1Gb: x4, x8, x16 DDR2 SDRAM Addendum

Features

DDR2 SDRAM Data Sheet Addendum

MT47H256M4 32 Meg x 4 x 8 banks
MT47H128M8 16 Meg x 8 x 8 banks
MT47H64M16 8 Meg x 16 x 8 banks

Features Options1 Marking

Configuration
This data sheet addendum provides information to 256 Meg x 4 (32 Meg x 4 x 8 banks) 256M4
add the X option indicating the Product Longevity 128 Meg x 8 (16 Meg x 8 x 8 banks) 128M8
Program for data sheet MT47H64M16NF-25E. This ad- 64 Meg x 16 (8 Meg x 16 x 8 banks) 64M16
dendum does not provide detailed information about FBGA package (Pb-free) x16
the device. Refer to the general market data sheet for a 84-ball FBGA (8mm x 12.5mm) Die HR
complete description of device functionality, operat- Rev :H
ing modes, and specifications. 84-ball FBGA (8mm x 12.5mm) Die NF
Rev :M
VDD = 1.8V 0.1V, V DDQ = 1.8V 0.1V FBGA package (Pb-free) x4, x8
JEDEC-standard 1.8V I/O (SSTL_18-compatible) 60-ball FBGA (8mm x 10mm) Die CF
Differential data strobe (DQS, DQS#) option Rev :H
4n-bit prefetch architecture 60-ball FBGA (8mm x 10mm) Die SH
Duplicate output strobe (RDQS) option for x8 Rev :M
FBGA package (lead solder) x16
DLL to align DQ and DQS transitions with CK
84-ball FBGA (8mm x 12.5mm) Die HW
8 internal banks for concurrent operation Rev :H
Programmable CAS latency (CL) FBGA package (lead solder) x4, x8
Posted CAS additive latency (AL) 60-ball FBGA (8mm x 10mm) Die JN
WRITE latency = READ latency - 1 tCK Rev :H
Selectable burst lengths (BL): 4 or 8 Timing cycle time
1.875ns @ CL = 7 (DDR2-1066) -187E
Adjustable data-output drive strength
2.5ns @ CL = 5 (DDR2-800) -25E
64ms, 8192-cycle refresh 3.0ns @ CL = 5 (DDR2-667) -3
On-die termination (ODT) Self refresh
Industrial temperature (IT) option Standard None
Automotive temperature (AT) option Low-power L
RoHS-compliant Special options
Product Longevity Program (PLP) X
Supports JEDEC clock jitter specification
Operating temperature
Commercial (0C T C +85C)2 None
Industrial (40C T C +95C; IT
40C T A +85C)
Revision :H / :M
Notes: 1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
2. For extended CT operating temperature see
the product data sheet.

PDF: 09005aef85a5c357
1gb_u68a_u88b_ddr2_addendum.pdf Rev. A 9/14 EN 1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
2014 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
 1Gb: x4, x8, x16 DDR2 SDRAM Addendum
Features

Table 1: Key Timing Parameters

Data Rate (MT/s)

Speed Grade CL = 3 CL = 4 CL = 5 CL = 6 CL = 7 tRC (ns)
-187E 400 533 800 800 1066 54
-25E 400 533 800 800 n/a 55
-3 400 533 667 n/a n/a 55

Table 2: Addressing

Parameter 256 Meg x 4 128 Meg x 8 64 Meg x 16

Configuration 32 Meg x 4 x 8 banks 16 Meg x 8 x 8 banks 8 Meg x 16 x 8 banks
Refresh count 8K 8K 8K
Row address A[13:0] (16K) A[13:0] (16K) A[12:0] (8K)
Bank address BA[2:0] (8) BA[2:0] (8) BA[2:0] (8)
Column address A[11, 9:0] (2K) A[9:0] (1K) A[9:0] (1K)

Figure 1: 1Gb DDR2 Part Numbers

Example Part Number: MT47H128M8SH-25E:M

- :
MT47H Configuration Package Speed Revision
{

Configuration :H/:M Revision

256 Meg x 4 256M4
128 Meg x 8 128M8 L Low power
64 Meg x 16 64M16 IT Industrial temperature

Package Special options

Pb-free Product Longevity Program (PLP) X
84-ball 8mm x 12.5mm FBGA HR
60-ball 8mm x 10.0mm FBGA CF Speed Grade
84-ball 8mm x 12.5mm FBGA NF -187E tCK = 1.875ns, CL = 7

60-ball 8mm x 10.0mm FBGA SH -25E tCK = 2.5ns, CL = 5

Lead solder -3 tCK = 3ns, CL = 5

84-ball 8mm x 12.5mm FBGA HW
60-ball 8mm x 10mm FBGA JN

Note: 1. Not all speeds and configurations are available in all packages.

FBGA Part Number System

Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Microns Web site:
http://www.micron.com.

PDF: 09005aef85a5c357
1gb_u68a_u88b_ddr2_addendum.pdf Rev. A 9/14 EN 2 Micron Technology, Inc. reserves the right to change products or specifications without notice.
2014 Micron Technology, Inc. All rights reserved.
 1Gb: x4, x8, x16 DDR2 SDRAM Addendum
Revision History

Revision History
Rev. A 5/14
Initial release; based on 1Gb: x4, x8, x16 DDR2 SDRAM, Rev. AA 04/14 data sheet
(09005aef8565148a)

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www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.

PDF: 09005aef85a5c357
1gb_u68a_u88b_ddr2_addendum.pdf Rev. A 9/14 EN 3 Micron Technology, Inc. reserves the right to change products or specifications without notice.
2014 Micron Technology, Inc. All rights reserved.