dBm OIP3, the
LMH6881 is suitable for a wide variety of signal
conditioning applications.

The LMH6881 programmable differential amplifier


combines the best of both fully differential amplifiers
and variable gain amplifiers. It offers superior noise
and distortion performance over the entire gain range
without external resistors, enabling the use of just
one device and one design for multiple applications
requiring different gain settings.
The LMH6881 is an easy-to-use amplifier that can
replace both fully differential, fixed gain amplifiers as
well as variable gain amplifiers. The LMH6881
requires no external gain-setting components and
supports gain settings from 6 dB to 26 dB with small,
accurate 0.25-dB gain steps. With an input
impedance of 100 the LMH6881 is easy to drive
from a variety of sources such as mixers or filters.
The LMH6881 also supports 50 single-ended
signal sources and supports both DC- and ACcoupled applications.
Parallel gain control allows the LMH6881 to be
soldered down in a fixed gain so that no control
circuit is required. If dynamic-gain control is desired,
the LMH6881 can be changed with SPI serial
commands or with the parallel pins.
The LMH6881 is fabricated in TIs CBiCMOS8
proprietary
complementary
silicon
germanium
process and is available in a space saving, thermally
enhanced 24-pin Lead Quad WQFN package. The
same amplifier is offered in a dual package as the
LMH6882.

Performance Curves
Noise Figure Over Voltage Gain Range
DVGA Response Shown for Comparison

50

35

45

30
NOISE FIGURE (dB)

OIP3 (dBm)

OIP3 over Voltage Gain Range

40
35
30
25

f = 100 MHz
POUT= 4dBm / Tone

20

25
20
15
LMH6881
Traditional DVGA

10
5

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Motorola, Inc..
All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.


Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Copyright 20122013, Texas Instruments Incorporated

LMH6881
SNOSC72E JUNE 2012 REVISED MARCH 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings (1) (2)


ESD Tolerance (3)

Human Body Model

1 kV

Charged Device Model

250V
0.6V to 5.5V

Positive Supply Voltage (VCC)


Differential Voltage between Any Two Grounds

<200 mV

Analog Input Voltage Range

0.6V to 5.5V

Digital Input Voltage Range

0.6V to 5.5V

Output Short Circuit Duration (one pin to ground)

Infinite

Junction Temperature

+150C
65C to +150C

Storage Temperature Range


Soldering Information
(1)
(2)
(3)

Infrared or Convection (30 sec)

260C

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For verified specifications, see the Electrical
Characteristics table.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Field-Induced Charge-Device Model, applicable std. JESD22-C101C (ESD FICDM std. of JEDEC).

Operating Ratings (1)


Supply Voltage (VCC)

4.75V to 5.25V

Differential Voltage Between Any Two Grounds

<10 mV

Analog Input Voltage Range, AC Coupled

0V to VCC

Temperature Range (2)


Package Thermal Resistance (3)

(1)
(2)
(3)

40C to +85C
24pin WQFN

(JA)

53C/W

(JC)

6C/W

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For verified specifications, see the Electrical
Characteristics table.
The maximum power dissipation is a function of TJ(MAX), JA and the ambient temperature TA. The maximum allowable power dissipation
at any ambient temperature is PD = (TJ(MAX) TA)/ JA. All numbers apply for packages soldered directly onto a PC Board.
Junction to ambient (JA) thermal resistance measured on JEDEC 4-layer board. Junction-to-case (JC) thermal resistance measured at
exposed thermal pad; package is not mounted to any PCB.

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SNOSC72E JUNE 2012 REVISED MARCH 2013

5V Electrical Characteristics (1) (2) (3)


The following specifications apply for single supply with VCC = 5 V, Maximum Gain (26 dB), RL = 200 , fin = 100 MHz.
Boldface limits apply at temperature extremes.
Symbol

Parameter

Conditions

Min (4)

Typ (5)

Max (4)

Units

Dynamic Performance
3 dBBW

3 dB Bandwidth

VOUT= 2 VPPD

2.4

NF

Noise Figure

Source Resistance (Rs) = 100

9.7

dB

OIP3

Output Third Order Intercept


Point (6)

f = 100 MHz, POUT = 4 dBm per tone, tone


spacing = 1 MHz

44

dBm

f = 200 MHz, POUT = 4 dBm per tone, tone


spacing = 2 MHz

42

GHz

OIP2

Output Second Order Intercept


Point

POUT= 4 dBm per Tone, f1 =112.5 MHz, f2 =


187.5 MHz

76

dBm

IMD3

Third Order Intermodulation


Products

f = 100 MHz, POUT = 4 dBm per tone, tone


spacing = 1 MHz

80

dBc

f = 200 MHz, POUT = 4 dBm per tone, tone


spacing =2 MHz

76

P1dB

1dB Compression Point

Output Power

17

dBm

HD2

Second Order Harmonic Distortion

f = 200 MHz, POUT = 4 dBm

65

dBc

HD3

Third Order Harmonic Distortion

f = 200 MHz, POUT = 4 dBm

74

dBc

CMRR

Common Mode Rejection Ratio (7)

Pin = 15 dBm, f = 100 MHz

40

dBc

SR

Slew Rate

6000

V/us

Output Voltage Noise

Maximum Gain f > 1 MHz

47

nV/Hz

Input Referred Voltage Noise

Maximum Gain f > 1 MHz

2.3

nV/Hz

RIN

Input Resistance

Differential, INPD to INMD

100

RIN

Input Resistance

Single Ended, INPS or INPD, 50-


termination on unused input

50

VICM

Input Common Mode Voltage

Self Biased

2.5

Maximum Input Voltage Swing

Volts peak to peak, differential

2.85

VPPD

Maximum Differential Output


Voltage Swing

Differential, f < 10MHz

VPPD

Output Resistance

Differential, f = 100MHz

0.4

Analog I/O

ROUT

Gain Parameters
Maximum Voltage Gain

Parallel Inputs (INPD and INMD), Rs = 100

26

Single ended input (INMS or INPS), 50- Rs


and 50- termination on unused input.

26.6

dB
dB

Minimum Gain

Parallel Inputs, Rs = 100

Gain Steps

Available using SPI interface

80

Available using parallel interface

10

Gain Step Size

Available using SPI interface


Available using parallel interface

(1)
(2)
(3)
(4)
(5)
(6)

(7)

0.25
2

dB

Electrical Table values apply only for factory testing conditions at the temperature indicated. No verification of parametric performance is
indicated in the electrical tables under conditions different than those tested
Negative input current implies current flowing out of the device.
Drift determined by dividing the change in parameter at temperature extremes by the total temperature change.
Limits are 100% production tested at 25C. Limits over the operating temperature range are ensured through correlation using Statistical
Quality Control (SQC) methods.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
OIP3 is the third order intermodulation intercept point. In this datasheet OIP3 numbers are single power measurements where OIP3 =
IMD3 / 2 + POUT (per tone). OIP2 is the second order intercept point where OIP2 = IMD2 + POUT (per tone). HD2 is the second order
harmonic distortion and is a single tone measurement. HD3 is the third order harmonic distortion and is a single tone measurement.
Power measurements are made at the amplifier output pins.
CMRR is defined as the differential response at the output in response to a common mode signal at the input.
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5V Electrical Characteristics(1)(2)(3) (continued)


The following specifications apply for single supply with VCC = 5 V, Maximum Gain (26 dB), RL = 200 , fin = 100 MHz.
Boldface limits apply at temperature extremes.
Symbol

Parameter

Min (4)

Conditions

Typ (5)

Max (4)

Units

Gain Step Error

Any two adjacent steps over entire range

0.125

dB

Gain Step Phase Shift

Any two adjacent steps over entire range

Degrees

20

ns

15

ns

Gain Step Switching Time


Enable/ Disable Time

Settled to 90% level

Power Requirements
ICC

Supply Current

100

Power

0.5

135

mA
W

ICCD

Disabled Supply Current

15

mA

All Digital Inputs


Logic Compatibility

TTL, 2.5V CMOS, 3.3V CMOS, 5V CMOS

VIL

Logic Input Low Voltage

0.4

VIH

Logic Input High Voltage

2.0-5.0

IIH

Logic Input High Input Current

IIL

Logic Input Low Input Current

47

Parallel Mode Timing


tGS

Setup Time

ns

tGH

Hold Time

ns

50

MHz

Serial Mode
fCLK

SPI Clock Frequency

50% duty cycle

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10

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SNOSC72E JUNE 2012 REVISED MARCH 2013

CONNECTION DIAGRAM

NC

OCM

D1

D0

SPI

GND

24-Pin WQFN

GND

VCC

INMS

VCC

INMD

OUTP
GND

NC

VCC

SD

GND

D3

VCC

D2

INPS

NC

OUTM

GND

INPD

Figure 1. Top View

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PIN DESCRIPTIONS
Pin Number

Symbol

Pin Category

Description

9,10

INPD, INMD

Analog Input

Differential inputs 100

8, 11

INPS, INMS

Analog Input

Single-ended inputs 50

21, 22

OUTP, OUTM

Analog Output

Differential outputs, low impedance

6, 7, 12, 13

GND

Ground

Ground pins. Connect to low impedance ground


plane. All pin voltages are specified with respect to
the voltage on these pins. The exposed thermal pad
is internally bonded to the ground pins.

19, 20, 23, 24

VCC

Power

Power supply pins. Valid power supply range is


4.75 V to 5.25 V.

Thermal/ Ground

Thermal management/ Ground

Digital Input

0 = Parallel Mode, 1 = Serial Mode

Analog I/O

Power

Exposed Center Pad


Digital Inputs
5

SPI

Parallel Mode Digital Pins, SPI = Logic Low


3, 4, 15, 16

D0, D1, D2, D3

Digital Input

Attenuator control

17

SD

Digital Input

Shutdown 0 = amp on, 1 = amp off

Serial Mode Digital Pins, SPI= Logic High, SPI compatible


4

SDO

Digital Output - Open Emitter

Serial Data Output (Requires external bias.)

SDI

Digital Input

Serial Data In

16

CS

Digital Input

Chip Select (active low)

15

CLK

Digital Input

Clock

PIN LIST
Pin Number

Description

Pin

NC

OCM

Output Common Mode, gain of 2

D1, SDI

Parallel mode = Logic control signal, position 1 or weight 21


SPI mode = serial data in (SDI)

D0, SDO

Parallel mode = Logic control signal, position 0 or weight 20


SPI mode = serial data out (SDO)

SPI

Serial mode control

GND

Ground

GND

Ground

INMS

Amplifier single ended input minus swing (negative)


Amplifier differential input minus swing (negative)

INMD

10

INPD

Amplifier differential input plus swing (positive)

11

INPS

Amplifier single ended input plus swing (positive)

12

GND

Ground

13

GND

Ground

14

NC

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PIN LIST (continued)


Pin Number

Description

Pin

15

D2

Parallel mode = Logic control signal, position 2 or weight 22 SPI mode = serial clock
(CLK)

16

D3

Parallel mode = Logic control signal, position 3 or weight 23 SPI mode = chip select
(CS)

17

SD

Device Shutdown

18

NC

19

VCC

Power supply nominal value of 5V

20

VCC

Power supply nominal value of 5V

21

OUTM

Amplifier output minus (negative)

22

OUTP

Amplifier output plus (positive)

23

VCC

Power supply nominal value of 5V

24

VCC

Power supply nominal value of 5V

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Typical Performance Characteristics


(Unless otherwise specified, the following conditions apply: TA = 25C, VCC = 5 V, RL = 200 , Maximum Gain, Differential
Input). LMH6882 devices have been used for some typical performance plots.
Frequency Response over Gain Range,
4-dB Steps

OIP3 vs Voltage Gain


50

35

45

25
20

40

OIP3 (dBm)

15
10
5

35
30

0
-5

25

-10

f = 100 MHz
POUT= 4dBm / Tone

4dB Step

-15

20
1

10
100
1k
FREQUENCY (MHz)

10k

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Figure 2.

Figure 3.

OIP3 vs Output Power

Dynamic Range Figure vs Voltage Gain


45
OIP3, NOISE FIGURE (dBm, dB)

50

OIP3 (dBm)

45

40

35
f = 100MHz
Tone Spacing = 1 MHz

20

40

OIP3
Noise Figure
Dynamic Range Figure

35

16
14

30

12

25

10

20

8
6

15

30

18

10

-4
-2
0
2
4
6
8
10
OUTPUT POWER FOR EACH TONE (dBm)

DYNAMIC RANGE FIGURE (dB)

VOLTAGE GAIN (dB)

30

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Figure 4.

Figure 5.

OIP3 vs Frequency

OIP3 vs Supply Voltage

50

50
f = 100 MHz
POUT= 4dBm / Tone

45
OIP3 (dBm)

OIP3 (dBm)

45
40
35

40

30
35

Voltage Gain
26 dB
16 dB
6 dB

25
20
0

30

50 100 150 200 250 300 350 400


FREQUENCY (MHz)

Figure 6.

Voltage Gain
26 dB
16 dB
6 dB

4.50

4.75
5.00
5.25
SUPPLY VOLTAGE (V)

5.50

Figure 7.

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SNOSC72E JUNE 2012 REVISED MARCH 2013

Typical Performance Characteristics (continued)


(Unless otherwise specified, the following conditions apply: TA = 25C, VCC = 5 V, RL = 200 , Maximum Gain, Differential
Input). LMH6882 devices have been used for some typical performance plots.
OIP3 vs Temperature

OIP2 vs Voltage Gain


90

50
f = 100 MHz
POUT= 4dBm / Tone

85
80
OIP2 (dBm)

OIP3 (dBm)

45

40

35

75
70
65
60

Temperature
- 40 C
25 C
85 C

30

25
6

f1= 187.5 MHz


f2= 112.5 MHz
POUT= 4dBm/ Tone

55
50

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Figure 8.

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Figure 9.

Supply Current vs Temperature

Maximum Voltage Gain vs Temperature


27.0

100

26.5

98

MAXIMUM GAIN (dB)

SUPPLY CURRENT (mA)

99

97
96
95
94
93
92

26.0
25.5
25.0
24.5
f = 100 MHz
POUT= 4.5dBm

91
90

24.0

-45 -30 -15 0 15 30 45 60 75 90


TEMPERATURE (C)

-45 -30 -15 0 15 30 45 60 75 90


TEMPERATURE (C)

Figure 10.

Figure 11.

HD2 vs Frequency

HD3 vs Frequency

-20

-20
Voltage Gain
26 dB
16 dB
6 dB

-30

-40

-50

-50

HD3 (dBc)

HD2 (dBc)

-40

Voltage Gain
26 dB
16 dB
6 dB

-30

-60
-70

-60
-70

-80

-80

-90

-90

POUT=4dBm

POUT= 4 dBm
-100

-100
0

50 100 150 200 250 300 350 400


FREQUENCY (MHz)

Figure 12.

50 100 150 200 250 300 350 400


FREQUENCY (MHz)

Figure 13.

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Typical Performance Characteristics (continued)


(Unless otherwise specified, the following conditions apply: TA = 25C, VCC = 5 V, RL = 200 , Maximum Gain, Differential
Input). LMH6882 devices have been used for some typical performance plots.
HD2 & HD3 vs Voltage Gain

HD2 vs Output Power

-40

-20

HD2
-50

Voltage Gain
26 dB
21 dB
10 dB

-30

HD3

-40
f = 100 MHz
POUT = 4dBm

-70

-50

HD2 (dBc)

HD2,HD3 (dBc)

-60

-80

-60
-70
-80

-90

-90
-100

-100
-110

-110
6

10 12 14 16 18 20 22 24 26

VOLTAGE GAIN (dB)

4
6
8 10 12 14
OUTPUT POWER (dBm)

16

C001

Figure 14.

Figure 15.

HD3 vs Output Power

Output Power vs Input Power


20

-10

-30
HD3 (dBc)

-40

OUTPUT POWER (dBm)

Voltage Gain
26 dB
21 dB
10 dB

-20

-50
-60
-70
-80
-90

f = 100 MHz
Voltage Gain = 26dB

15

10

-100
-110

-5
0

4
6
8 10 12 14
OUTPUT POWER (dBm)

16

-25

Figure 16.

0.5
PHASE ERROR (Degrees)

AMPLITUDE ERROR (dB)

Gain Step Phase Error


1.0

50 MHz
200 MHz

0.1

0.0

-0.1

0.0
-0.5
-1.0
-1.5
-2.0
-2.5

-0.2
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Figure 18.

10

50 MHz
200 MHz

-3.0
6

Figure 17.

Gain Step Amplitude Error


0.2

-20
-15
-10
-5
INPUT POWER (dBm)

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Figure 19.

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Typical Performance Characteristics (continued)


(Unless otherwise specified, the following conditions apply: TA = 25C, VCC = 5 V, RL = 200 , Maximum Gain, Differential
Input). LMH6882 devices have been used for some typical performance plots.
Cumulative Amplitude Error
0.6

50 MHz
200 MHz

2
PHASE ERROR (Degrees)

0.5
0.4
0.3
0.2
0.1
0.0
-0.1

1
0
-1
-2
-3

-0.2

-4

-0.3

-5
6

50 MHz
200 MHz

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Figure 20.
Noise Figure vs Voltage Gain

Noise Figure vs Frequency


14
13
12

NOISE FIGURE (dB)

NOISE FIGURE (dB)

25
20
15
10

11
10
9
8

6
6

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Figure 22.

200
400
600
800
FREQUENCY (MHz)

1000

Figure 23.

Channel Enable Control Timing Behavior

16dB Gain Control Timing Behavior

Enable Control
Output Voltage

4
16dB Gain Control
Ouptut Voltage

0
-1

-1

-1

-2

-1

OUTPUT VOLTAGE (V)

ENABLE CONTROL (V)

OUTPUT VOLTAGE (V)

10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Figure 21.

30

-2

0 10 20 30 40 50 60 70 80 90 100
TIME (ns)

0 10 20 30 40 50 60 70 80 90 100
TIME (ns)

Figure 24.

Figure 25.

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16dB GAIN CONTROL (V)

AMPLITUDE ERROR (dB)

Cumulative Phase Error


3

11

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Typical Performance Characteristics (continued)


(Unless otherwise specified, the following conditions apply: TA = 25C, VCC = 5 V, RL = 200 , Maximum Gain, Differential
Input). LMH6882 devices have been used for some typical performance plots.
8dB Step Control Timing Behavior

Common Mode Rejection (Sdc21) vs Frequency

8 dB Gain Control
Output Voltage

-1
-2

-1

0
COMMON MODE REJECTION (dBc)

4
8 DB GAIN CONTROL (V)

OUTPUT VOLTAGE (V)

-10
-20
-30
-40
-50
-60

0 10 20 30 40 50 60 70 80 90 100
TIME (ns)

10
100
FREQUENCY (MHz)

Figure 26.

Figure 27.

Input Impedance

Output Impedance

125

50
40
OUTPUT IMPEDANCE ( )

INPUT IMPEDANCE ( )

100
75
R
X

50

Impedance = R + j X

25
0
-25

R
X

30

Impedance = R + j X

20
10
0
-10
-20
-30
-40

-50

-50
0

400
800
1200 1600
FREQUENCY (MHz)

2000

Figure 28.

12

1k

400
800
1200 1600
FREQUENCY (MHz)

2000

Figure 29.

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Typical Performance Characteristics, Single-Ended Input


(Unless otherwise specified, the following conditions apply: TA = 25C, VCC = 5 V, RL = 200 , Maximum Gain.)
OIP3 vs Voltage Gain

HD2 vs Frequency
-20

50

Voltage Gain
26 dB
16 dB
6 dB

-30
-40
HD2 (dBc)

OIP3 (dBm)

45

40

-50
-60
-70
-80

35

Single Ended Input


f = 100 MHz, 1MHz Spacing
POUT= 4dBm / Tone

POUT=4dBm

-90
-100

30
6

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

50 100 150 200 250 300 350 400


FREQUENCY (MHz)

Figure 30.

Figure 31.

HD3 vs Frequency

HD2 & HD3vs Voltage Gain

-30

-30
Voltage Gain
26 dB
16 dB
6 dB

HD3 (dBc)

-50

f = 100 MHz

-40
-50
HD2, HD3 (dBc)

-40

-60
-70
-80

-60
-70

HD2
HD3

-80
-90

-90

-100
POUT= 4dBm

-100
0

-110

50 100 150 200 250 300 350 400


FREQUENCY (MHz)

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Figure 32.

Figure 33.

Noise Figure vs Voltage Gain

Single Ended Input Impedance

20

60
f = 100 MHz

50
INPUT IMPEDANCE ( )

NOISE FIGURE (dB)

18
16
14
12
10
8

R
X

40
30

Impedance = R + j X

20
10
0
-10

-20
6

8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)

Figure 34.

400
800
1200 1600
FREQUENCY (MHz)

2000

Figure 35.

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APPLICATION INFORMATION
INTRODUCTION
The LMH6881 has been designed to replace traditional, fixed-gain amplifiers, as well as variable-gain amplifiers,
with an easy-to-use device which can be flexibly configured to many different gain settings while maintaining
excellent performance over the entire gain range. Many systems can benefit from this programmable-gain, DCcapable, differential amplifier. Last-minute design changes can be implemented immediately, and external
resistors are not required to set the gain.
Gain control is enabled with a parallel or a serial-control interface, and as a result, the amplifier can also serve as
a digitally controlled variable-gain amplifier (DVGA) for automatic gain-control applications. Figure 36 and
Figure 37 show typical implementations of the amplifier.
+5V

100:
FILTER

0.01 PF

RF

49.9:
100:

LMH6881

100:
FILTER

2.5V

ADS5400

49.9:

0.01 PF
LO
5

OCM 1.25V

GAIN 0-3
SD

Figure 36. LMH6881 Typical Application


VCC
:

0.01 PF

49.9:
CAT5
100:

LMH6881

49.9:

0.01 PF

5
GAIN 0-3

Rx
100:

1.25V
OCM

SD

Figure 37. LMH6881 Used as Twisted Pair Cable Driver


This application section will cover the use and function of the amplifier, common applications, detailed
instructions on digital control and power supply as well as thermal and board layout recommendations.

BASIC CIRCUIT DESCRIPTION


The LMH6881 has three functional stages, a low-noise amplifier, followed by a digital attenuator, and a lowdistortion, low-impedance output amplifier. The amplifier has four signal-input pins, to accommodate both
differential signals and single-ended signals. The amplifier has an OCM pin used to set the output common mode
voltage. There is a gain of 2 on this pin so that 1.25 V applied on that pin will place the output common mode at
2.5 V.

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+5V
0.01 PF

SOURCE

LOAD
VCC

INMS

50:

49.9:

OUT+
INMD
VCM 2.5V

AC

VCM 2.5V

LMH6881

INPD

100:

OUT-

50:

49.9:

INPS
OCM

0.01 PF
1.25V

Figure 38. Typical Implementation with a Differential Input Signal


+5V
0.01 PF

SOURCE

LOAD
50:

VIN 2.5V INMS

VCC
OUT+

INMD

49.9:

AC
VCM 2.5V

LMH6881
INPD

100:

OUT-

INPS
49.9:
50:
0.01 PF
OCM
0.01 PF

2.5V
1.25V

Figure 39. Typical Implementation with a Single-Ended Input Signal

INPUT CHARACTERISTICS
The LMH6881 has internally terminated inputs. The INMD and INPD pins are intended to be the differential input
pins and have an internal 100- resistive termination. An example differential circuit is shown in Figure 38. When
using the differential inputs, the single-ended inputs should be left disconnected.
The INMS and INPS pins are intended to be used for single ended inputs and have been designed to support
single ended termination of 50 working as an active termination. For single-ended signals an external 50-
resistor is required as shown in Figure 39. When using the single-ended inputs, the differential inputs should be
left disconnected.
All of the input pins are self biased to 2.5 V. When using the LMH6881 for DC-coupled applications it is possible
to externally bias the input pins to voltages from 1.5 V to 3.5 V. Performance is best at the 2.5-V level specified.
Performance will degrade slightly as the common mode shifts away from 2.5 V.
The first stage of the LMH6881 is a low-noise amplifier that can accommodate a maximum input signal of 2 Vppd
on the differential input pins and 1 Vpp on either of the single-ended pins. Signals larger than this will cause
severe distortion. Although the inputs are protected against ESD, sustained electrical overstress will damage the
part. Signal power over 13 dBm should not be applied to the amplifier differential inputs continuously. On the
single-ended pins the power limit is 10 dBm for each pin.

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OUTPUT CHARACTERISTICS
The LMH6881 has a low-impedance output very similar to a traditional Op-amp output. This means that a wide
range of loads can be driven with good performance. Matching load impedance for proper termination of filters is
as easy as inserting the proper value of resistor between the filter and the amplifier (See Figure 36 for example.)
This flexibility makes system design and gain calculations very easy. By using a differential output stage the
LMH6881 can achieve large voltage swings on a single 5-V supply. This is illustrated in Figure 40. This figure
shows how a voltage swing of 4 VPPD is realized while only swinging 2 VPP on each output. A 1-VP signal on one
branch corresponds to 2 VPP on that branch and 4 VPPD when looking at both branches (positive and negative).
5.0
4.5

4VPPD

4.0
VOUT(V)

3.5
3.0
2.5
2.0

2VPP

1.5
1.0
0.5
0.0
0.0

Out Plus
Out Minus
Differential Vout
0.9 1.8 2.7 3.6 4.5 5.4
PHASE ANGLE (Radians)

Figure 40. Differential Output Voltage


The LMH6881 has been designed for both AC-coupled and DC-coupled applications. To give more flexibility in
DC-coupled applications, the common mode voltage of the output pins is set by the OCM pin. The OCM pin
needs to be driven from an external low-noise source. If the OCM pin is left floating, the output common mode is
undefined, and the amplifier will not operate properly.
There is a DC gain of 2 between the OCM pin and the output pins so that the OCM voltage should be between 1
V and 1.5 V. This will set the output common mode voltage between 2 V and 3 V. Output common mode
voltages outside the recommended range will exhibit poor voltage swing and distortion performance. The
amplifier will give optimum performance when the output common mode is set to half of the supply voltage (2.5 V
or 1.25 V at the OCM pin).
The ability of the LMH6881 to drive low-impedance loads while maintaining excellent OIP3 performance creates
an opportunity to greatly increase power gain and drive low-impedance filters. This gives the system designer
much needed flexibility in filter design. In many cases using a lower impedance filter will provide better
component values for the filter. Another benefit of low-impedance filters is that they are less likely to be
influenced by circuit board parasitic reactances such as pad capacitance or trace inductance. The output stage is
a low-impedance voltage amplifier, so voltage gain is constant over different load conditions. Power gain will
change based on load conditions. See Figure 41 for details on power gain with respect to different load
conditions. The graph was prepared for the 26-dB voltage gain. Other gain settings will behave similarly.
All measurements in this data sheet, unless specified otherwise, refer to voltage or power at the device output
pins. For instance, in an OIP3 measurement the power out will be equal to the output voltage at the device pins
squared, divided by the total load voltage. In back terminated applications, power to the load would be 3 dB less.
Common back terminated applications include driving a matched filter or driving a transmission line.

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POWER GAIN AT LOAD (dB)

24
22
20
18
16
14
12
0

100
200
300
LOAD IMPEDANCE ( )

400

Figure 41. Power Gain as a Function of the Load


Printed circuit board (PCB) design is critical to high-frequency performance. In order to ensure output stability the
load-matching resistors should be placed as close to the amplifier output pins as possible. This allows the
matching resistors to mask the board parasitics from the amplifier output circuit. An example of this is shown in
Figure 36. Also note that the low-pass filters in Figure 43 and Figure 44 use center-tapped capacitors. Having
capacitors to ground provides a path for high-frequency, common-mode energy to dissipate. This is equally
valuable for the ADC, so there are also capacitors to ground on the ADC side of the filter. The LMH6881EVAL
evaluation board is available to serve as a guide for system board layout. See also application note AN-2235 for
more details.

INTERFACING TO AN ADC
The LMH6881 is an excellent choice for driving high-speed ADCs such as the ADC12D1800RF,
ADC12D1600RF or the ADS5400. The following sections will detail several elements of ADC system design,
including noise filters, AC-, and DC-coupling options.
ADC NOISE FILTER
When connecting a broadband amplifier to an analog-to-digital converter, it is nearly always necessary to filter
the signal before sampling it with the ADC. Figure 42 shows a schematic of a second order Butterworth filter, and
Table 1 shows component values for some common IF frequencies. These filters offer a good compromise
between bandwidth, noise rejection and cost. This filter topology is the same as is used on the
ADC14V155KDRB High IF Receiver reference design board. This filter topology is adequate for reducing aliasing
of broadband noise and will also provide rejection of harmonic distortion and many of the images that are
commonly created by mixers.
R1
AMP VOUT -

L1

C1

L5

L2
AMP VOUT +

ADC ZIN

C2

R4

C3

R3

ADC VIN +

ADC VIN -

R2
ADC VCM

Figure 42. ADC Noise Filter Schematic

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Table 1. Filter Component Values (1)


Center Frequency

75 MHz

150 MHz

180 MHz

250 MHz

Bandwidth

40 MHz

60 MHz

75 MHz

100 MHz

R1, R2

90

90

90

90

L1, L2

390 nH

370 nH

300 nH

225 nH

C1, C2

10 pF

3 pF

2.7 pF

1.9 pF

C3

22 pF

19 pF

15 pF

11 pF

L5

220 nH

62 nH

54 nH

36 nH

R3, R4

100

100

100

100

(1)

Resistor values are approximate, but have been reduced due to the internal 10 of output resistance per pin.

AC COUPLING TO ADC
AC coupling is an effective method for interfacing to an ADC for many communications systems. In many
applications this will be the best choice. The LMH6881 evaluation board is configured for AC coupling as shipped
from the factory. Coupling with capacitors is usually the most cost effective method. Transformers can provide
both AC coupling and impedance transformation as well as single ended to differential conversion. One of the
key benefits to AC coupling is that each stage of the system can be biased to the ideal DC operating point. Many
systems operate with lower overall power dissipation when DC bias currents are eliminated between stages.
DC COUPLING TO ADC
The LMH6881 supports DC-coupled signals. In order to successfully implement a DC-coupled signal chain the
common-mode voltage requirements of every stage need to be met. This will require careful planning, and in
some cases there will be signal level, gain or termination compromises required to meet the requirements of
every part. Shown in Figure 43 and Figure 44 is a method using resistors to change the 2.5-V common mode of
the amplifier output to a common mode compatible for the input of a low-input-voltage ADC such as the
ADC12D1800RF. This DC level shift is achieved while maintaining an AC impedance match with the filter in
Figure 43, while in Figure 44 there is a small mismatch between the amplifier termination resistors and the ADC
input. Since there is no universal ADC input common mode and some ADCs have impedance controlled input,
each design will require a different resistor ratio. For high-speed data conversion systems it is very important to
keep the physical distance between the amplifier and the ADC electrically short. When connections between the
amplifier and the ADC are electrically short, termination mismatches are not critical.
LMH6881
50:

INPS
RIN = 50:
ROUT

N/C

RT
LPF

75:

INPD
50:
VCM = 2.5V

N/C

ADC

VCM =1.5V
300:

RL
INMD
50:

ROUT

75:

x2

INMS

OCM

RT

+1.25V

50:
Parallel termination = 2* RT || RL = 150 || 300 =
100:
VCM voltage divider = 2.5V * RT/(ROUT + RT) =
2.5 * 75/125 = 1.5 V

+2.5V

Figure 43. DC-Coupled ADC Driver Example 1, High Input Impedance ADC
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LMH6881

N/C

INSP
ROUT

100:

RT

OUTM

INDP

100:

V=1.25V

V =2.5V

100:

OUTP

INDM

CM

ROUT
INSM

100:

RT

+1.25V

x2

N/C

ADC12D1800RF

100:

OCM

Figure 44. DC-Coupled ADC Driver Example 2, Terminated Input ADC

DIGITAL CONTROL OF THE GAIN AND POWER-DOWN PINS


The LMH6881 will support two modes of control for its gain: a parallel mode and a serial mode (SPI compatible).
Parallel mode is fastest and requires the most board space for logic line routing. Serial mode is compatible with
existing SPI-compatible systems. The device has gain settings covering a range of 20 dB. In parallel mode, only
2-dB steps are available. The serial interface should be used for finer gain control of 0.25 dB for a gain between
6 dB and 26 dB of voltage gain. If fixed gain is desired the pins can be strapped to ground or VCC, as required.
The device has a shutdown pin to enable power savings when the amplifier is not being used.
The LMH6881 was designed to interface with 2.5-V to 5-V CMOS logic circuits. If operation with 5-V logic is
required care should be taken to avoid signal transients exceeding the amplifier supply voltage. Long,
unterminated digital signal traces should be avoided. Signal voltages on the logic pins that exceed the device
power supply voltage may trigger ESD protection circuits and cause unreliable operation. Some digital inputoutput pins have different functions depending on the digital control mode. Table 2 shows the mapping of the
digital pins. These functions for each pin will be described in the sections PARALLEL INTERFACE and SPICOMPATIBLE SERIAL INTERFACE.
Table 2. Pins with Dual Functions
Pin

SPI = 0

SPI = 1

D1

SDI

D0

SDO (1)

15

D2

CLK

16

D3

CS (active low)

(1)

Pin 4 requires external bias. See SPI-COMPATIBLE SERIAL INTERFACE section for Details.

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PARALLEL INTERFACE
Parallel mode offers the fastest gain update capability with the drawback of requiring the most board space
dedicated to control lines. To place the LMH6881 into parallel mode the SPI pin (pin 5) is set to the logical zero
state. Alternately the SPI pin can be connected directly to ground. The SPI pin has a weak internal resistor to
ground. If left unconnected, the amplifier will operate in parallel mode.
In parallel mode the gain can be changed in 2-dB steps with a 4-bit gain control bus. The attenuator control pins
are internally biased to logic high state with weak pull-up resistors, with the exception of D0 which is biased low
due to the shared SDO function. If the control bus is left unconnected, the amplifier gain will be set to 6 dB.
Table 3 shows the gain of the amplifier when controlled in parallel mode.
Table 3. Amplifier Gain for All Control Pin Combinations
Control pins logical level in parallel mode
D3

D2

D1

D0

Decimal value

Amplifier voltage
gain [dB]

10 - 15

10

12

14

16

18

20

22

24

26

For fixed-gain applications the attenuator-control pins should be connected to the desired logic state instead of
relying on the weak internal bias. Data from the gain-control pins directly drive the amplifier gain circuits. To
minimize gain change glitches all gain pins should be driven with minimal skew. If gain-pin timing is uncertain,
undesirable transients can be avoided by using the shutdown pin to disable the amplifier while the gain is
changed. Gain glitches are most likely to occur when multiple bits change value for a small gain change, such as
the gain change from 10 dB to 12 dB which requires changing all 4 gain-control pins.
A shutdown pin (SD == 0, amplifier on, SD == 1, amplifier off) is provided to reduce power consumption by
disabling the highest power portions of the amplifier. The digital control circuit is not shut down and will preserve
the last active gain setting during the disabled state. See the Typical Performance Characteristics section for
disable and enable timing information. The SD pin is functional in parallel mode only and disabled in serial mode.

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LMH6881

CONTROL LOGIC
Shutdown

SD

2 dB Step

D0

4 dB Step

D1

8 dB Step

D2

16 dB Step

D3

Figure 45. Parallel Mode Connection

SPI-COMPATIBLE SERIAL INTERFACE


The serial interface allows a great deal of flexibility in gain programming and reduced board complexity. The
LMH6881 serial interface is a generic 4-wire synchronous interface that is compatible with SPI-type interfaces
that are used on many microcontrollers and DSP controllers. Using only 4 wires, the SPI mode offers access to
the 0.25-dB gain steps of the amplifier.
For systems where gain is changed only infrequently, or where only slower gain changes are required, serial
mode is the best choice. To place the LMH6881 into serial mode the SPI pin (Pin 5) should be put into the logic
high state. Alternatively the SPI pin can be connected directly to the 5-V supply bus. In this configuration the pins
function as shown in Table 2. The SPI interface uses the following signals: clock input (CLK), serial data in (SDI),
serial data out (SDO), and serial chip select (CS). The chip select pin is active low meaning the device is
selected when the pin is low.
The SD pin is inactive in the serial mode. This pin can be left disconnected for serial mode. The SPI interface
has the ability to shut down the amplifier without using the SD pin.
The CLK pin is the serial clock pin. It is used to register the input data that is presented on the SDI pin on the
rising edge and to source the output data on the SDO pin on the falling edge. The user may disable clock and
hold it in the low state, as long as the clock pulse-width minimum specification is not violated when the clock is
enabled or disabled. The clock pulse-width minimum is equal to one setup plus one hold time, or 6 ns.
The CS pin is the chip select pin. This pin is active low; the chip is selected in the logic low state. Each assertion
starts a new register access - i.e., the SDATA field protocol is required. The user is required to de-assert this
signal after the 16th clock. If the CS pin is de-asserted before the 16th clock, no address or data write will occur.
The rising edge captures the address just shifted in and, in the case of a write operation, writes the addressed
register. There is a minimum pulse-width requirement for the de-asserted pulse - which is specified in the
Electrical Specifications section.
The SDI pin is the input pin for the serial data. Each write cycle is 16-bits long.
The SDO pin is the data output pin. This output is normally at a high impedance state, and is driven only when
CS is asserted. Upon CS assertion, contents of the register addressed during the first byte are shifted out with
the second 8 SCLK falling edges. The SDO pin is a current output and requires external bias resistor to develop
the correct logic voltage. See Figure 47 for details on sizing the external bias resistor. Resistor values of 180
to 400 are recommended. The SDO pin can source 10 mA in the logic high state. With a bias resistor of 250
the logic 1 voltage would be 2.5 V. In the logic 0 state, the SDO output is off and no current flows, so the bias
resistor will pull the voltage to 0 V.
Each serial interface write access cycle is exactly 16 bits long as shown in Figure 46.
The external bias resistor means that in the high-impedance state the SDO pin impedance is equal to the
external bias resistor value. If bussing multiple SPI devices make sure that the SDO pins of the other devices
can drive the bias resistor.
The serial interface has 4 registers with address [0] to address [3]. Table 4 shows the content of each SPI
register. Registers 0 and 1 are read only. Registers 2 and three are read/write and control the gain and power of
the amplifier. Table 5 shows the data format of register 2 and Table 6 shows the data format of register 3.

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Table 4. SPI Registers


Address

Read/Write

Name

Description

Default value [Hex]

Revision ID

Revision of the product

1 (first revision)

Product ID

Identification of the
product

20

R/W

Power down

Power up/down of the


amplifier

R/W

Attenuation

Attenuation control

50

Table 5. Register 2 Definition


7

Reserved

OFF = 1,1: ON = 0,0

0
Reserved

Table 6. Register 3 Definition


7

Reserved

16dB

8dB

4dB

2dB

1dB

0.5dB

0.25dB

Gain [dB] = 26- (Register3 * 0.25); valid range is 0 to 80 in decimal.


1

10

11

12

13

14

15

16

D2

D1

D0
(LSB)

D2

D1

17

SCLK

SCSb

COMMAND FIELD

SDI

C7

C6

C5

C4

R/Wb

Reserved (3-bits)

DATA FIELD

C3

C2

C1

C0

A3

A2

A1

A0

D7
D6
(MSB)

D5

D4

D3

Write DATA

Address (4-bits)

D7
D6
(MSB)

D5

D4

D3

D0
(LSB)

Hi-Z
Read DATA

SDO

Data (8-bits)
Single Access Cycle

Figure 46. Serial Interface Protocol (SPI Compatible)

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Control Logic

LMH6881
CLK
CS
SDI

Clock out
Chip Select out
Data Out (MOSI)
Data In (MISO)

SDO
R
10 mA
Typ
For SDO (MISO) pin only:
VOH = R x 0.010A,
VOL = 0V
Recommended:
R = 250: to 400:

Figure 47. Internal Operation of the SDO pin

FIGURE OF MERIT: DYNAMIC RANGE FIGURE


The dynamic range figure (DRF) as illustrated in Figure 5, is defined as the input third order intercept point (IIP3)
minus the noise figure (NF). The combination of noise figure and linearity gives a good proxy for the total
dynamic range of an amplifier. In some ways this figure is similar to the SFDR of an analog-to-digital converter.
In contrast to an ADC, though, an amplifier will not have a full-scale input to use as a reference point. With
amplifiers, there is no one point where signal amplitude hits full scale. Yet, there are real limitations to how
large of a signal the amplifier can handle. Normally, the distortion products produced by the amplifier will
determine the upper limit to signal amplitude. The intermodulation intercept point is an imaginary point that gives
a well understood figure of merit for the maximum signal an amplifier can handle. For low-amplitude signals the
noise figure gives a threshold of the lowest signal that the amplifier can reproduce. By combining the third-order
input intercepts point and the noise figure the DRF gives a very good indication of the available dynamic range
offered.

POWER SUPPLY CONSIDERATIONS


The LMH6881 was designed to be operated on 5-V power supplies. The voltage range for VCC is 4.75 V to 5.25
V. Power-supply accuracy of 5% or better is advised. When operated on a board with high-speed digital signals it
is important to provide isolation between digital signal noise and the analog input pins. The SP16160CH1RB
reference board provides an example of good board layout.
The power supply pins are 19, 20, 23 and 24. Each supply pin should be decoupled with a low-inductance,
surface-mount ceramic capacitor of approximately 10 nF as close to the device as possible. When vias are used
to connect the bypass capacitors to a ground plane the vias should be configured for minimal parasitic
inductance. One method of reducing via inductance is to use multiple vias. For broadband systems two
capacitors per supply pin are advised.
To avoid undesirable signal transients the LMH6881 should not be powered on with large inputs signals present.
Careful planning of system power on sequencing is especially important to avoid damage to ADC inputs when an
ADC is used in the application.

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THERMAL CONSIDERATION
The LMH6881 is packaged in a thermally enhanced package. The exposed pad on the bottom of the package is
the primary means of removing heat from the package. It is recommended, but not necessary, that the exposed
pad be connected to the supply ground plane. In any case, the thermal dissipation of the device is largely
dependent on the attachment of the exposed pad to the system PCB. The exposed pad should be attached to as
much copper on the PCB as possible, preferably external layers of copper. It is also very important to maintain
good high-speed layout practices when designing a system board. Please refer to the LMH6881 evaluation board
for suggested layout techniques. The LMH6881EVAL evaluation board was designed for both signal integrity and
thermal dissipation. The LMH6881EVAL evaluation board uses higher performance dielectric (Rogers) on the top
layer for high frequency signal fidelity.

CONCLUSION
The LMH6881 is a fully differential amplifier optimized for signal-path applications up to 1000 MHz. The
LMH6881 has a 100- input impedance and a low (less than 0.5 ) impedance output. The gain is digitally
controlled over a 20-dB range from 26 dB to 6 dB. The LMH6881 is designed to replace fixed-gain differential
amplifiers with a single, flexible-gain device. It has been designed to provide good noise figure and OIP3 over the
entire gain range. This design feature is highlighted by the DRF of merit. Traditional variable gain amplifiers
generally have the best OIP3 and NF performance at maximum gain only.
Table 7. COMPATIBLE HIGH SPEED ANALOG-TO-DIGITAL CONVERTERS

24

Product Number

Max Sampling Rate (MSPS)

Resolution

Channels

ADC12D1800RF

1800

12

DUAL

ADC12D1600RF

1600

12

DUAL
DUAL

12D1000 RF

1000

12

ADC12D800RF

800

12

DUAL

ADS5400

1000

12

SINGLE

ADC12C105

105

12

SINGLE

ADC10D1500

1500

10

DUAL

ADC12C170

170

12

SINGLE

ADC12V170

170

12

SINGLE
SINGLE

ADC14C105

105

14

ADC14DS105

105

14

DUAL

ADC14155

155

14

SINGLE

ADC14V155

155

14

SINGLE

ADC16V130

130

16

SINGLE

ADC16DV160

160

16

DUAL

ADC08D500

500

DUAL
SINGLE

ADC08500

500

ADC08D1000

1000

DUAL

ADC081000

1000

SINGLE

ADC08D1500

1500

DUAL

ADC081500

1500

SINGLE

ADC08(B)3000

3000

SINGLE

ADC08100

100

SINGLE

ADCS9888

170

SINGLE

ADC08(B)200

200

SINGLE

ADC11C125

125

11

SINGLE

ADC11C170

170

11

SINGLE

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Copyright 20122013, Texas Instruments Incorporated

Product Folder Links: LMH6881

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Top-Side Markings

(3)

(4)

LMH6881SQ/NOPB

ACTIVE

WQFN

RTW

24

1000

Green (RoHS
& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 85

L6881SQ

LMH6881SQE/NOPB

ACTIVE

WQFN

RTW

24

250

Green (RoHS
& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 85

L6881SQ

LMH6881SQX/NOPB

ACTIVE

WQFN

RTW

24

4500

Green (RoHS
& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 85

L6881SQ

(1)

The marketing status values are defined as follows:


ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

Samples

PACKAGE MATERIALS INFORMATION


www.ti.com

21-Mar-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins


Type Drawing

LMH6881SQ/NOPB

WQFN

RTW

24

LMH6881SQE/NOPB

WQFN

RTW

LMH6881SQX/NOPB

WQFN

RTW

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

1000

178.0

12.4

4.3

4.3

1.3

8.0

12.0

Q1

24

250

178.0

12.4

4.3

4.3

1.3

8.0

12.0

Q1

24

4500

330.0

12.4

4.3

4.3

1.3

8.0

12.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION


www.ti.com

21-Mar-2013

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

LMH6881SQ/NOPB

WQFN

RTW

24

1000

210.0

185.0

35.0

LMH6881SQE/NOPB

WQFN

RTW

24

250

210.0

185.0

35.0

LMH6881SQX/NOPB

WQFN

RTW

24

4500

367.0

367.0

35.0

Pack Materials-Page 2

MECHANICAL DATA

RTW0024A

SQA24A (Rev B)

www.ti.com

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