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32GB DDR5 RDIMM ECC Memory Specs

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17 views8 pages

32GB DDR5 RDIMM ECC Memory Specs

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lawrence0721
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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32GB (x80, ECC, DR) 288-Pin DDR5 RDIMM

Features

DDR5 SDRAM RDIMM Addendum


MTC20F2085S1RC – 32GB
16Gb Die Revision A
Features Figure 1: 288-Pin DDR5 RDIMM (R/C-E0)

Information provided here is in addition to or super-


sedes information provided in the Micron DDR5 U_TS0 U_TS1

RDIMM Core data sheet. U1 U2 U3 U4 U5


U_RCD1
U6 U7 U8 U9 U10

• DDR5 functionality and operations supported as


defined in the component data sheet Sensitive parts:
Primary side
• Features and specifications defined in the Micron U_SPD1

DDR5 RDIMM core data sheet


U_PMIC1

• 288-pin, DDR5 registered dual in-line memory U11 U12 U13 U14 U15 U16 U17 U18 U19 U20
module (DDR5 RDIMM)
• Fast data transfer rate: PC5-4800
Secondary side
• 32GB (4Gig x 80)
• Dual-rank Options Marking
• 32 internal banks; 8 groups of 4 banks each • Operating temperature
– Commercial (0°C ≤ TOPER ≤ 95°C) C
• Frequency/CAS latency
– 0.416ns @ CL = 40 (DDR5-4800) 48B

Table 1: Addressing
Parameter 32GB
Row address1 64K (R0-R15)

Column address1 1K (C0-C9)

Device bank group address1 8 (BG0-BG2)

Device bank address per bank group1 4 (BA0-BA1)

Device configuration 16Gb (2Gb x 8), 32 banks


Module rank address 2 (CS0_n, CS1_n)

Notes: 1. These parameters represent the logical address state of the CA bus for different commands. Refer to the command
truth table in the component data sheet.

Table 2: Part Numbers and Timing Parameters – 32GB Modules

Base device: MT60B2G8,1 16Gb DDR5 SDRAM Die Revision A


Part Number Module Configuration Module Memory Clock/ Clock Cycles
Density Bandwidth Data Rate (CL-nRCD-nRP)
MTC20F2085S1RC48BA1 32GB 4Gb x 80 38.4 GB/s 0.416ns/4800 MT/s 40-39-39

Notes: 1. The data sheet for the base device can be found on micron.com.

CCM005-802248454-9
mtc20f2085s1rc_drx8_3112_rdimm.pdf - Rev. E 08/2021
1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2020 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

This datasheet has been downloaded from http://www.digchip.com at this page


32GB (x80, ECC, DR) 288-Pin DDR5 RDIMM
Important Notes and Warnings

Important Notes and Warnings


Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,
including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this document
if you obtain the product described herein from any unauthorized distributor or other source not authorized by
Micron.
Automotive Applications. Products are not designed or intended for use in automotive applications unless specifi-
cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-
utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of
non-automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and
conditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to
indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'
fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage
resulting from any use of non-automotive-grade products in automotive applications.
Critical Applications. Products are not authorized for use in applications in which failure of the Micron component
could result, directly or indirectly in death, personal injury, or severe property or environmental damage ("Critical
Applications"). Customer must protect against death, personal injury, and severe property and environmental
damage by incorporating safety design measures into customer's applications to ensure that failure of the Micron
component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron compo-
nent for any critical application, customer and distributor shall indemnify and hold harmless Micron and its subsid-
iaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims, costs,
damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product
liability, personal injury, or death arising in any way out of such critical application, whether or not Micron or its
subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the Micron
product.
Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems,
applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT
FAILURE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE
WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR
PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included in
customer's applications and products to eliminate the risk that personal injury, death, or severe property or envi-
ronmental damages will result from failure of any semiconductor component.
Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential
damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such damages are based on tort, warranty, breach
of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly autho-
rized representative.

CCM005-802248454-9
mtc20f2085s1rc_drx8_3112_rdimm.pdf - Rev. E 08/2021
2 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2020 Micron Technology, Inc. All rights reserved.
32GB (x80, ECC, DR) 288-Pin DDR5 RDIMM
DQ Map

DQ Map

Table 3: Component-to-Module DQ Map


Component Component
Reference Component Module Pin Reference Component Module Pin
Number DQ Module DQ Number Number DQ Module DQ Number
U1 0 3A 154 U2 0 11A 165
1 0A 7 1 8A 18
2 1A 9 2 9A 20
3 2A 152 3 10A 163
4 7A 161 4 15A 172
5 4A 14 5 12A 25
6 5A 16 6 13A 27
7 6A 159 7 14A 170
U3 0 19A 176 U4 0 27A 187
1 16A 29 1 24A 40
2 17A 31 2 25A 42
3 18A 174 3 26A 185
4 23A 183 4 31A 194
5 20A 36 5 28A 47
6 21A 38 6 29A 49
7 22A 181 7 30A 192
U5 0 CB3A 198 U6 0 CB3B 243
1 CB0A 51 1 CB0B 96
2 CB1A 53 2 CB1B 98
3 CB2A 196 3 CB2B 241
4 CB7A 205 4 CB7B 236
5 CB4A 58 5 CB4B 89
6 CB5A 60 6 CB5B 91
7 CB6A 203 7 CB6B 234
U7 0 3B 247 U8 0 11B 258
1 0B 100 1 8B 111
2 1B 102 2 9B 113
3 2B 245 3 10B 256
4 7B 254 4 15B 265
5 4B 107 5 12B 118
6 5B 109 6 13B 120
7 6B 252 7 14B 263

CCM005-802248454-9
mtc20f2085s1rc_drx8_3112_rdimm.pdf - Rev. E 08/2021
3 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2020 Micron Technology, Inc. All rights reserved.
32GB (x80, ECC, DR) 288-Pin DDR5 RDIMM
DQ Map

Table 3: Component-to-Module DQ Map (Continued)


Component Component
Reference Component Module Pin Reference Component Module Pin
Number DQ Module DQ Number Number DQ Module DQ Number
U9 0 19B 269 U10 0 27B 280
1 16B 122 1 24B 133
2 17B 124 2 25B 135
3 18B 267 3 26B 278
4 23B 276 4 31B 287
5 20B 129 5 28B 140
6 21B 131 6 29B 142
7 22B 274 7 30B 285
U11 0 24B 133 U12 0 16B 122
1 27B 280 1 19B 269
2 26B 278 2 18B 267
3 25B 135 3 17B 124
4 28B 140 4 20B 129
5 31B 287 5 23B 276
6 30B 285 6 22B 274
7 29B 142 7 21B 131
U13 0 8B 111 U14 0 0B 100
1 11B 258 1 3B 247
2 10B 256 2 2B 245
3 9B 113 3 1B 102
4 12B 118 4 4B 107
5 15B 265 5 7B 254
6 14B 263 6 6B 252
7 13B 120 7 5B 109
U15 0 CB0B 96 U16 0 CB0A 51
1 CB3B 243 1 CB3A 198
2 CB2B 241 2 CB2A 196
3 CB1B 98 3 CB1A 53
4 CB4B 89 4 CB4A 58
5 CB7B 236 5 CB7A 205
6 CB6B 234 6 CB6A 203
7 CB5B 91 7 CB5A 60

CCM005-802248454-9
mtc20f2085s1rc_drx8_3112_rdimm.pdf - Rev. E 08/2021
4 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2020 Micron Technology, Inc. All rights reserved.
32GB (x80, ECC, DR) 288-Pin DDR5 RDIMM
DQ Map

Table 3: Component-to-Module DQ Map (Continued)


Component Component
Reference Component Module Pin Reference Component Module Pin
Number DQ Module DQ Number Number DQ Module DQ Number
U17 0 24A 40 U18 0 16A 29
1 27A 187 1 19A 176
2 26A 185 2 18A 174
3 25A 42 3 17A 31
4 28A 47 4 20A 36
5 31A 194 5 23A 183
6 30A 192 6 22A 181
7 29A 49 7 21A 38
U19 0 8A 18 U20 0 0A 7
1 11A 165 1 3A 154
2 10A 163 2 2A 152
3 9A 20 3 1A 9
4 12A 25 4 4A 14
5 15A 172 5 7A 161
6 14A 170 6 6A 159
7 13A 27 7 5A 16

CCM005-802248454-9
mtc20f2085s1rc_drx8_3112_rdimm.pdf - Rev. E 08/2021
5 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2020 Micron Technology, Inc. All rights reserved.
32GB (x80, ECC, DR) 288-Pin DDR5 RDIMM
IDD Specifications

IDD Specifications
Table 4: DDR5 IDD Specifications and Conditions – 32GB (Die Revision A)

Module IDD is based on PMIC VIN_BULK 12V input current and typical operating range of temperature. Each IDD parameter
includes PMIC efficiency, RCD current and all DRAM current on all supplies (VDD, VDDQ, and VPP).

Parameter Symbol 4800 Units


Operating one bank ACTIVATE-PRECHARGE current IDD01 164 mA

Operating four bank ACTIVATE-PRECHARGE current IDD0F1 213 mA

Precharge standby current IDD2N2 147 mA

Precharge standby non-target command IDD2NT1 246 mA

Precharge power-down current IDD2P2 140 mA

Active standby current IDD3N2 150 mA

Active power-down current IDD3P2 144 mA

Operating burst read current IDD4R1 460 mA

Operating burst write current IDD4W1 578 mA

Operating burst write with write CRC current IDD4WC1 536 mA

Burst refresh (normal refresh mode) current IDD5B1 364 mA

Burst refresh (fine granularity refresh mode) current IDD5F1 242 mA

Burst refresh (same bank refresh mode) current IDD5C1 189 mA

Self refresh current IDD6N2 64 mA

Operating bank interleave read current IDD71 499 mA

Maximum power saving deep power down mode current IDD82 72 mA

Notes: 1. One module rank in this IDD/IDDQ/IPP condition, the other rank in IDD2N/IDDQ2N/IPP2N.
2. Both ranks in this IDD/IDDQ/IPP condition.

CCM005-802248454-9
mtc20f2085s1rc_drx8_3112_rdimm.pdf - Rev. E 08/2021
6 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2020 Micron Technology, Inc. All rights reserved.
32GB (x80, ECC, DR) 288-Pin DDR5 RDIMM
Functional Block Diagram

Functional Block Diagram


Figure 2: Functional Block Diagram
QACS1_A_n QACS1_B_n
QACS0_A_n QACS0_B_n
Channel A Channel B

DQS0A_t DQS0B_t Host Side DRAM Side


DQS0A_c DQS0B_c
CS_n DQS_t DQS_c CS_n DQS_t DQS_c CS_n DQS_t DQS_c CS_n DQS_t DQS_c DCS[1:0]A_n R QACS[1:0][B:A]_n:
DQ[7:0]A DQ[7:0] DQ[7:0] DQ[7:0]B DQ[7:0] DQ[7:0] DCS[1:0]B_n QBCS[1:0][B:A]_n:
E QACA[13:0][B:A]
Vss ZQ U1 Vss ZQ U20 Vss ZQ U7 Vss ZQ U14 DCA_[6:0]A
DCA_[6:0]B G QBCA[13:0][B:A]
DQS1A_t DQS1B_t ALERT_n DERROR_IN_[B:A]_n
I
DQS1A_c DQS1B_c LBDQ, RSP_A_n DLBD_[B:A]
CS_n DQS_t DQS_c CS_n DQS_t DQS_c CS_n DQS_t DQS_c CS_n DQS_t DQS_c LBDQS, RSP_B_n S DLBS_[B:A]
DQ[15:8]A DQ[7:0] DQ[7:0] DQ[15:8]B DQ[7:0] DQ[7:0] PAR_A T
Vss ZQ U2 Vss ZQ U19 Vss ZQ U8 Vss ZQ U13 PAR_B
E
DQS2A_t DQS2B_t HSCL R
DQS2A_c DQS2B_c HSDA

CS_n DQS_t DQS_c CS_n DQS_t DQS_c CS_n DQS_t DQS_c CS_n DQS_t DQS_c
&
Q[D:A]CK[A:B]_c
DQ[23:16]A DQ[7:0] DQ[7:0] DQ[23:16]B DQ[7:0] DQ[7:0] CK_c P
Vss ZQ U3 Vss ZQ U18 Vss ZQ U9 Vss ZQ U12 CK_t
S Q[D:A]CK[A:B]_t

DQS3A_t DQS3B_t C
DQS3A_c DQS3B_c
RESET_n QRST[B:A]
CS_n DQS_t DQS_c CS_n DQS_t DQS_c CS_n DQS_t DQS_c CS_n DQS_t DQS_c ZQ
DQ[31:24]A DQ[7:0] DQ[7:0] DQ[31:24]B DQ[7:0] DQ[7:0]
VSS
Vss ZQ U4 Vss ZQ U17 Vss ZQ U10 Vss ZQ U11

DQS4A_t DQS4B_t
DQS4A_c DQS4B_c
VIN_BULK
CS_n DQS_t DQS_c CS_n DQS_t DQS_c CS_n DQS_t DQS_c CS_n DQS_t DQS_c
VIN_MGMT Output Rail A and B (VDD=1.1V)
CB[7:0]A DQ[7:0] DQ[7:0] CB[7:0]B DQ[7:0] DQ[7:0] PCAMP Power Managment
Vss ZQ U5 Vss ZQ U16 Vss ZQ U6 Vss ZQ U15 LSCL Intigrated Circuit Output Rail C (VDDQ=1.1V)
LSDA
(PMIC) Output Rail D (VPP=1.8V)
1.0V LDO output
1.8V LDO output
AGND PGND

Vss Vss

Host Bus Local Bus


HSCL LSCL
SPD5 Hub
HSDA LSDA
HSA (SPD_ID)

VDDSPD (1.8V) VDDIO (1.0V)

Notes: 1. The ZQ ball on each DDR5 component is connected to an external 240Ω ±1% resistor that is tied to ground. It is
used for the calibration of the component’s ODT and output driver.
2. Functional block diagram is for reference only.

CCM005-802248454-9
mtc20f2085s1rc_drx8_3112_rdimm.pdf - Rev. E 08/2021
7 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2020 Micron Technology, Inc. All rights reserved.
32GB (x80, ECC, DR) 288-Pin DDR5 RDIMM
Revision History

Revision History
Rev. E – 08/2021
• Production Release

Rev. D – 02/2021
• Preliminary Release

Rev. C – 01/2021
• Preliminary Release

Rev. B – 06/2020
• Preliminary Release

Rev. A – 06/2020
• Preliminary Release

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006


208-368-4000, micron.com/support
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization sometimes
occur.
CCM005-802248454-9
mtc20f2085s1rc_drx8_3112_rdimm.pdf - Rev. E 08/2021
8 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2020 Micron Technology, Inc. All rights reserved.

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