D D D D D D D D D D D D: TLV5618A 2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT Digital-To-Analog Converter With Power Down
D D D D D D D D D D D D: TLV5618A 2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT Digital-To-Analog Converter With Power Down
features applications
D Dual 12-Bit Voltage Output DAC D Digital Servo Control Loops
D Programmable Settling Time D Digital Offset and Gain Adjustment
– 3 µs in Fast Mode D Industrial Process Control
– 10 µs in Slow Mode
D Machine and Motion Control Devices
D Compatible With TMS320 and SPI Serial
D Mass Storage Devices
Ports
D Differential Nonlinearity <0.5 LSB Typ P, D OR JG PACKAGE
(TOP VIEW)
D Monotonic Over Temperature
D Direct Replacement for TLC5618A (C and I DIN 1 8 VDD
Suffixes) SCLK 2 7 OUTB
CS 3 6 REF
D Available in Q-Temp Automotive
OUTA 4 5 AGND
HighRel Automotive Applications
Configuration Control/Print Support
FK PACKAGE
Qualification to Automotive Standards (TOP VIEW)
VDD
DIN
NC
NC
NC
description
The TLV5618A is a dual 12-bit voltage output DAC 3 2 1 20 19
with a flexible 3-wire serial interface. The serial NC 4 18 NC
interface is compatible with TMS320, SPI, SCLK 5 17 OUTB
QSPI, and Microwire serial ports. It is NC 6 16 NC
programmed with a 16-bit serial string containing
4 control and 12 data bits. CS 7 15 REF
NC 8 14 NC
The resistor string output voltage is buffered by an
9 10 11 12 13
x2 gain rail-to-rail output buffer. The buffer
OUTA
AGND
NC
NC
NC
features a Class-AB output stage to improve
stability and reduce settling time. The program-
mable settling time of the DAC allows the designer
to optimize speed versus power dissipation.
Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It
is available in an 8-pin SOIC package in standard commercial and industrial temperature ranges.
The TLV5618AC is characterized for operation from 0°C to 70°C. The TLV5618AI is characterized for operation
from – 40°C to 85°C. The TLV5618AQ is characterized for operation from – 40°C to 125°C. The TLV5618AM
is characterized for operation from – 55°C to 125°C.
AVAILABLE OPTIONS
PACKAGE
TA PLASTIC DIP SOIC CERAMIC DIP 20 PAD LCCC
(P) (D) (JG) (FK)
0°C to 70°C TLV5618ACP TLV5618ACD — —
– 40°C to 85°C TLV5618AIP TLV5618AID — —
TLV5618AQD
– 40°C to 125°C — — —
TLV5618AQDR
– 55°C to 125°C — — TLV5618AMJG TLV5618AMFK
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
x2 OUTA
DIN
12 12-Bit 12
DAC A
Latch
SCLK Serial
Interface 12
and
Buffer
CS Control
12 12
12-Bit
DAC B
Latch x2 OUTB
Terminal Functions
TERMINAL
I/O/P DESCRIPTION
NAME NO.
AGND 5 P Ground
CS 3 I Chip select. Digital input active low, used to enable/disable inputs.
DIN 1 I Digital serial data input
OUTA 4 O DAC A analog voltage output
OUTB 7 O DAC B analog voltage output
REF 6 I Analog reference voltage input
SCLK 2 I Digital serial clock input
VDD 8 P Positive power supply
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage (VDD to AGND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Reference input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VDD + 0.3 V
Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VDD + 0.3 V
Operating free-air temperature range, TA: TLV5618AC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
TLV5618AI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
TLV5618AQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 125°C
TLV5618AM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
power supply
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
output specifications
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VO Output voltage range RL = 10 kΩ 0 VDD–0.4 V
VO = 4.096 V, 2.048 V,
Output load regulation accuracy ± 0.29 % FS
RL = 2 kΩ to 10 kΩ
reference input
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VI Input voltage range 0 VDD–1.5 V
RI Input resistance 10 MΩ
CI Input capacitance 5 pF
Fast 1.3 MHz
Reference input bandwidth REF = 0 2 Vpp + 1.024
0.2 1 024 V dc
Slow 525 kHz
Reference feedthrough REF = 1 Vpp at 1 kHz + 1.024 V dc (see Note 10) – 80 dB
NOTE 10: Reference feedthrough is measured at the DAC output with an input code = 0x000.
digital inputs
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IIH High-level digital input current VI = VDD 1 µA
IIL Low-level digital input current VI = 0 V –1 µA
Ci Input capacitance 8 pF
timing requirements
tw(L) tw(H)
SCLK X 1 2 3 4 5 15 16 X
tsu(D) th(D)
tsu(C16-CS)
tsu(CS-CK)
CS
TYPICAL CHARACTERISTICS
VO – Output Voltage – V
2.046 4.095 5 V Fast Mode, SOURCE
2.044 4.090
2.042 4.085
2.040 4.080
VDD = 3 V
VREF = 1 V
2.038 4.075
Full Scale
2.036 4.070
0 –0.01 –0.02 –0.5 –0.1 –0.2 –0.5 –0.8 –1 –2 0 –0.02 –0.04 –0.1 –0.2 –0.4 –0.8 –1 –2 –4
Load Current – mA Load Current – mA
Figure 2 Figure 3
VO – Output Voltage – V
0.14 0.25
0.12
0.20
0.10
0.08 0.15
0.00 0.00
0 0.01 0.02 0.05 0.1 0.2 0.5 0.8 1 2 0 0.02 0.04 0.1 0.2 0.4 0.8 1 2 4
Load Current – mA Load Current – mA
Figure 4 Figure 5
TYPICAL CHARACTERISTICS
I DD – Supply Current – mA
Full Scale
1.2 1.2
1.0 1.0
0.8 0.8
0.4 0.4
0.2 0.2
0.0 0.0
–40 –20 0 20 40 60 80 100 120 –40 –20 0 20 40 60 80 100 120
TA – Free-Air Temperature – C TA – Free-Air Temperature – C
Figure 6 Figure 7
–30 –30
–40 –40
3 V Slow Mode
–50 –50
3 V Fast Mode
5 V Slow Mode
–60 –60
–70 –70
5 V Fast Mode
–80 –80
–90 –90
1 10 100 1 10 100
f – Frequency – kHz f – Frequency – kHz
Figure 8 Figure 9
TYPICAL CHARACTERISTICS
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
–0.5
–1.0
–1.5
–2.0
–2.5
–3.0
–3.5
–4.0
0 512 1024 1536 2048 2560 3072 3584 4096
Digital Code
Figure 10
DIGITAL CODE
1.00
0.75
0.50
0.25
0.00
–0.25
–0.50
–0.75
–1.00
0 1024 2048 3072 4096
Digital Code
Figure 11
APPLICATION INFORMATION
general function
The TLV5618A is a dual 12-bit, single-supply DAC, based on a resistor-string architecture. It consists of a serial
interface, a speed and power down control logic, a resistor string, and a rail-to-rail output buffer.
The output voltage (full scale determined by the reference) is given by:
Where REF is the reference voltage and CODE is the digital input value within the range of 010 to 2n–1, where
n=12 (bits). The 16-bit data word, consisting of control bits and the new DAC value, is illustrated in the data
format section. A power-on reset initially resets the internal latches to a defined state (all bits zero).
serial interface
A falling edge of CS starts shifting the data bit-per-bit (starting with the MSB) to the internal register on the falling
edges of SCLK. After 16 bits have been transferred or CS rises, the content of the shift register is moved to the
target latches (DAC A, DAC B, BUFFER, CONTROL), depending on the control bits within the data word.
Figure 12 shows examples of how to connect the TLV5618A to TMS320, SPI, and Microwire.
Notes on SPI and Microwire: Before the controller starts the data transfer, the software has to generate a falling
edge on the pin connected to CS. If the word width is 8 bits (SPI and Microwire) two write operations must be
performed to program the TLV5618A. After the write operation(s), the holding registers or the control register
are updated automatically on the next positive clock edge following the 16th falling clock edge.
f + 1 + 20 MHz
sclkmax t )t
whmin wlmin
The maximum update rate is:
f + 1 + 1.25 MHz
updatemax ǒ whmin ) twlminǓ
16 t
Note that the maximum update rate is just a theoretical value for the serial interface, as the settling time of the
TLV5618A should also be considered.
APPLICATION INFORMATION
data format
The 16-bit data word for the TLV5618A consists of two parts:
D Program bits (D15..D12)
D New data (D11..D0)
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
R1 SPD PWR R0 MSB 12 Data bits LSB
The meaning of the 12 data bits depends on the register. If one of the DAC registers or the BUFFER is selected,
then the 12 data bits determine the new DAC value:
examples of operation
D Set DAC A output, select fast mode:
Write new DAC A value and update DAC A output:
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
1 1 0 0 New DAC A output value
The DAC A output is updated on the rising clock edge after D0 is sampled.
D Set DAC B output, select fast mode:
Write new DAC B value to BUFFER and update DAC B output:
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 1 0 0 New BUFFER content and DAC B output value
The DAC A output is updated on the rising clock edge after D0 is sampled.
D Set DAC A value, set DAC B value, update both simultaneously, select slow mode:
1. Write data for DAC B to BUFFER:
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 1 New DAC B value
APPLICATION INFORMATION
Output
Voltage
0V
DAC Code
Negative
Offset
APPLICATION INFORMATION
MECHANICAL DATA
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0.050 (1,27)
0.020 (0,51)
0.010 (0,25) M
0.014 (0,35)
14 8
0.010 (0,25)
1 7
0°–ā8°
0.044 (1,12)
A 0.016 (0,40)
Seating Plane
PINS **
8 14 16
DIM
MECHANICAL DATA
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINALS SHOWN
NO. OF A B
18 17 16 15 14 13 12
TERMINALS
** MIN MAX MIN MAX
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
4040140 / C 11/95
MECHANICAL DATA
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8 5
0.280 (7,11)
0.245 (6,22)
1 4
0.065 (1,65)
0.045 (1,14)
0.023 (0,58)
0°–15°
0.015 (0,38)
0.100 (2,54) 0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
MECHANICAL DATA
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE PACKAGE
0.400 (10,60)
0.355 (9,02)
8 5
0.260 (6,60)
0.240 (6,10)
1 4
0.310 (7,87)
0.020 (0,51) MIN
0.290 (7,37)
Seating Plane
0.021 (0,53)
0.010 (0,25) M
0.015 (0,38) 0.010 (0,25) NOM
4040082 / B 03/95
PACKAGING INFORMATION
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
5962-9955701Q2A ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC
5962-9955701QPA ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
TLV5618ACD ACTIVE SOIC D 8 75 Pb-Free CU NIPDAU Level-2-260C-1YEAR/
(RoHS) Level-1-220C-UNLIM
TLV5618ACDR ACTIVE SOIC D 8 2500 Pb-Free CU NIPDAU Level-2-260C-1YEAR/
(RoHS) Level-1-220C-UNLIM
TLV5618ACP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
TLV5618ACPE4 ACTIVE PDIP P 8 50 None Call TI Call TI
TLV5618AID ACTIVE SOIC D 8 75 Pb-Free CU NIPDAU Level-2-260C-1YEAR/
(RoHS) Level-1-220C-UNLIM
TLV5618AIDR ACTIVE SOIC D 8 2500 Pb-Free CU NIPDAU Level-2-260C-1YEAR/
(RoHS) Level-1-220C-UNLIM
TLV5618AIP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
TLV5618AIPE4 ACTIVE PDIP P 8 50 None Call TI Call TI
TLV5618AMFKB ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC
TLV5618AMJG ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
TLV5618AMJGB ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
TLV5618AQD ACTIVE SOIC D 8 75 None CU NIPDAU Level-1-220C-UNLIM
TLV5618AQDR ACTIVE SOIC D 8 2500 None CU NIPDAU Level-1-220C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
0.400 (10,16)
0.355 (9,00)
8 5
0.280 (7,11)
0.245 (6,22)
1 4
0.065 (1,65)
0.045 (1,14)
0.023 (0,58)
0°–15°
0.015 (0,38)
0.100 (2,54) 0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NO. OF A B
18 17 16 15 14 13 12
TERMINALS
** MIN MAX MIN MAX
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
4040140 / D 10/96
0.400 (10,60)
0.355 (9,02)
8 5
0.260 (6,60)
0.240 (6,10)
1 4
0.070 (1,78) MAX
0.325 (8,26)
0.020 (0,51) MIN
0.300 (7,62)
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
4040082/D 05/98
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