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LM2907-N, LM2917-N
SNAS555D – JUNE 2000 – REVISED DECEMBER 2016

LM2907 and LM2917 Frequency to Voltage Converter

1 Features 3 Description
1• Ground Referenced Tachometer Input Interfaces The LM2907 and LM2917 devices are monolithic
Directly With Variable Reluctance Magnetic frequency-to-voltage converters with a high gain op
amp designed to operate a relay, lamp, or other load
Pickups
when the input frequency reaches or exceeds a
• Op Amp Has Floating Transistor Output selected rate. The tachometer uses a charge pump
• 50-mA Sink or Source to Operate Relays, technique and offers frequency doubling for low-
Solenoids, Meters, or LEDs ripple, full-input protection in two versions (8-pin
• Frequency Doubling For Low Ripple LM2907 and LM2917), and its output swings to
ground for a zero frequency input.
• Tachometer Has Built-In Hysteresis With Either
Differential Input or Ground Referenced Input The op amp is fully compatible with the tachometer
and has a floating transistor as its output. This feature
• ±0.3% Linearity (Typical) allows either a ground or supply referred load of up to
• Ground-Referenced Tachometer is Fully Protected 50 mA. The collector may be taken above VCC up to a
From Damage Due to Swings Above VCC and maximum VCE of 28 V.
Below Ground
The two basic configurations offered include an 8-pin
• Output Swings to Ground For Zero Frequency device with a ground-referenced tachometer input
Input and an internal connection between the tachometer
• Easy to Use; VOUT = fIN × VCC × R1 × C1 output and the op amp noninverting input. This
version is well suited for single speed or frequency
• Zener Regulator on Chip allows Accurate and
switching or fully buffered frequency-to-voltage
Stable Frequency to Voltage or Current conversion applications.
Conversion (LM2917)
Device Information(1)
2 Applications PART NUMBER PACKAGE BODY SIZE (NOM)
• Over- and Under-Speed Sensing PDIP (8) 6.35 mm × 9.81 mm
• Frequency-to-Voltage Conversion (Tachometer) LM2907-N, PDIP (14) 6.35 mm × 19.177 mm
• Speedometers LM2917-N SOIC (8) 3.91 mm × 4.90 mm
• Breaker Point Dwell Meters SOIC (14) 3.91 mm × 8.65 mm

• Hand-Held Tachometers (1) For all available packages, see the orderable addendum at
the end of the data sheet.
• Speed Governors
• Cruise Control
• Automotive Door Lock Control
• Clutch Control
• Horn Control
• Touch or Sound Switches
Minimum Component Tachometer Diagram

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 9.3 Feature Description................................................. 11
2 Applications ........................................................... 1 9.4 Device Functional Modes........................................ 12
3 Description ............................................................. 1 10 Application and Implementation........................ 13
4 Revision History..................................................... 2 10.1 Application Information.......................................... 13
10.2 Typical Applications .............................................. 14
5 Description (continued)......................................... 3
6 Pin Configuration and Functions ......................... 3 11 Power Supply Recommendations ..................... 27
7 Specifications......................................................... 5 12 Layout................................................................... 28
12.1 Layout Guidelines ................................................. 28
7.1 Absolute Maximum Ratings ...................................... 5
12.2 Layout Example .................................................... 28
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5 13 Device and Documentation Support ................. 29
7.4 Thermal Information .................................................. 6 13.1 Related Links ........................................................ 29
7.5 Electrical Characteristics........................................... 6 13.2 Receiving Notification of Documentation Updates 29
7.6 Typical Characteristics .............................................. 7 13.3 Community Resources.......................................... 29
13.4 Trademarks ........................................................... 29
8 Parameter Measurement Information .................. 9
13.5 Electrostatic Discharge Caution ............................ 29
9 Detailed Description ............................................ 10
13.6 Glossary ................................................................ 29
9.1 Overview ................................................................. 10
9.2 Functional Block Diagram ....................................... 11 14 Mechanical, Packaging, and Orderable
Information ........................................................... 29

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (March 2013) to Revision D Page

• Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Recommended
Operating Conditions table, Thermal Information table, Parameter Measurement Information section, Detailed
Description section, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ...... 1
• Deleted Built-In Zener on LM2917 from Features .................................................................................................................. 1
• Deleted Only One RC Network Provides Frequency Doubling from Features....................................................................... 1
• Added Thermal Information table ........................................................................................................................................... 6
• Changed tablenote text From: C2 = 0.22 mFd To: C2 = 0.22 µF .......................................................................................... 6

Changes from Revision B (March 2013) to Revision C Page

• Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1

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5 Description (continued)
The more versatile configurations provide differential tachometer input and uncommitted op amp inputs. With this
version the tachometer input may be floated and the op amp becomes suitable for active filter conditioning of the
tachometer output.
Both of these configurations are available with an active shunt regulator connected across the power leads. The
regulator clamps the supply such that stable frequency-to-voltage and frequency-to-current operations are
possible with any supply voltage and a suitable resistor.

6 Pin Configuration and Functions

P and D Package
8-Pin PDIP and SOIC
Top View

TACH+ 1 8 TACH±/GND

CP1 2 7 IN±

CP2/IN+ 3 6 V+

EMIT 4 5 COL

Not to scale

Pin Functions: 8 Pins

PIN
I/O DESCRIPTION
NAME NO.
COL 5 I The collector of the bipolar junction transistor
A capacitor placed on this pin will be charged up to VCC/2 by a constant current source of 180 µA
CP1 2 O typical at the start of every positive half cycle. At the beginning of negative half cycles this capacitor
is discharged the same amount at the same rate.
See pins CP1 and IN+. On 8-pin devices (8-pin LM2907 and LM2917) these two nodes share a pin
CP2/IN+ 3 I/O
and are internally connected.
EMIT 4 O The emitter of the bipolar junction transistor
GND — G Ground
IN+ — I The noninverting input to the high gain op amp
IN– 7 I The inverting input to the high gain op amp
NC — — No connect
Positive terminal for the input signal that leads to the noninverting terminal of the internal Schmitt-
TACH+ 1 I
Trigger comparator.
Negative terminal for the input signal that leads to the noninverting terminal of the internal Schmitt-
TACH–/GND 8 I Trigger comparator. (NOTE: On 8-pin devices, LM2907 and LM2917, this pin is internally connected
to ground and must be tied to ground externally to provide the reference voltage of the device).
V+ 6 I Supply voltage

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NFF and D Package

14-Pin PDIP and SOIC
Top View

TACH+ 1 14 NC

CP1 2 13 NC

CP2 3 12 GND

IN+ 4 11 TACH±

EMIT 5 10 IN±

NC 6 9 V+

NC 7 8 COL

Not to scale

Pin Functions: 14 Pins

PIN
I/O DESCRIPTION
NAME NO.
COL 8 I The collector of the bipolar junction transistor
A capacitor placed on this pin will be charged up to VCC/2 by a constant current source of 180 µA
CP1 2 O typical at the start of every positive half cycle. At the beginning of negative half cycles this capacitor is
discharged the same amount at the same rate.
The charge pump sources current out of this pin equal to the absolute value of the capacitor current
CP2 3 O on CP1. A resistor and capacitor in parallel connected to this pin filters the current pulses into the
output voltage.
EMIT 5 O The emitter of the bipolar junction transistor
GND 12 G Ground
IN+ 4 I The noninverting input to the high gain op amp
IN– 10 I The inverting input to the high gain op amp
NC 6, 7, 13, 14 — No connect
Positive terminal for the input signal that leads to the noninverting terminal of the internal Schmitt-
TACH+ 1 I
Trigger comparator.
Negative terminal for the input signal that leads to the noninverting terminal of the internal Schmitt-
TACH– 11 I
Trigger comparator.
V+ 9 I Supply voltage

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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
Supply voltage 28 V
Supply current (Zener options) 25 mA
Collector voltage 28 V
Differential input voltage Tachometer, op amp, and comparator 28 V
LM2907 (8), LM2917 (8) –28 28
Tachometer
Input voltage LM2907 (14), LM2917 (14) 0 28 V
Op amp and comparator 0 28
LM29x7 (8) 1200
Power dissipation mW
LM29x7 (14) 1580
PDIP package Soldering (10 s) 260
Soldering information Vapor phase (60 s) 215 °C
SOIC package
Infrared (15 s) 220
Operating temperature, TJ –40 85 °C
Storage temperature, Tstg –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.

7.2 ESD Ratings

VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JESD22-A114 (1) ±1000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±250

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
LM2907 (8), LM2917 (8) –28 28 V
Input voltage
LM2907 (14), LM2917 (14) 0 28 V
Output sink current 50 mA

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7.4 Thermal Information

LM2907, LM2917
THERMAL METRIC (1) P (PDIP) D (SOIC) NFF (PDIP) D (SOIC) UNIT
8 PINS 8 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 77.6 110 69.1 83.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 80.5 53.9 64.8 42.1 °C/W
RθJB Junction-to-board thermal resistance 54.8 50.4 49.1 38 °C/W
ψJT Junction-to-top characterization parameter 37.6 9.1 35.1 7.7 °C/W
Junction-to-board characterization
ψJB 54.8 49.9 49 37.7 °C/W
parameter
Junction-to-case (bottom) thermal
RθJC(bot) — — — — °C/W
resistance

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

7.5 Electrical Characteristics

VCC = 12 VDC, TA = 25°C, see test circuit
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TACHOMETER
Input thresholds VIN = 250 mVp-p at 1 kHz (1) ±10 ±25 ±40 mV
Hysteresis VIN = 250 mVp-p at 1 kHz (1) 30 mV
VIN = 250 mVp-p at 1 kHz (1) 3.5 10
LM29x7 offset voltage mV
VIN = 250 mVp-p at 1 kHz (8-pin LM29x7) (1) 5 15
Input bias current VIN = ±50 mVDC 0.1 1 μA
VOH High level output voltage For CP1, VIN = 125 mVDC (2) 8.3 V
VOL Low level output voltage For CP1, VIN = –125 mVDC (2) 2.3 V
I2, I3 Output current V2 = V3 = 6 V (3) 140 180 240 μA
I3 Leakage current I2 = 0, V3 = 0 0.1 μA
K Gain constant See (2) 0.9 1 1.1
Linearity fIN = 1 kHz, 5 kHz, or 10 kHz (4) –1% 0.3% 1%
OP AMP AND COMPARATOR
VOS Input offset voltage VIN = 6 V 3 10 mV
IBIAS Bias current VIN = 6 V 50 500 nA
Input common-mode voltage 0 VCC–1.5 V
Voltage gain 200 V/mV
Output sink current VC = 1 40 50 mA
Output source current VE = VCC –2 10 mA
ISINK = 5 mA 0.1 0.5 V
Saturation voltage ISINK = 20 mA 1 V
ISINK = 50 mA 1 1.5 V
ZENER REGULATOR
Regulator voltage RDROP = 470 Ω 7.56 V
Series resistance 10.5 15 Ω
Temperature stability 1 mV/°C
Total supply current 3.8 6 mA

(1) Hysteresis is the sum VTH – (–VTH), offset voltage is their difference. See test circuit.
(2) VOH = 0.75 × VCC – 1 VBE and VOL = 0.25 × VCC – 1 VBE, therefore VOH – VOL = VCC / 2. The difference (VOH – VOL) and the mirror gain
(I2 / I3) are the two factors that cause the tachometer gain constant to vary from 1.
(3) Ensure that when choosing the time constant R1 × C1 that the maximum anticipated output voltage at CP2/IN+ can be reached with I3 ×
R1. The maximum value for R1 is limited by the output resistance of CP2/IN+ which is greater than 10 MΩ typically.
(4) Nonlinearity is defined as the deviation of VOUT (at CP2/IN+) for fIN = 5 kHz from a straight line defined by the VOUT at 1 kHz and VOUT
at 10 kHz. C1 = 1000 pF, R1 = 68 kΩ and C2 = 0.22 µF.

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7.6 Typical Characteristics

Figure 1. Tachometer Linearity vs Temperature Figure 2. Tachometer Linearity vs Temperature

Figure 3. Total Supply Current Figure 4. Zener Voltage vs Temperature

Figure 5. Normalized Tachometer Output (K) Figure 6. Normalized Tachometer Output (K)
vs Temperature vs Temperature

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Typical Characteristics (continued)

Figure 7. Tachometer Currents I2and I3 vs Supply Voltage Figure 8. Tachometer Currents I2and I3 vs Temperature

Figure 9. Tachometer Linearity vs R1 Figure 10. Tachometer Input Hysteresis vs Temperature

Figure 11. Op Amp Output Transistor Characteristics Figure 12. Op Amp Output Transistor Characteristics

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8 Parameter Measurement Information

Figure 13. Test Circuit

Figure 14. Tachometer Input Threshold Measurement

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9 Detailed Description

9.1 Overview
The LM29x7 frequency-to-voltage converter features two separate inputs to monitor the signal. In the 8-pin
devices, one of these inputs is internally grounded and therefore it monitors the remaining input for zero
crossings. In the 14-pin devices, both of these inputs are open and it instead detects whenever the differential
voltage switches polarity. Therefore, the input comparator outputs a square wave of equal frequency to the input.
A charge pump system is used to translate the frequency of this square wave to a voltage. At the start of every
positive half cycle of the input signal a 180-µA constant current charges C1 until its voltage has increased by
VCC/2. The capacitor is held at that voltage until the input signal begins a negative half cycle. Then the 180-µA
constant current discharges capacitor C1 until its voltage has dropped by VCC/2. This voltage is held until the
next positive half cycle and the process repeats. This generates pulses of current flowing into and out of
capacitor C1 at the same frequency as the input signal. For every full cycle, the charge pump mirrors both
current pulses as positive current pulses into the parallel combination of resistor R1 and capacitor C2. Therefore
every full cycle, the amount of charge leaving pin 3 is equal to the sum of the charge entering C1 and leaving C1.
Because the voltage at pin 3 is equal to I3(avg) × R1, I(avg) is calculated in Equation 1.
I3(avg) = Q/t = (Qcharge + Qdischarge) / (1 / f) = 2 × Q × f = 2 × C1 × (VCC/2) × f = C1 × VCC × f (1)
This average current will be flowing across R1, giving the output voltage in Equation 2.
Vo = R1 × C1 × VCC × f (2)
C2 acts as a filter to smooth the pulses of current and does not affect the output voltage. However, the size of C2
determines both the output response time for changes in frequency and the amount of output voltage ripple.
The voltage generated is then fed in a high gain op amp. This op amp drives a bipolar transistor whose collector
and emitter are each broken out to a pin. The LM29x7 has the flexibility to be configured a variety of ways to
meet system requirements including voltage output, driving loads, operating a relay, and more.

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9.2 Functional Block Diagram

*This connection made on 8-pin LM2907 and LM2917 only.

**This connection made on LM2917 and 8-pin LM2917 only.

9.3 Feature Description

9.3.1 Differential Input
This device features a Schmitt-Trigger comparator that is the first stage in converting the input signal. Every time
the output of the comparator flips between high and low correlates to a half cycle elapsing on the input signal. On
the LM29x7-8 devices, one terminal of this comparator is internally connected to ground. This requires that the
input signal cross zero volts in order for device to detect the frequency. On the LM29x7 devices, the input
terminals to the Schmitt-Trigger comparator are both available for use. This open terminal allows the potential at
which the comparator’s output is flipped to be applied externally. This allows the device to accept signals with DC
offset or compare differential inputs.

9.3.2 Configurable
While the ratio of output voltage to input frequency is dependent on supply voltage, it is easily adjusted through
the combination of one resistor and one capacitor, R1 and C1. The formula for calculating the expected output
voltage is in Equation 3.
VOUT = VCC × f × C1 × R1. (3)
The sizes of R1 and C1 have other effects on the system such as maximum frequency and output linearity. See
Choosing R1 and C1 for detailed instructions on sizing components.
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Feature Description (continued)

9.3.3 Output Stage
The output voltage generated by the charge pump is fed in the noninverting terminal of a high gain op amp. This
op amp then drives and uncommitted bipolar junction transistor. This allows the LM2907 to be configured a
variety of ways to meet system needs. The output voltage can be buffered and used to drive a load (see
Figure 15) or an output threshold can be given to trigger a load switch (see Figure 18).

9.4 Device Functional Modes

9.4.1 Grounded Input Devices (8-Pin LM2907 and LM2917)
These devices have one of the two Schmitt-Trigger comparator inputs internally grounded and must be externally
connected to the system ground as well. This configuration monitors the remaining terminal for zero crossings.

9.4.2 Differential Input Devices (LM2907 and LM2917)

These devices have both inputs to the Schmitt-Trigger comparator available and broken out to pins 1 and 11.
This configuration allows a new switching threshold provided in the case of signals with DC offset or to intake a
differential pair and switch based on voltage difference.

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10 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

10.1 Application Information

The LM2907 series of tachometer circuits is designed for minimum external part count applications and
maximum versatility. To fully exploit its features and advantages, first examine its theory of operation. The first
stage of operation is a differential amplifier driving a positive feedback flip-flop circuit. The input threshold voltage
is the amount of differential input voltage at which the output of this stage changes state. Two options (8-pin
LM2907 and LM2917) have one input internally grounded so that an input signal must swing above and below
ground and exceed the input thresholds to produce an output. This is offered specifically for magnetic variable
reluctance pickups which typically provide a single-ended AC output. This single input is also fully protected
against voltage swings to ±28 V, which are easily attained with these types of pickups.
The differential input options (LM2907, LM2917) give the user the option of setting his own input switching level
and still have the hysteresis around that level for excellent noise rejection in any application. Of course to allow
the inputs to attain common-mode voltages above ground, input protection is removed and neither input should
be taken outside the limits of the supply voltage being used. It is very important that an input not go below
ground without some resistance in its lead to limit the current that will then flow in the epi-substrate diode.
Following the input stage is the charge pump where the input frequency is converted to a DC voltage. To do this
requires one timing capacitor, one output resistor, and an integrating or filter capacitor. When the input stage
changes state (due to a suitable zero crossing or differential voltage on the input) the timing capacitor is either
charged or discharged linearly between two voltages whose difference is VCC/2. Then in one half cycle of the
input frequency or a time equal to 1/2 fIN the change in charge on the timing capacitor is equal to VCC/2 × C1.
The average amount of current pumped into or out of the capacitor is shown in Equation 4.
'Q V
= ic(AVG) = C1× CC × (2 fIN ) = VCC × fIN× C1
T 2 (4)
The output circuit mirrors this current very accurately into the load resistor R1, connected to ground, such that if
the pulses of current are integrated with a filter capacitor, then VO = ic × R1, and the total conversion formula
becomes Equation 5.
VO = VCC × fIN × C1 × R1 × K
where
• K is the gain constant (typically 1) (5)
The size of C2 is dependent only on the amount of ripple voltage allowable and the required response time.

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10.2 Typical Applications

10.2.1 Minimum Component Tachometer

Figure 15. Minimum Component Tachometer Diagram

10.2.1.1 Design Requirements

• C1: This capacitor is charged and discharged every cycle by a 180-µA typical current source. Smaller
capacitors can be charged quicker therefore increasing the maximum readable frequency. However, lower
capacitors values reduce the output voltage produced for a given frequency. C1 must not be sized lower than
500-pF die to its role in internal compensation.
• R1: This resistor produces the output voltage from current pulses source by the internal charge pump. Higher
values increase the output voltage for a given frequency, but too large will degrade the output’s linearity.
Because the current pulses are a fixed magnitude of 180 µA typical, R1 must be big enough to produce the
maximum desired output voltage at maximum input frequency. At maximum input frequency the pulse train
duty cycle is 100%, therefore the average current is 180 µA and R1 = Vo(max) / 180 µA.
• C2: This capacitor filters the ripple produced by the current pulses sourced by the charge pump. Large values
reduce the output voltage ripple but increase the output’s response time to changes in input frequency.
• Rload: The load resistance must be large enough that at maximum output voltage, the current is under the
rated value of 50 mA.

10.2.1.2 Detailed Design Procedure

10.2.1.2.1 Choosing R1 and C1

There are some limitations on the choice of R1 and C1 which should be considered for optimum performance.
The timing capacitor also provides internal compensation for the charge pump and must be kept larger than 500
pF for very accurate operation. Smaller values can cause an error current on R1, especially at low temperatures.
Several considerations must be met when choosing R1. The output current at pin 3 is internally fixed and
therefore VO/R1 must be less than or equal to this value. If R1 is too large, it can become a significant fraction of
the output impedance at pin 3 which degrades linearity. Also output ripple voltage must be considered and the
size of C2 is affected by R1. An expression that describes the ripple content on pin 3 for a single R1C2
combination is in Equation 6.
V C1 § VCC × fIN × C1 ·
VRIPPLE = CC × × ¨1 ¸ pk- pk
2 C2 © I2 ¹ (6)
R1 can be chosen independent of ripple. However, response time, or the time it takes VOUT to stabilize at a new
voltage, increases as the size of C2 increases, so a compromise between ripple, response time, and linearity
must be chosen carefully.
As a final consideration, the maximum attainable input frequency is determined by VCC, C1, and I2 in Equation 7.

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Typical Applications (continued)

I2
fMAX =
C1× VCC (7)

10.2.1.2.2 Using Zener Regulated Options (LM2917)

For those applications where an output voltage or current must be obtained independent of supply voltage
variations, the LM2917 is offered. The most important consideration in choosing a dropping resistor from the
unregulated supply to the device is that the tachometer and op amp circuitry alone require about 3 mA at the
voltage level provided by the Zener. At low supply voltages there must be some current flowing in the resistor
above the 3-mA circuit current to operate the regulator. As an example, if the raw supply varies from 9 V to 16 V,
a resistance of 470 Ω minimizes the Zener voltage variation to 160 mV. If the resistance goes under 400 Ω or
over 600 Ω, the Zener variation quickly rises above 200 mV for the same input variation.

10.2.1.3 Application Curves

C1 = .01 µF C2 = 1 µF R1 = 100 kΩ
C1 = .01 µF C2 = 1 µF R1 = 100 kΩ Rdrop = 910 Ω Zener Regulated VCC = 7.58 V
Rdrop = 910 Ω Zener Regulated VCC = 7.58 V

Figure 16. Output Response to an Increase Figure 17. Output Voltage Ripple
in Input Frequency

10.2.2 Other Application Circuits

This section shows application circuit examples using the LM2907-N and LM2917-N devices. Customers must
fully validate and test these circuits before implementing a design based on these examples.
SPACER

Load is energized when fIN ≥ (1 / ( 2 × RC))

Figure 18. Speed Switch

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Typical Applications (continued)

Figure 19. Zener Regulated Frequency to Voltage Converter

SPACER

Figure 20. Breaker Point Dwell Meter

SPACER

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Product Folder Links: LM2907-N LM2917-N

 LM2907-N, LM2917-N
www.ti.com SNAS555D – JUNE 2000 – REVISED DECEMBER 2016

Typical Applications (continued)

VO = 6 V at 400 Hz or 6000 ERPM (8 Cylinder Engine)

Figure 21. Voltage Driven Meter Indicating Engine RPM

SPACER

IO = 10 mA at 300 Hz or 6000 ERPM (6 Cylinder Engine)

Figure 22. Current Driven Meter Indicating Engine RPM

SPACER

Copyright © 2000–2016, Texas Instruments Incorporated Submit Documentation Feedback 17

Product Folder Links: LM2907-N LM2917-N
LM2907-N, LM2917-N
SNAS555D – JUNE 2000 – REVISED DECEMBER 2016 www.ti.com

Typical Applications (continued)

VOUT = 1 V to 10 V for CX = 0.01 to 0.1 mFd and R = 111 kΩ

Figure 23. Capacitance Meter

SPACER

Figure 24. Two-Wire Remote Speed Switch

SPACER

18 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated

Product Folder Links: LM2907-N LM2917-N

 LM2907-N, LM2917-N
www.ti.com SNAS555D – JUNE 2000 – REVISED DECEMBER 2016

Typical Applications (continued)

V3 steps up in voltage by the amount of (VCC × C1) / C2, for each complete input cycle (2 zero crossings).
For example: if C2 = 200 × C1 after 100 consecutive input cycles, then V3 = 1/2 × VCC.

Figure 25. 100 Cycle Delay Switch

SPACER

Flashing begins when fIN ≥ 100 Hz

Flash rate increases with input frequency increase beyond trip point.

Figure 26. Flashing LED Indicates Over-Speed

SPACER

Copyright © 2000–2016, Texas Instruments Incorporated Submit Documentation Feedback 19

Product Folder Links: LM2907-N LM2917-N
LM2907-N, LM2917-N
SNAS555D – JUNE 2000 – REVISED DECEMBER 2016 www.ti.com

fPOLE = 0.707 / (2 × π × RC)

τRESPONSE = 2.57 / (2 × π × fPOLE)

Figure 27. Frequency to Voltage Converter With 2 Pole Butterworth Filter to Reduce Ripple

10.2.2.1 Variable Reluctance Magnetic Pickup Buffer Circuits

Precision two-shot output frequency is twice the input frequency

Pulse width = (VCC / 2) × (C1 / 12)
Pulse height = VZENER

Figure 28. Magnetic Pickup Buffer With Zener Regulated Output Magnitude

SPACER

20 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated

Product Folder Links: LM2907-N LM2917-N

 LM2907-N, LM2917-N
www.ti.com SNAS555D – JUNE 2000 – REVISED DECEMBER 2016

Figure 29. Magnetic Pickup Buffer With 1/2 VCC Output Magnitude

10.2.2.2 Finger Touch or Contact Switch

Figure 30. Finger Touch or Contact Switch Diagram

SPACER

Figure 31. System Output in Response to Consecutive Button Presses

Copyright © 2000–2016, Texas Instruments Incorporated Submit Documentation Feedback 21

Product Folder Links: LM2907-N LM2917-N
LM2907-N, LM2917-N
SNAS555D – JUNE 2000 – REVISED DECEMBER 2016 www.ti.com

10.2.2.3 Over-Speed Latch

Output latches when fIN = (R2 / (R1 + R2)) × (1 / RC).

Output is reset by removing VCC.

Figure 32. Over-Speed Latch Circuit Diagram

SPACER

Figure 33. VOUT vs FIN

22 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated

Product Folder Links: LM2907-N LM2917-N

 LM2907-N, LM2917-N
www.ti.com SNAS555D – JUNE 2000 – REVISED DECEMBER 2016

10.2.2.4 Frequency Switch Applications

Some frequency switch applications may require hysteresis in the comparator function which can be
implemented in several ways. Example circuits are shown in Figure 34 to Figure 36.

Figure 34. Frequency Switch With Resistor Divider Threshold

SPACER

Figure 35. Frequency Switch With Added Hysteresis

SPACER

Copyright © 2000–2016, Texas Instruments Incorporated Submit Documentation Feedback 23

Product Folder Links: LM2907-N LM2917-N
LM2907-N, LM2917-N
SNAS555D – JUNE 2000 – REVISED DECEMBER 2016 www.ti.com

Figure 36. Frequency Switch With Added Hysteresis

10.2.2.4.1 Application Curves

Figure 37. VOUT vs V3

Figure 38. VOUT vs V3

10.2.2.5 Anti-Skid Circuits

10.2.2.5.1 Select-Low Circuit

Figure 39. Select-Low Circuit Diagram

24 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated

Product Folder Links: LM2907-N LM2917-N

 LM2907-N, LM2917-N
www.ti.com SNAS555D – JUNE 2000 – REVISED DECEMBER 2016

SPACER

VOUT is proportional to the lower of the two input wheel speeds

Figure 40. VOUT vs Wheel Speed

10.2.2.5.2 Select-High Circuit

Figure 41. Select-High Circuit Diagram

SPACER

VOUT is proportional to the higher of the two input wheel speeds

Figure 42. VOUT vs Wheel Speed

Copyright © 2000–2016, Texas Instruments Incorporated Submit Documentation Feedback 25

Product Folder Links: LM2907-N LM2917-N
LM2907-N, LM2917-N
SNAS555D – JUNE 2000 – REVISED DECEMBER 2016 www.ti.com

10.2.2.5.3 Select-Average Circuit

Figure 43. Select-Average Circuit Diagram

10.2.2.6 Changing the Output Voltage for an Input Frequency of Zero

Figure 44. Tachometer With Adjustable Zero Speed Voltage Output

SPACER

Figure 45. VOUT vs Frequency Plot Shifted to Produce 1 V at Zero Speed

26 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated

Product Folder Links: LM2907-N LM2917-N

 LM2907-N, LM2917-N
www.ti.com SNAS555D – JUNE 2000 – REVISED DECEMBER 2016

10.2.2.7 Changing Tachometer Gain Curve or Clamping the Minimum Output Voltage

Figure 46. Tachometer With Output Clamped at Low Speeds

SPACER

Figure 47. VOUT vs Frequency Plot With Output Clamped at Low Speeds

11 Power Supply Recommendations

This family of devices is designed to operate from a supply voltage up to 28 V. For the 8-pin LM2907 and
LM2917, devices with a fixed ground reference for TACH–, the tachometer inputs can intake voltages between
±28 V. LM2907 and LM2917 devices have both tachometer inputs available at the cost of input protection
features. This means neither input should be taken outside of the supply voltage range without additional
precautions (see Application Information).

Copyright © 2000–2016, Texas Instruments Incorporated Submit Documentation Feedback 27

Product Folder Links: LM2907-N LM2917-N
LM2907-N, LM2917-N
SNAS555D – JUNE 2000 – REVISED DECEMBER 2016 www.ti.com

12 Layout

12.1 Layout Guidelines

• Bypass capacitors must be placed as close as possible to the supply pin. When using a through-hole
package, it is acceptable to place the bypass capacitor on the bottom layer. All other components must be
placed as close to the device as possible.
• Use of a ground plane is recommended to provide a low-impedance ground across the circuit.
• Feedback loops must use short and wide traces.

12.2 Layout Example

Figure 48. Layout Recommendation

28 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated

Product Folder Links: LM2907-N LM2917-N

 LM2907-N, LM2917-N
www.ti.com SNAS555D – JUNE 2000 – REVISED DECEMBER 2016

13 Device and Documentation Support

13.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY
DOCUMENTS SOFTWARE COMMUNITY
LM2907-N Click here Click here Click here Click here Click here
LM2917-N Click here Click here Click here Click here Click here

13.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

13.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2000–2016, Texas Instruments Incorporated Submit Documentation Feedback 29

Product Folder Links: LM2907-N LM2917-N
 PACKAGE OPTION ADDENDUM

www.ti.com 14-Jul-2025

PACKAGING INFORMATION

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

LM2907M-8/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM29
07M-8
LM2907M-8/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM29
07M-8
LM2907M/NOPB Active Production SOIC (D) | 14 55 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM2907M
LM2907M/NOPB.B Active Production SOIC (D) | 14 55 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM2907M
LM2907MX-8/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM29
07M-8
LM2907MX-8/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM29
07M-8
LM2907MX/NOPB Active Production SOIC (D) | 14 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM2907M
LM2907MX/NOPB.B Active Production SOIC (D) | 14 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM2907M
LM2907N-8/NOPB Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM
2907N-8
LM2907N-8/NOPB.B Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM
2907N-8
LM2907N/NOPB Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM2907N
LM2907N/NOPB.B Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM2907N
LM2907N/NOPBG4 Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM2907N
LM2907N/NOPBG4.B Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM2907N
LM2917M-8/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM29
17M-8
LM2917M-8/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM29
17M-8
LM2917M/NOPB Active Production SOIC (D) | 14 55 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM2917M
LM2917M/NOPB.B Active Production SOIC (D) | 14 55 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM2917M
LM2917MX-8/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM29
17M-8
LM2917MX-8/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM29
17M-8
LM2917MX/NOPB Active Production SOIC (D) | 14 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM2917M
LM2917MX/NOPB.B Active Production SOIC (D) | 14 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM2917M

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 14-Jul-2025

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

LM2917N-8/NOPB Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM
2917N-8
LM2917N-8/NOPB.B Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM
2917N-8
LM2917N-8/NOPBG4 Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM
2917N-8
LM2917N-8/NOPBG4.B Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM
2917N-8
LM2917N/NOPB Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM2917N
LM2917N/NOPB.B Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM2917N
LM2917N/NOPBG4 Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM2917N
LM2917N/NOPBG4.B Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 85 LM2917N

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 14-Jul-2025

and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3
 PACKAGE MATERIALS INFORMATION

www.ti.com 15-Jul-2025

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2907MX-8/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2907MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
LM2917MX-8/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2917MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 15-Jul-2025

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2907MX-8/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2907MX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LM2917MX-8/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2917MX/NOPB SOIC D 14 2500 367.0 367.0 35.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 15-Jul-2025

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
LM2907M-8/NOPB D SOIC 8 95 495 8 4064 3.05
LM2907M-8/NOPB.B D SOIC 8 95 495 8 4064 3.05
LM2907M/NOPB D SOIC 14 55 495 8 4064 3.05
LM2907M/NOPB.B D SOIC 14 55 495 8 4064 3.05
LM2907N-8/NOPB P PDIP 8 40 502 14 11938 4.32
LM2907N-8/NOPB.B P PDIP 8 40 502 14 11938 4.32
LM2907N/NOPB N PDIP 14 25 502 14 11938 4.32
LM2907N/NOPB.B N PDIP 14 25 502 14 11938 4.32
LM2907N/NOPBG4 N PDIP 14 25 502 14 11938 4.32
LM2907N/NOPBG4.B N PDIP 14 25 502 14 11938 4.32
LM2917M-8/NOPB D SOIC 8 95 495 8 4064 3.05
LM2917M-8/NOPB.B D SOIC 8 95 495 8 4064 3.05
LM2917M/NOPB D SOIC 14 55 495 8 4064 3.05
LM2917M/NOPB.B D SOIC 14 55 495 8 4064 3.05
LM2917N-8/NOPB P PDIP 8 40 502 14 11938 4.32
LM2917N-8/NOPB.B P PDIP 8 40 502 14 11938 4.32
LM2917N-8/NOPBG4 P PDIP 8 40 502 14 11938 4.32
LM2917N-8/NOPBG4.B P PDIP 8 40 502 14 11938 4.32
LM2917N/NOPB N PDIP 14 25 502 14 11938 4.32
LM2917N/NOPB.B N PDIP 14 25 502 14 11938 4.32
LM2917N/NOPBG4 N PDIP 14 25 502 14 11938 4.32
LM2917N/NOPBG4.B N PDIP 14 25 502 14 11938 4.32

Pack Materials-Page 3
 PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1

.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]

4X (0 -15 )

4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4

.005-.010 TYP
[0.13-0.25]

4X (0 -15 )

SEE DETAIL A
.010
[0.25]

.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.

www.ti.com
 EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X

SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK

EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55] SYMM

1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
D0014A SCALE 1.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

C
6.2
TYP SEATING PLANE
5.8

A PIN 1 ID 0.1 C
AREA
12X 1.27
14
1

8.75 2X
8.55 7.62
NOTE 3

7
8
0.51
14X
4.0 0.31
B 1.75 MAX
3.8 0.25 C A B
NOTE 4

0.25
TYP
0.13
SEE DETAIL A
0.25
GAGE PLANE

0.25
0 -8 1.27 0.10
0.40

DETAIL A
TYPICAL

4220718/A 09/2016

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side.
5. Reference JEDEC registration MS-012, variation AB.

www.ti.com
 EXAMPLE BOARD LAYOUT
D0014A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

14X (1.55) SYMM

1
14

14X (0.6)

12X (1.27)
SYMM

7 8

(R0.05)
TYP
(5.4)

LAND PATTERN EXAMPLE

SCALE:8X

SOLDER MASK METAL UNDER SOLDER MASK

METAL OPENING
OPENING SOLDER MASK

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4220718/A 09/2016
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
D0014A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

14X (1.55) SYMM

1
14

14X (0.6)

12X (1.27)
SYMM

7 8

(5.4)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:8X

4220718/A 09/2016
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

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