0% found this document useful (0 votes)
112 views23 pages

D D D D D D D D D D D D: TLV5618A 2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT Digital-To-Analog Converter With Power Down

Conversor Digital-Analogico
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
112 views23 pages

D D D D D D D D D D D D: TLV5618A 2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT Digital-To-Analog Converter With Power Down

Conversor Digital-Analogico
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 23

TLV5618A

2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT


DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

features applications
D Dual 12-Bit Voltage Output DAC D Digital Servo Control Loops
D Programmable Settling Time D Digital Offset and Gain Adjustment
– 3 µs in Fast Mode D Industrial Process Control
– 10 µs in Slow Mode
D Machine and Motion Control Devices
D Compatible With TMS320 and SPI Serial
D Mass Storage Devices
Ports
D Differential Nonlinearity <0.5 LSB Typ P, D OR JG PACKAGE
(TOP VIEW)
D Monotonic Over Temperature
D Direct Replacement for TLC5618A (C and I DIN 1 8 VDD
Suffixes) SCLK 2 7 OUTB
CS 3 6 REF
D Available in Q-Temp Automotive
OUTA 4 5 AGND
HighRel Automotive Applications
Configuration Control/Print Support
FK PACKAGE
Qualification to Automotive Standards (TOP VIEW)

VDD
DIN
NC

NC

NC
description
The TLV5618A is a dual 12-bit voltage output DAC 3 2 1 20 19
with a flexible 3-wire serial interface. The serial NC 4 18 NC
interface is compatible with TMS320, SPI, SCLK 5 17 OUTB
QSPI, and Microwire serial ports. It is NC 6 16 NC
programmed with a 16-bit serial string containing
4 control and 12 data bits. CS 7 15 REF
NC 8 14 NC
The resistor string output voltage is buffered by an
9 10 11 12 13
x2 gain rail-to-rail output buffer. The buffer

OUTA

AGND
NC

NC

NC
features a Class-AB output stage to improve
stability and reduce settling time. The program-
mable settling time of the DAC allows the designer
to optimize speed versus power dissipation.
Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It
is available in an 8-pin SOIC package in standard commercial and industrial temperature ranges.
The TLV5618AC is characterized for operation from 0°C to 70°C. The TLV5618AI is characterized for operation
from – 40°C to 85°C. The TLV5618AQ is characterized for operation from – 40°C to 125°C. The TLV5618AM
is characterized for operation from – 55°C to 125°C.
AVAILABLE OPTIONS
PACKAGE
TA PLASTIC DIP SOIC CERAMIC DIP 20 PAD LCCC
(P) (D) (JG) (FK)
0°C to 70°C TLV5618ACP TLV5618ACD — —
– 40°C to 85°C TLV5618AIP TLV5618AID — —
TLV5618AQD
– 40°C to 125°C — — —
TLV5618AQDR
– 55°C to 125°C — — TLV5618AMJG TLV5618AMFK

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

SPI and QSPI are trademarks of Motorola, Inc.


Microwire is a trademark of National Semiconductor Corporation.
PRODUCTION DATA information is current as of publication date. Copyright  2002, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments On products compliant to MIL-PRF-38535, all parameters are tested
standard warranty. Production processing does not necessarily include unless otherwise noted. On all other products, production
testing of all parameters. processing does not necessarily include testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

functional block diagram


REF AGND VDD

Power-On Power and


Reset Speed Control

x2 OUTA
DIN
12 12-Bit 12
DAC A
Latch
SCLK Serial
Interface 12
and
Buffer
CS Control
12 12
12-Bit
DAC B
Latch x2 OUTB

Terminal Functions
TERMINAL
I/O/P DESCRIPTION
NAME NO.
AGND 5 P Ground
CS 3 I Chip select. Digital input active low, used to enable/disable inputs.
DIN 1 I Digital serial data input
OUTA 4 O DAC A analog voltage output
OUTB 7 O DAC B analog voltage output
REF 6 I Analog reference voltage input
SCLK 2 I Digital serial clock input
VDD 8 P Positive power supply

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage (VDD to AGND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Reference input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VDD + 0.3 V
Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VDD + 0.3 V
Operating free-air temperature range, TA: TLV5618AC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
TLV5618AI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
TLV5618AQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 125°C
TLV5618AM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATING TABLE


TA ≤ 25
25°C
C DERATING FACTOR 70°C
TA = 70 C 85°C
TA = 85 C 125°C
TA = 125 C
PACKAGE
POWER RATING ABOVE TA = 25°C‡ POWER RATING POWER RATING POWER RATING
D 635 mW 5.08 mW/°C 407 mW 330 mW 127 mW
FK 1375 mW 11.00 mW/°C 880 mW 715 mW 275 mW
JG 1050 mW 8.40 mW/°C 672 mW 546 mW 210 mW
‡ This is the inverse of the traditional junction-to-ambient thermal resistance (RΘJA). Thermal resistances are not production tested and are for
informational purposes only.

recommended operating conditions


MIN NOM MAX UNIT
VDD = 5 V 4.5 5 5.5
Supply voltage
voltage, VDD V
VDD = 3 V 2.7 3 3.3
Power on reset 0.55 2 V
VDD = 2.7 V 2
High level digital input voltage,
High-level voltage VIH V
VDD = 5.5 V 2.4
VDD = 2.7 V 0.6
Low level digital input voltage,
Low-level voltage VIL V
VDD = 5.5 V 1
VDD = 5 V (see Note 1) AGND 2.048 VDD –1.5
Reference voltage,
voltage Vref to REF terminal V
VDD = 3 V (see Note 1) AGND 1.024 VDD – 1.5
Load resistance, RL 2 kΩ
Load capacitance, CL 100 pF
Clock frequency, f(CLK) 20 MHz
TLV5618AC 0 70
TLV5618AI – 40 85
Operating free
free-air
air temperature
temperature, TA °C
TLV5618AQ – 40 125
TLV5618AM – 55 125
NOTE 1: Due to the x2 output buffer, a reference input voltage ≥ (VDD–0.4 V)/2 causes clipping of the transfer function.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

electrical characteristics over recommended operating conditions (unless otherwise noted)

power supply
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VDD = 4.5 V to Fast 1.8 2.5


mA
5.5
55V Slow 08
0.8 1
C&I
suffixes Fast 1.6 2.2
No load, All inputs
in uts = AGND or VDD = 2.7 V to
IDD Power su ly current
supply mA
VDD, DAC latch = All ones 3.3
33V Slow 06
0.6 0.9
09

VDD = 2.7 V to M&Q Fast 18


1.8 2.3
23
mA
5.5 V suffixes Slow 0.8 1
Power down supply current 1 µA
Zero scale, See Note 2 –65
PSRR Power supply rejection ratio dB
Full scale, See Note 3 –65
NOTES: 2. Power supply rejection ratio at zero scale is measured by varying VDD and is given by:
PSRR = 20 log [(EZS(VDDmax) – EZS(VDDmin)/VDDmax]
3. Power supply rejection ratio at full scale is measured by varying VDD and is given by:
PSRR = 20 log [(EG(VDDmax) – EG(VDDmin)/VDDmax]

static DAC specifications


PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Resolution 12 bits
INL Integral nonlinearity See Note 4 ±2 ±4 LSB
DNL Differential nonlinearity See Note 5 ± 0.5 ±1 LSB
Zero-scale error (offset error at zero
EZS See Note 6 ± 12 mV
scale)
Zero-scale-error temperature
EZS (TC) See Note 7 3 ppm/°C
coefficient
VDD = 4.5 V – 5.5 V ± 0.29
C & I suffixes % full
f ll
EG Gain error See Note 8 VDD = 2.7 V – 3.3 V ± 0.6
scale V
M & Q suffixes VDD = 2.7 V – 5.5 V ± 0.6
EG (TC) Gain-error temperature coefficient See Note 9 1 ppm/°C
NOTES: 4. The relative accuracy of integral nonlinearity (INL), sometimes referred to as linearity error, is the maximum deviation of the output
from the line between zero and full scale, excluding the effects of zero-code and full-scale errors.
5. The differential nonlinearity (DNL), sometimes referred to as differential error, is the difference between the measured and ideal
1-LSB amplitude change of any two adjacent codes.
6. Zero-scale error is the deviation from zero voltage output when the digital input code is zero.
7. Zero-scale-error temperature coefficient is given by: EZS TC = [EZS (Tmax) – EZS (Tmin)]/2Vref × 106/(Tmax – Tmin).
8. Gain error is the deviation from the ideal output (2Vref – 1 LSB) with an output load of 10 kΩ.
9. Gain temperature coefficient is given by: EG TC = [EG (Tmax) – Eg (Tmin)]/2Vref × 106/(Tmax – Tmin).

output specifications
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VO Output voltage range RL = 10 kΩ 0 VDD–0.4 V
VO = 4.096 V, 2.048 V,
Output load regulation accuracy ± 0.29 % FS
RL = 2 kΩ to 10 kΩ

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

electrical characteristics over recommended operating conditions (unless otherwise noted)


(continued)

reference input
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VI Input voltage range 0 VDD–1.5 V
RI Input resistance 10 MΩ
CI Input capacitance 5 pF
Fast 1.3 MHz
Reference input bandwidth REF = 0 2 Vpp + 1.024
0.2 1 024 V dc
Slow 525 kHz
Reference feedthrough REF = 1 Vpp at 1 kHz + 1.024 V dc (see Note 10) – 80 dB
NOTE 10: Reference feedthrough is measured at the DAC output with an input code = 0x000.

digital inputs
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IIH High-level digital input current VI = VDD 1 µA
IIL Low-level digital input current VI = 0 V –1 µA
Ci Input capacitance 8 pF

analog output dynamic performance


PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Fast 1 3
ts(FS) Output settling time,
time full scale RL = 10 kΩ,
kΩ CL = 100 pF
pF, See Note 11 µss
Slow 3 10
Fast 1
ts(CC) time code to code
Output settling time, RL = 10 kΩ,
kΩ CL = 100 pF
pF, See Note 12 µss
Slow 2
Fast 3
SR Slew rate RL = 10 kΩ,
kΩ CL = 100 pF
pF, See Note 13 V/ s
V/µs
Slow 0.5
Glitch energy DIN = 0 to 1, FCLK = 100 kHz, CS = VDD 5 nV–s
SNR Signal-to-noise ratio 76
SINAD Signal-to-noise + distortion fs = 102 kSPS, fout = 1 kHz, RL = 10 kΩ, 68
dB
THD Total harmonic distortion CL = 100 pF –68
SFDR Spurious free dynamic range 72
NOTES: 11. Settling time is the time for the output signal to remain within ± 0.5 LSB of the final measured value for a digital input code change
of 0x020 to 0xFDF and 0xFDF to 0x020 respectively. Not tested, assured by design.
12. Settling time is the time for the output signal to remain within ± 0.5 LSB of the final measured value for a digital input code change
of one count. Not tested, assured by design.
13. Slew rate determines the time it takes for a change of the DAC output from 10% to 90% of full-scale voltage.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

digital input timing requirements


MIN NOM MAX UNIT
VDD = 5 V 5
C and I suffixes ns
tsu(CS-CK) Setup time, CS low before first negative SCLK edge
Setu VDD = 3 V 10
Q and M suffixes 10 ns
tsu(C16-CS) th
Setup time, 16 negative SCLK edge before CS rising edge 10 ns
tw(H) SCLK pulse width high 25 ns
tw(L) SCLK pulse width low 25 ns
VDD = 5 V 5
C and I suffixes
tsu(D) Setup time, data ready before SCLK falling edge
Setu VDD = 3 V 10 ns
Q and M suffixes 8
VDD = 5 V 5
C and I suffixes
th(D) Hold time, data held valid after SCLK falling
g edge
g VDD = 3 V 10 ns
Q and M suffixes 10
VDD = 5 V 25
th(CSH) Hold time,
time CS high between cycles ns
VDD = 3 V 50

timing requirements
tw(L) tw(H)

SCLK X 1 2 3 4 5 15 16 X

tsu(D) th(D)

DIN X D15 D14 D13 D12 D1 D0 X

tsu(C16-CS)
tsu(CS-CK)

CS

Figure 1. Timing Diagram

6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

TYPICAL CHARACTERISTICS

OUTPUT VOLTAGE OUTPUT VOLTAGE


vs vs
LOAD CURRENT LOAD CURRENT
2.050 4.105
3 V Slow Mode, SOURCE VDD = 5 V
5 V Slow Mode, SOURCE VREF = 2 V
2.048 4.100 Full Scale

3 V Fast Mode, SOURCE


VO – Output Voltage – V

VO – Output Voltage – V
2.046 4.095 5 V Fast Mode, SOURCE

2.044 4.090

2.042 4.085

2.040 4.080
VDD = 3 V
VREF = 1 V
2.038 4.075
Full Scale

2.036 4.070
0 –0.01 –0.02 –0.5 –0.1 –0.2 –0.5 –0.8 –1 –2 0 –0.02 –0.04 –0.1 –0.2 –0.4 –0.8 –1 –2 –4
Load Current – mA Load Current – mA

Figure 2 Figure 3

OUTPUT VOLTAGE OUTPUT VOLTAGE


vs vs
LOAD CURRENT LOAD CURRENT
0.20 0.35
VDD = 3 V VDD = 5 V
0.18 VREF = 1 V VREF = 2 V
Zero Scale 0.30 Zero Scale
0.16
3 V Slow Mode, SINK 5 V Slow Mode, SINK
VO– Output Voltage – V

VO – Output Voltage – V

0.14 0.25

0.12
0.20
0.10

0.08 0.15

5 V Fast Mode, SINK


0.06
3 V Fast Mode, SINK 0.10
0.04
0.05
0.02

0.00 0.00
0 0.01 0.02 0.05 0.1 0.2 0.5 0.8 1 2 0 0.02 0.04 0.1 0.2 0.4 0.8 1 2 4
Load Current – mA Load Current – mA

Figure 4 Figure 5

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

TYPICAL CHARACTERISTICS

SUPPLY CURRENT SUPPLY CURRENT


vs vs
FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE
1.8 1.8
VDD = 3 V
VREF = 1 V
1.6 1.6
Full Scale Fast Mode Fast Mode
VDD = 5 V
1.4 1.4 VREF = 2 V
I DD – Supply Current – mA

I DD – Supply Current – mA
Full Scale
1.2 1.2

1.0 1.0

0.8 0.8

0.6 Slow Mode 0.6 Slow Mode

0.4 0.4

0.2 0.2

0.0 0.0
–40 –20 0 20 40 60 80 100 120 –40 –20 0 20 40 60 80 100 120
TA – Free-Air Temperature – C TA – Free-Air Temperature – C
Figure 6 Figure 7

TOTAL HARMONIC DISTORTION TOTAL HARMONIC DISTORTION


vs vs
FREQUENCY FREQUENCY
0 0

–10 VREF = 1 V + 1 VP/P Sinewave, –10 VREF = 1 V + 1 VP/P Sinewave,


THD – Total Harmonic Distortion – dB

THD – Total Harmonic Distortion – dB

Output Full Scale Output Full Scale


–20 –20

–30 –30

–40 –40
3 V Slow Mode
–50 –50
3 V Fast Mode
5 V Slow Mode
–60 –60

–70 –70
5 V Fast Mode
–80 –80

–90 –90
1 10 100 1 10 100
f – Frequency – kHz f – Frequency – kHz

Figure 8 Figure 9

8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

TYPICAL CHARACTERISTICS

INTEGRAL NONLINEARITY ERROR


vs
DIGITAL CODE
INL – Integral Nonlinearity Error – LSB

4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
–0.5
–1.0
–1.5
–2.0
–2.5
–3.0
–3.5
–4.0
0 512 1024 1536 2048 2560 3072 3584 4096

Digital Code

Figure 10

DIFFERENTIAL NONLINEARITY ERROR


vs
DNL – Differential Nonlinearity Error – LSB

DIGITAL CODE
1.00
0.75
0.50
0.25
0.00
–0.25
–0.50
–0.75
–1.00
0 1024 2048 3072 4096
Digital Code

Figure 11

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

APPLICATION INFORMATION

general function
The TLV5618A is a dual 12-bit, single-supply DAC, based on a resistor-string architecture. It consists of a serial
interface, a speed and power down control logic, a resistor string, and a rail-to-rail output buffer.
The output voltage (full scale determined by the reference) is given by:

2 REF CODE [V]


2n

Where REF is the reference voltage and CODE is the digital input value within the range of 010 to 2n–1, where
n=12 (bits). The 16-bit data word, consisting of control bits and the new DAC value, is illustrated in the data
format section. A power-on reset initially resets the internal latches to a defined state (all bits zero).

serial interface
A falling edge of CS starts shifting the data bit-per-bit (starting with the MSB) to the internal register on the falling
edges of SCLK. After 16 bits have been transferred or CS rises, the content of the shift register is moved to the
target latches (DAC A, DAC B, BUFFER, CONTROL), depending on the control bits within the data word.
Figure 12 shows examples of how to connect the TLV5618A to TMS320, SPI, and Microwire.

TMS320 TLV5618A SPI TLV5618A Microwire TLV5618A


DSP FSX CS I/O CS I/O CS
DX DIN MOSI DIN SO DIN
CLKX SCLK SCK SCLK SK SCLK

Figure 12. Three-Wire Interface

Notes on SPI and Microwire: Before the controller starts the data transfer, the software has to generate a falling
edge on the pin connected to CS. If the word width is 8 bits (SPI and Microwire) two write operations must be
performed to program the TLV5618A. After the write operation(s), the holding registers or the control register
are updated automatically on the next positive clock edge following the 16th falling clock edge.

serial clock frequency and update rate


The maximum serial clock frequency is given by:

f + 1 + 20 MHz
sclkmax t )t
whmin wlmin
The maximum update rate is:

f + 1 + 1.25 MHz
updatemax ǒ whmin ) twlminǓ
16 t

Note that the maximum update rate is just a theoretical value for the serial interface, as the settling time of the
TLV5618A should also be considered.

10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

APPLICATION INFORMATION

data format
The 16-bit data word for the TLV5618A consists of two parts:
D Program bits (D15..D12)
D New data (D11..D0)
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
R1 SPD PWR R0 MSB 12 Data bits LSB

SPD: Speed control bit 1 → fast mode 0 → slow mode


PWR: Power control bit 1 → power down 0 → normal operation
On power up, SPD and PWD are reset to 0 (slow mode and normal operation)
The following table lists all possible combinations of register-select bits:
register-select bits
R1 R0 REGISTER
0 0 Write data to DAC B and BUFFER
0 1 Write data to BUFFER
1 0 Write data to DAC A and update DAC B with BUFFER content
1 1 Reserved

The meaning of the 12 data bits depends on the register. If one of the DAC registers or the BUFFER is selected,
then the 12 data bits determine the new DAC value:

examples of operation
D Set DAC A output, select fast mode:
Write new DAC A value and update DAC A output:
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
1 1 0 0 New DAC A output value

The DAC A output is updated on the rising clock edge after D0 is sampled.
D Set DAC B output, select fast mode:
Write new DAC B value to BUFFER and update DAC B output:
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 1 0 0 New BUFFER content and DAC B output value

The DAC A output is updated on the rising clock edge after D0 is sampled.
D Set DAC A value, set DAC B value, update both simultaneously, select slow mode:
1. Write data for DAC B to BUFFER:
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 1 New DAC B value

2. Write new DAC A value and update DAC A and B simultaneously:


D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
1 0 0 0 New DAC A value

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

APPLICATION INFORMATION

examples of operation (continued)


Both outputs are updated on the rising clock edge after D0 from the DAC A data word is sampled.
D Set power-down mode:
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
X X 1 X X X X X X X X X X X X X
X = Don’t care

linearity, offset, and gain error using single ended supplies


When an amplifier is operated from a single supply, the voltage offset can still be either positive or negative. With
a positive offset, the output voltage changes on the first code change. With a negative offset, the output voltage
may not change with the first code, depending on the magnitude of the offset voltage.
The output amplifier attempts to drive the output to a negative voltage. However, because the most negative
supply rail is ground, the output cannot drive below ground and clamps the output at 0 V.
The output voltage then remains at zero until the input code value produces a sufficient positive output voltage
to overcome the negative offset voltage, resulting in the transfer function shown in Figure 13.

Output
Voltage

0V
DAC Code
Negative
Offset

Figure 13. Effect of Negative Offset (Single Supply)


This offset error, not the linearity error, produces this breakpoint. The transfer function would have followed the
dotted line if the output buffer could drive below the ground rail.
For a DAC, linearity is measured between zero-input code (all inputs 0) and full-scale code (all inputs 1) after
offset and full scale are adjusted out or accounted for in some way. However, single supply operation does not
allow for adjustment when the offset is negative due to the breakpoint in the transfer function. So the linearity
is measured between full-scale code and the lowest code that produces a positive output voltage.

12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

APPLICATION INFORMATION

definitions of specifications and terminology


integral nonlinearity (INL)
The relative accuracy or integral nonlinearity (INL), sometimes referred to as linearity error, is the maximum
deviation of the output from the line between zero and full scale excluding the effects of zero code and full-scale
errors.
differential nonlinearity (DNL)
The differential nonlinearity (DNL), sometimes referred to as differential error, is the difference between the
measured and ideal 1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage
changes in the same direction (or remains constant) as a change in the digital input code.
zero-scale error (EZS)
Zero-scale error is defined as the deviation of the output from 0 V at a digital input value of 0.
gain error (EG)
Gain error is the error in slope of the DAC transfer function.
total harmonic distortion (THD)
THD is the ratio of the rms value of the first six harmonic components to the value of the fundamental signal.
The value for THD is expressed in decibels.
signal-to-noise ratio + distortion (S/N+D)
S/N+D is the ratio of the rms value of the output signal to the rms sum of all other spectral components below
the Nyquist frequency, including harmonics but excluding dc. The value for S/N+D is expressed in decibels.
spurious free dynamic range (SFDR)
Spurious free dynamic range is the difference between the rms value of the output signal and the rms value of
the largest spurious signal within a specified bandwidth. The value for SFDR is expressed in decibels.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

MECHANICAL DATA
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN

0.050 (1,27)

0.020 (0,51)
0.010 (0,25) M
0.014 (0,35)
14 8

0.008 (0,20) NOM


0.244 (6,20)
0.228 (5,80)
0.157 (4,00)
0.150 (3,81)
Gage Plane

0.010 (0,25)
1 7
0°–ā8°
0.044 (1,12)
A 0.016 (0,40)

Seating Plane

0.010 (0,25) 0.004 (0,10)


0.069 (1,75) MAX
0.004 (0,10)

PINS **
8 14 16
DIM

0.197 0.344 0.394


A MAX
(5,00) (8,75) (10,00)

0.189 0.337 0.386


A MIN
(4,80) (8,55) (9,80)
4040047 / D 10/96

NOTES: A. All linear dimensions are in inches (millimeters).


B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012

14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

MECHANICAL DATA
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINALS SHOWN

NO. OF A B
18 17 16 15 14 13 12
TERMINALS
** MIN MAX MIN MAX

0.342 0.358 0.307 0.358


19 11 20
(8,69) (9,09) (7,80) (9,09)
20 10 0.442 0.458 0.406 0.458
28
(11,23) (11,63) (10,31) (11,63)
21 9
B SQ 0.640 0.660 0.495 0.560
22 8 44
(16,26) (16,76) (12,58) (14,22)
A SQ
23 7 0.740 0.761 0.495 0.560
52
(18,78) (19,32) (12,58) (14,22)
24 6
0.938 0.962 0.850 0.858
68
(23,83) (24,43) (21,6) (21,8)
25 5
1.141 1.165 1.047 1.063
84
(28,99) (29,59) (26,6) (27,0)
26 27 28 1 2 3 4

0.020 (0,51) 0.080 (2,03)


0.010 (0,25) 0.064 (1,63)

0.020 (0,51)
0.010 (0,25)

0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)

0.028 (0,71) 0.045 (1,14)


0.022 (0,54) 0.035 (0,89)
0.050 (1,27)

4040140 / C 11/95

NOTES: A. All linear dimensions are in inches (millimeters).


B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold-plated.
E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 15


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

MECHANICAL DATA
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE

0.400 (10,16)
0.355 (9,00)

8 5

0.280 (7,11)
0.245 (6,22)

1 4
0.065 (1,65)
0.045 (1,14)

0.063 (1,60) 0.310 (7,87)


0.020 (0,51) MIN
0.015 (0,38) 0.290 (7,37)

0.200 (5,08) MAX


Seating Plane

0.130 (3,30) MIN

0.023 (0,58)
0°–15°
0.015 (0,38)
0.100 (2,54) 0.014 (0,36)
0.008 (0,20)

4040107/C 08/96

NOTES: A. All linear dimensions are in inches (millimeters).


B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8

16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265


TLV5618A
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
SLAS230H – JULY 1999 – REVISED JULY 2002

MECHANICAL DATA
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE PACKAGE

0.400 (10,60)
0.355 (9,02)

8 5

0.260 (6,60)
0.240 (6,10)

1 4

0.070 (1,78) MAX

0.310 (7,87)
0.020 (0,51) MIN
0.290 (7,37)

0.200 (5,08) MAX

Seating Plane

0.125 (3,18) MIN

0.100 (2,54) 0°–ā15°

0.021 (0,53)
0.010 (0,25) M
0.015 (0,38) 0.010 (0,25) NOM

4040082 / B 03/95

NOTES: A. All linear dimensions are in inches (millimeters).


B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 17


PACKAGE OPTION ADDENDUM
www.ti.com 11-Mar-2005

PACKAGING INFORMATION

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
5962-9955701Q2A ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC
5962-9955701QPA ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
TLV5618ACD ACTIVE SOIC D 8 75 Pb-Free CU NIPDAU Level-2-260C-1YEAR/
(RoHS) Level-1-220C-UNLIM
TLV5618ACDR ACTIVE SOIC D 8 2500 Pb-Free CU NIPDAU Level-2-260C-1YEAR/
(RoHS) Level-1-220C-UNLIM
TLV5618ACP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
TLV5618ACPE4 ACTIVE PDIP P 8 50 None Call TI Call TI
TLV5618AID ACTIVE SOIC D 8 75 Pb-Free CU NIPDAU Level-2-260C-1YEAR/
(RoHS) Level-1-220C-UNLIM
TLV5618AIDR ACTIVE SOIC D 8 2500 Pb-Free CU NIPDAU Level-2-260C-1YEAR/
(RoHS) Level-1-220C-UNLIM
TLV5618AIP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
TLV5618AIPE4 ACTIVE PDIP P 8 50 None Call TI Call TI
TLV5618AMFKB ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC
TLV5618AMJG ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
TLV5618AMJGB ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
TLV5618AQD ACTIVE SOIC D 8 75 None CU NIPDAU Level-1-220C-UNLIM
TLV5618AQDR ACTIVE SOIC D 8 2500 None CU NIPDAU Level-1-220C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 1
MECHANICAL DATA

MCER001A – JANUARY 1995 – REVISED JANUARY 1997

JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE

0.400 (10,16)
0.355 (9,00)

8 5

0.280 (7,11)
0.245 (6,22)

1 4
0.065 (1,65)
0.045 (1,14)

0.063 (1,60) 0.310 (7,87)


0.020 (0,51) MIN
0.015 (0,38) 0.290 (7,37)

0.200 (5,08) MAX


Seating Plane

0.130 (3,30) MIN

0.023 (0,58)
0°–15°
0.015 (0,38)
0.100 (2,54) 0.014 (0,36)
0.008 (0,20)

4040107/C 08/96

NOTES: A. All linear dimensions are in inches (millimeters).


B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265


MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER


28 TERMINAL SHOWN

NO. OF A B
18 17 16 15 14 13 12
TERMINALS
** MIN MAX MIN MAX

0.342 0.358 0.307 0.358


19 11 20
(8,69) (9,09) (7,80) (9,09)
20 10 0.442 0.458 0.406 0.458
28
(11,23) (11,63) (10,31) (11,63)
21 9
B SQ 0.640 0.660 0.495 0.560
22 8 44
(16,26) (16,76) (12,58) (14,22)
A SQ
23 7 0.739 0.761 0.495 0.560
52
(18,78) (19,32) (12,58) (14,22)
24 6
0.938 0.962 0.850 0.858
68
(23,83) (24,43) (21,6) (21,8)
25 5
1.141 1.165 1.047 1.063
84
(28,99) (29,59) (26,6) (27,0)
26 27 28 1 2 3 4

0.020 (0,51) 0.080 (2,03)


0.010 (0,25) 0.064 (1,63)

0.020 (0,51)
0.010 (0,25)

0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)

0.028 (0,71) 0.045 (1,14)


0.022 (0,54) 0.035 (0,89)
0.050 (1,27)

4040140 / D 10/96

NOTES: A. All linear dimensions are in inches (millimeters).


B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265


MECHANICAL DATA

MPDI001A – JANUARY 1995 – REVISED JUNE 1999

P (R-PDIP-T8) PLASTIC DUAL-IN-LINE

0.400 (10,60)
0.355 (9,02)
8 5

0.260 (6,60)
0.240 (6,10)

1 4
0.070 (1,78) MAX

0.325 (8,26)
0.020 (0,51) MIN
0.300 (7,62)

0.015 (0,38)

Gage Plane
0.200 (5,08) MAX
Seating Plane

0.125 (3,18) MIN 0.010 (0,25) NOM

0.100 (2,54) 0.430 (10,92)


MAX
0.021 (0,53)
0.010 (0,25) M
0.015 (0,38)

4040082/D 05/98

NOTES: A. All linear dimensions are in inches (millimeters).


B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001

For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265


IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:

Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless

Mailing Address: Texas Instruments


Post Office Box 655303 Dallas, Texas 75265

Copyright  2005, Texas Instruments Incorporated

You might also like